Texas Instruments 3138 155 232931 manual Product Status Definitions

Page 87

CC2420

Revision	Date	Description/Changes
1.2	2004-06-09	Output power range: 24 dB (was 40 dB).
		Deleted option for single ended external PA.
		Adjacent channel rejection corrected to 46 dB for + 5MHz (was 39 dB), 39 dB for –5
		MHz (was 46 dB) 58 dB for +10 MHz (was 53 dB) and 55 dB for-10 MHz (was 57 dB).
		“image channel” deleted in text for In band spurious reception.
		Revision for reference [1] updated.
		CSMA-CA added to abbreviations.
		Schematic view of the IEEE 802.15.4 Frame Format corrected, address field 0 to 20
		bits.
		Changed blocking specifications to relate to EN 300 440 class 2.
		Updated addresses for Chipcon offices.
		Added section Operating Conditions.
		Section RAM access: A6:0 (LSB).
		IOCFG0.BCN_ACCEPT bit added and described in section Address recognition and
		the IOCFG0 register.
		The previous IDLE mode has been renamed to power down to be consistent with
		other Chipcon data sheets. Three power modes defined: Voltage regulator off (OFF),
		Power down (PD) (Voltage regulator enabled), IDLE (XOSC running) and used
		throughout the document.
		Default TXMIXBUF_CUR[1:0] in table for TXCTRL set to 2.
		Added information: compliance with EN 300 328 og EN 300 440 (Class 2).
		Added more information about FIFOP in section Receive mode.
		Removed text about SO programmable pull up from entire document.
		In Voltage regulator section of Electrical Specifications: voltage regulator may only
		supply CC2420.
		MANFIDH.VERSION register, changed to ”current version is 2”.
		Included package height in package drawing.
		Included layout drawing for package.
		Power supply pins defined clearer in Absolute maximum ratings.
		Third harmonic level corrected to –51dBm in Electrical specifications, second
		harmonic to –37dBm.
		Table with Crystal oscillator component values corrected.
		Link to reference [3] corrected.
		Corrected spelling grammar and references to tables and figures.
		Figure showing SmartRF Studio user interface included.
		Added figure to describe pin activity during RXFIFO read out.
		Added description on how to connect pins when not using internal regulator.

1.1	2004-03-22	Application circuits: Pin 20 and pin 37 connected to 1.8 V from VREG_OUT.
		IOCFG0.SO_PULLUP deleted.
		Added document history table.
1.0	2003-11-17	Initial release.

42.2 Product Status Definitions

Data Sheet Identification	Product Status	Definition
Advance Information	Planned or Under	This data sheet contains the design specifications for
	Development	product development. Specifications may change in
		any manner without notice.

Preliminary	Engineering Samples	This data sheet contains preliminary data, and
	and First Production	supplementary data will be published at a later date.
		Chipcon reserves the right to make changes at any
		time without notice in order to improve design and
		supply the best possible product.

No Identification Noted	Full Production	This data sheet contains the final specifications.
		Chipcon reserves the right to make changes at any
		time without notice in order to improve design and
		supply the best possible product.

Obsolete	Not In Production	This data sheet contains specifications on a product
		that has been discontinued by Chipcon. The data
		sheet is printed for reference information only.

SWRS041B

Page 87 of 89

Image 87

Contents Key Features ApplicationsProduct Description Table of contents RF Data Buffering Ordering Information General Information ITU-T AbbreviationsReferences Features Parameter Min Typ Max Units Condition Absolute Maximum RatingsOperating Conditions Parameter Min Max Units ConditionParameter Min Typ Max Unit Condition / Note Electrical SpecificationsOverall Transmit SectionReceive Section Rssi / Carrier Sense If SectionFrequency Synthesizer Section VDD Digital Inputs/OutputsBattery Monitor Power SupplyVoltage Regulator CC2420 Pin Pin Name Pin type Pin Description Pin AssignmentAvddadc Circuit Description CC2420 simplified block diagramCC2420 Bias resistor Power supply decoupling and filteringApplication Circuit Input / output matchingDescription Overview of external componentsTransceiver Transceiver Bill of materials for the application circuits Ieee 802.15.4 Modulation Format Symbol Chip sequence C0, C1, C2, … , C31Phase Configuration OverviewSmartRF Studio user interface Evaluation Software13 4-wire Serial Configuration and Data Interface Pin configurationRegister access Parameter Symbol Min Max Units Conditions SPI timing specification Status byteRAM access Configuration registers write and read operations via SPI CC2420 RAM Memory Space Fifo access Multiple SPI accessAddress Byte Ordering Name Description Microcontroller Interface and Pin Description Configuration interfaceRxfifo overflow Receive modePin activity examples during receive Demodulator, Symbol Synchroniser and Data Decision Frame Format Demodulator Simplified Block DiagramMAC protocol data unit Transmitted Synchronisation Header Length fieldFormat of the Frame Control Field FCF Frame check sequence Buffered transmit mode Buffered receive modeRF Data Buffering Fifop Unbuffered, serial modeAcknowledge Frames Address RecognitionAcknowledge frame format Radio control state machine Radio control states Ieee 802.15.4 Nonce MAC Security Operations Encryption and AuthenticationKeys Nonce / counterIn-line security operations CC2420 Security Flag Byte Stand-alone encryptionCTR mode encryption / decryption CBC-MAC21.7 CCM Timing Linear if and AGC SettingsMode LMIC Time Rssi / Energy DetectionLink Quality Indication ValueRF Level dBm Frequency and Channel Programming Clear Channel Assessment27.1 VCO Output Power ProgrammingVCO and PLL Self-Calibration Voltage RegulatorVoltage regulator, simplified schematic Battery MonitorCrystal Oscillator Unmodulated carrier Input / Output MatchingTransmitter Test Modes Crystal oscillator component valuesCC2420 Modulated spectrum plot System Considerations and Guidelines Battery operated systems Low-cost systemsBER / PER measurements Antenna Considerations PCB Layout RecommendationsCC2420 Address Register Register type Description Configuration RegistersSaes Configuration registers overviewBit Field Name Reset Main 0x10 Main Control RegisterXOSC16MBYPASS MDMCTRL0 0x11 Modem Control Register Reservedframemode Pancoordinator AdrdecodeCCAHYST20 CCAMODE10 Autocrc Autoack Preamblelength RSSIVAL70 MDMCTRL1 0x12- Modem Control RegisterRssi 0x13 Rssi and CCA Status and Control Register CORRTHR40 Demodavgmode ModulationmodeTxctrl 0x15 Transmit Control Register Syncword 0x14 Sync WordRXMIXBUFCUR10 RXCTRL0 0x16 Receive control registerRXCTRL1 0x17 Receive control register Caldone Calrunning Locklength Lockstatus Fsctrl 0x18 Frequency Synthesizer Control and StatusSECMODE10 SECCTRL0 0x19 Security Control RegisterBattmonok Battmonen Battmonvoltage Battmon 0x1B Battery Monitor Control registerSECCTRL1 0x1A Security Control Register Sectxl SecrxlHSSDSRC20 SFDMUX40 CCAMUX40 IOCFG0 0x1C I/O Configuration RegisterIOCFG1 0x1D I/O Configuration Register Manfidl 0x1E Manufacturer ID, Lower 16 BitFsmtc 0x20 Finite state machine time constants Manfidh 0x1F Manufacturer ID, Upper 16 BitIsused = is * Isandmask + Isormask Manand 0x21 Manual signal and override register1Lnamixgainmodeo Manor 0x22 Manual signal or override registerAgcctrl 0x23 AGC Control VgagainoeAGCTST0 0x24 AGC Test Register AGCTST1 0x25 AGC Test RegisterAGCTST2 0x26 AGC Test Register FSTST0 0x27 Frequency Synthesizer Test Register FSTST1 0x28 Frequency Synthesizer Test RegisterFSTST2 0x29 Frequency Synthesizer Test Register FSTST3 0x2A Frequency Synthesizer Test Register Rxbpftst 0x2B Receiver Bandpass Filters Test RegisterFsmstate 0x2C Finite state machine information Adcclockdisable Adctst 0x2D ADC Test RegisterDactst 0x2E DAC Test Register Rxfifo 0x3F Receive Fifo Byte register Oscillator must be running for accessing the RxfifoToptst 0x2F Top Level Test Register Txfifo 0x3E Transmit Fifo Byte registerTest Output Signals CCA test signal select tableSignal output on CCA pin Description Signal output on SFD pin Description SFD test signal select tableQuad Leadless Package QLP Package Description QLPThermal resistance Recommended layout for package QLPPackage thermal properties Soldering informationTape and Reel Specification 40.3 Plastic tube specification40.4 Carrier tape and reel specification Tube SpecificationGeneral Information 42.1 Document HistoryRevision Date Description/Changes Product Status Definitions Data Sheet Identification Product Status DefinitionAddress Information TI Worldwide Technical Support InternetProduct Information Centers 2007, Texas Instruments. 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