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1 TMS320DM355 Digital Media System-on-Chip (DMSoC)
1.1 Features
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1.2 Description
TMS320DM355Digital Media System-on-Chip (DMSoC)
1.3 Functional Block Diagram
BufferLogic
TMS320DM355 Digital Media System-on-Chip (DMSoC)4Submit Documentation Feedback
SPRS463A SEPTEMBER 2007 REVISED SEPTEMBER 2007
Figure 1-1 shows the functional block diagram of the DM355 device.
TMS320DM355Digital Media System-on-Chip (DMSoC)
2 Device Overview
2.1 Device Characteristics
2.2 Memory Map Summary
Table 2-3. DM355 ARM Configuration Bus Access to Peripherals
Table 2-3. DM355 ARM Configuration Bus Access to Peripherals (continued)
2.3 Pin Assignments 2.3.1 Pin Map (Bottom View)
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Figure 2-1. Pin Map [Quadrant A]
Figure 2-2. Pin Map [Quadrant B]
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Figure 2-3. Pin Map [Quadrant C]
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Figure 2-4. Pin Map [Quadrant D]
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2.4 Pin Functions 2.4.1 Image Data Input - Video Processing Front End
Table 2-5. CCD Controller/Video Input Terminal Functions
2.4.2 Image Data Output - Video Processing Back End (VPBE)
Table 2-5. CCD Controller/Video Input Terminal Functions (continued)
Table 2-6. Signals for VPBE Display Modes
Table 2-7. Digital Video Terminal Functions
2.4.3 Asynchronous External Memory Interface (AEMIF)
Table 2-8. Analog Video Terminal Functions
Table 2-9. Asynchronous EMIF/NAND/OneNAND Terminal Functions (continued)
2.4.4 DDR Memory Interface
TMS320DM355
Table 2-9. Asynchronous EMIF/NAND/OneNAND Terminal Functions (continued)
The DDR EMIF supports DDR2 and mobile DDR. Table 2-10. DDR Terminal Functions
Table 2-10. DDR Terminal Functions (continued)
2.4.5 GPIO
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2.4.6 Multi-Media Card/Secure Digital (MMC/SD) Interfaces
2.4.7 Universal Serial Bus (USB) Interface
2.4.8 Audio Interfaces
2.4.9 UART Interface
Table 2-14. ASP Terminal Functions (continued)
2.4.10 I
C Interface
The includes an I
2.4.11 Serial Interface
Table 2-15. UART Terminal Functions (continued)
TMS320DM355
Table 2-17. SPI Terminal Functions (continued)
The provides interface with the system clocks. Table 2-18. Clocks Terminal Functions
2.4.13 Real Time Output (RTO) Interface
2.4.14 Pulse Width Modulator (PWM) Interface
The provides Real Time Output (RTO) interface. Table 2-19. RTO Terminal Functions
The provides Pulse Width Modulator (PWM) interface. Table 2-20. PWM Terminal Functions
2.4.15 System Configuration Interface
Table 2-20. PWM Terminal Functions (continued)
2.4.16 Emulation
TMS320DM355Digital Media System-on-Chip (DMSoC)
Table 2-21. System/Boot Terminal Functions (continued)
2.5 Pin List
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2.6 Device Support 2.6.1 Development Tools
2.6.2 Device Nomenclature
TMS320DM355Digital Media System-on-Chip (DMSoC)
2.6.3 Device Documentation
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3 Detailed Device Description
3.1 ARM Subsystem Overview
3.1.1 Components of the ARM Subsystem
3.2 ARM926EJ-S RISC CPU
3.2.1 CP15 3.2.2 MMU
3.2.3 Caches and Write Buffer
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3.3.2 External Memories
3.3.3 Peripherals 3.4 ARM Interrupt Controller (AINTC)
3.4.1 Interrupt Mapping
Table 3-1. AINTC Interrupt Connections (continued)
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UART0,1
Sequencer
Figure 3-2. Device Clocking Block Diagram
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3.5.2 Supported Clocking Configurations for DM355-216
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3.5.3 Supported Clocking Configurations for DM355-270
Table 3-7. PLL2 Supported Clocking Configurations for DM355-270 (24 MHz reference) (continued)
3.5.4 Peripheral Clocking Considerations
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3.6 PLL Controller (PLLC) 3.6.1 PLL Controller Module
3.6.2 PLLC1
Figure 3-3. PLLC1 Configuration In DM355
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3.6.3 PLLC2
3.7 Power and Sleep Controller (PSC)
3.8 System Control Module
3.9 Pin Multiplexing
3.9.1 Hardware Controlled Pin Multiplexing
3.9.2 Software Controlled Pin Multiplexing
3.10 Device Reset
Table 3-13. AECFG (Async EMIF Configuration) Pin Mux Coding
3.11 Default Device Configurations
3.11.1 Device Configuration Pins
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Table 3-16. Module Configuration
3.11.4 ARM Boot Mode Configuration
3.11.5 AEMIF Configuration
3.12 Device Boot Modes
3.12.1 Boot Modes Overview
3.13 Power Management
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3.14 64-Bit Crossbar Architecture
3.14.1 Crossbar Connections
3.14.2 EDMA Controller
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Table 3-19. EDMA Channel Synchronization Events
3.15 MPEG/JPEG Overview
Table 3-19. EDMA Channel Synchronization Events (continued)
4 Device Operating Conditions
4.1 Absolute Maximum Ratings Over Operating Case Temperature Range
(Unless Otherwise Noted)
4.2 Recommended Operating Conditions
4.3 Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating
Case Temperature (Unless Otherwise Noted)
5 Peripheral Information and Electrical Specifications
5.1 Parameter Information Device-Specific Information
5.1.1 Signal Transition Levels
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5.2 Recommended Clock and Control Signal Transition Behavior 5.3 Power Supplies
All clocks and control signals should transition between V
and V
(or between V
and V
5.3.1 Power-Supply Sequencing
5.4 Reset 5.4.1 Reset Electrical Data/Timing
Table 5-2. Timing Requirements for Reset
(see Figure 5-4 )
Figure 5-4. Reset Timing
5.5 Oscillators and Clocks
5.5.1 MXI1 (24-MHz) Oscillator
5.5.2 MXI2 (27-MHz) Oscillator (optional oscillator)
5.5.3 Clock PLL Electrical Data/Timing (Input and Output Clocks)
Table 5-5. Timing Requirements for MXI1/CLKIN1
(see Figure 5-7 )
Figure 5-7. MXI1/CLKIN1 Timing Table 5-6. Timing Requirements for MXI2/CLKIN2
(see Figure 5-7 )
Table 5-7. Switching Characteristics Over Recommended Operating Conditions for CLKOUT1
(seeFigure 5-9 )
(seeFigure 5-10 )
Figure 5-10. CLKOUT2 Timing
Table 5-9. Switching Characteristics Over Recommended Operating Conditions for CLKOUT3
(seeFigure 5-11 )
Figure 5-11. CLKOUT3 Timing
5.6 General-Purpose Input/Output (GPIO)
5.6.1 GPIO Peripheral Input/Output Electrical Data/Timing
5.6.2 GPIO Peripheral External Interrupts Electrical Data/Timing
Figure 5-12. GPIO Port Timing Table 5-12. Timing Requirements for External Interrupts/EDMA Events
(see Figure 5-13 )
Figure 5-13. GPIO External Interrupt Timing
5.7 External Memory Interface (EMIF) 5.7.1 Asynchronous EMIF (AEMIF)
(see Figure 5-14and Figure 5-15 )
(see Figure 5-14 and Figure 5-15 )
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DM355 UNINO. PARAMETER TMIN Nom MAX Output hold time, EM_WE high to27 t
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(WH)*E nsEM_D[15:0] invalid
Figure 5-14. Asynchronous Memory Read Timing for EMIF
Figure 5-15. Asynchronous Memory Write Timing for EMIF
Figure 5-16. EM_WAIT Read Timing Requirements
Figure 5-17. EM_WAIT Write Timing Requirements
Figure 5-18. Synchronous OneNAND Flash Read Timing
5.7.2 DDR2 Memory Controller
5.8 MMC/SD
5.8.1 MMC/SD Electrical Data/Timing
Figure 5-19. MMC/SD Host Command Timing
Figure 5-20. MMC/SD Card Response Timing
Figure 5-21. MMC/SD Host Write Timing
Figure 5-22. MMC/SD Host Read and Card CRC Status Timing
5.9 Video Processing Sub-System (VPSS) Overview
5.9.1 Video Processing Front-End (VPFE)
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(see Figure 5-25 )
Figure 5-25. VPFE (CCD) Master Mode Input Data Timing
5.9.2 Video Processing Back-End (VPBE)
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(seeFigure 5-28 )
(see Figure 5-29 )
Figure 5-29. VPBE Control and Data Output With Respect to PCLK and EXTCLK
(see Figure 5-30 )
Figure 5-31. DAC Only Application Example
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Figure 5-32. DAC With Buffer Circuit
5.10 USB 2.0
5.10.1 USB2.0 Electrical Data/Timing
Figure 5-33. USB2.0 Integrated Transceiver Interface Timing
Figure 5-34. USB Reference Resistor Routing
5.11 Universal Asynchronous Receiver/Transmitter (UART)
5.11.1 UART Electrical Data/Timing
Figure 5-35. UART Transmit/Receive Timing
5.12 Serial Port Interface (SPI)
5.12.1 SPI Electrical Data/Timing
(see Figure 5-37 )
Figure 5-37. SPI Master Mode External Timing (Clock Phase = 0)
Figure 5-38. SPI Master Mode External Timing (Clock Phase = 1)
5.13 Inter-Integrated Circuit (I2C)
5.13.1 I2C Electrical Data/Timing
5.13.1.1 Inter-Integrated Circuits (I2C) Timing Table 5-33. Timing Requirements for I2C Timings
(see Figure 5-39 )
Figure 5-39. I2C Receive Timings
Table 5-34. Switching Characteristics for I2C Timings
(see Figure 5-40 )
CAUTIONThe DM355 I
C pins use a standard 4-mA LVCMOS buffer, not the slow I/OP bufferdefined in the I
C specification. Series resistors may be necessary to reduce noise atthe system level.
5.14 Audio Serial Port (ASP)
5.14.1 ASP Electrical Data/Timing
5.14.1.1 Audio Serial Port (ASP) Timing Table 5-35. Timing Requirements for ASP
(see Figure 5-41 )
Table 5-36. Switching Characteristics Over Recommended Operating Conditions for ASP
(see Figure 5-41 )
Figure 5-41. ASP Timing
Table 5-37. ASP as SPI Timing Requirements
CLKSTP = 10b, CLKXP = 0 (see Figure 5-42 )
Table 5-38. ASP as SPI Switching Characteristics
CLKSTP = 10b, CLKXP = 0 (see Figure 5-42 )
Figure 5-42. ASP as SPI: CLKSTP = 10b, CLKXP = 0
Table 5-39. ASP as SPI Timing Requirements
CLKSTP = 11b, CLKXP = 0
Table 5-40. ASP as SPI Switching Characteristics
CLKSTP = 11b, CLKXP = 0 (see Figure 5-43 )
Figure 5-43. ASP as SPI: CLKSTP = 11b, CLKXP = 0
Table 5-41. ASP as SPI Timing Requirements
CLKSTP = 10b, CLKXP = 1 (see Figure 5-44 )
Table 5-42. ASP as SPI Switching Characteristics
CLKSTP = 10b, CLKXP = 1 (see Figure 5-44 )
Figure 5-44. ASP as SPI: CLKSTP = 10b, CLKXP = 1
Table 5-43. ASP as SPI Timing Requirements
CLKSTP = 11b, CLKXP = 1 (see Figure 5-45 )
Table 5-44. ASP as SPI Switching Characteristics
CLKSTP = 11b, CLKXP = 1 (see Figure 5-45 )
Figure 5-45. ASP as SPI: CLKSTP = 11b, CLKXP = 1
5.15 Timer
5.15.1 Timer Electrical Data/Timing
5.16 Pulse Width Modulator (PWM)
5.16.1 PWM0/1/2/3 Electrical/Timing Data
Figure 5-48. PWM Output Delay Timing
5.17 Real Time Out (RTO) 5.17.1 RTO Electrical/Timing Data
Figure 5-49. RTO Output Timing
Figure 5-50. RTO Output Delay Timing
5.18 IEEE 1149.1 JTAG
5.18.1 JTAG Test-Port Electrical Data/Timing
Table 5-48. Timing Requirements for JTAG Test Port (see Figure 5-51 )
Figure 5-51. JTAG Input Timing
Figure 5-52. JTAG Output Timing
6 Revision History
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7 Mechanical Data
7.1 Thermal Data for ZCE
7.1.1 Packaging Information
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IMPORTANT NOTICE