Intel 315889-002 manual Figure Figure Figure

Output Voltage Requirements

Figure 2-7.

Figure 2-8.

Figure 2-9.

Six-layer Dual-Core Intel Xeon Processor-Based Server Platform VccP Power Delivery Impedance Model Path with 1206 Size Caps

VR	Motherboard				Socket and Package
15 X 560 uF	35 X 10 uF	58 pH	0.51m	9 X 10 uF	20 pH	0.33m
Aluminum-Polymer	MLCC 1206
				MLCC 1206
8400 uF	350 uF		90 uF
0.40m	0.09m		0.4m			VR	PWL
						Sense
						Point	30A to 130A
267 pH	34 pH		134 pH				1000A/uS

Eight-layer Dual-Core Intel Xeon Processor-Based Server Platform VccP Power Delivery Impedance Model Path with 1206 Size Caps

VR	Motherboard				Socket and Package
13 X 560 uF	35 X 10 uF	54 pH	0.37m	9 X 10 uF	20 pH	0.33m
Aluminum-Polymer	MLCC 1206			MLCC 1206
7280 uF	350 uF		90 uF
0.46m	0.09m		0.4m			VR	PWL
						Sense
						Point	30A to 130A
307 pH	34 pH		134 pH				1000A/uS

Eight-layer Dual-Core Intel Xeon Processor-Based Server Platform VccP Power Delivery Impedance Model Path with 0805 Size Caps

VR	Motherboard				Socket and Package
17 X 560 uF	45 X 10 uF	54 pH	0.43m	9 X 10 uF	20 pH	0.33m
Aluminum-Polymer	MLCC 0805			MLCC 0805
9520 uF	450 uF			90 uF
0.41m	0.22m		1.1m			VR	PWL
						Sense
						Point
235 pH	25 pH			122 pH		30A to 130A
						1000A/uS

The platform processor decoupling design incorporates fifteen 560 µF Aluminum- polymer bulk capacitors and forty four 10 µF 1206 package ceramic high-frequency capacitors per processor for a 6 layer board, thirteen 560 µF Aluminum-polymer bulk capacitors and forty four 10 µF 1206 package ceramic high-frequency capacitors per processor for a 8 layer board and seventeen 560 µF Aluminum-polymer bulk capacitors and fifty four 10 µF 0805 package ceramic high-frequency capacitors per processor for a 8 layer board (Table 2-8). At least nine of the 10 µF capacitors should be placed in the cavity of the processor socket. The remaining capacitors can be placed under the processor socket on the backside of the baseboard. The 560 µF capacitors should be placed along the sides of the processor socket, as close to the socket as the keep-out zones allow and on the south east side of the processor socket where the bulk of the power pins are located.

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