Intel 315889-002 manual Motherboard, Socket & Package

Output Voltage Requirements

Figure 2-10. Dual-Core Intel Xeon 5000 Series with Intel 5400 Chipsets Platform VccP Power Delivery Impedance Model Path - Example

VR	Motherboard		Socket & Package
				HF Caps in
Low Fr Caps	Mid Fr Caps	HF Caps		socket cavity	Sense
12x 560µF	10x 100µF	49x 10µF	20 pH	9x 10µF	Point
Oscon	MLCC 1210	0.51 mO MLCC 1206		MLCC 1206
	54 pH			0.33 mO	30A to
6.72mF	1mF	490µF		90µF	130A
					1000A/us
0.58 mO	0.4 mO	0.08 mO		0.56 mO
0.33 nH	52 pH	20 pH		0.11 nH

Table 2-10. Dual-Core Intel Xeon 5000 Series with Intel 5400 Chipsets Platform Processor Decoupling Capacitor Recommendations

Quantity		Value	Tolerance	Temperature	ESR	ESL	Notes
				Coefficient	(mΩ)	(nH)
12	560	µF Al-Polymer	±20%	Oscon	7	4	1
10	100	µF 1210 MLCC	±10%	X6S	4	0.52	1
58	10 µF 1206 MLCC		±10%	X5R or X6S	5	1	1, 2

Notes:

1.Dual-Core Intel Xeon 5000 Series processors with Intel 5400 Chipsets platform has 8-layer stackup. Refer to the latest Dual-Core Intel Xeon 5000 Series processors with Intel 5400 Chipsets Platform Design Guide for baseboard stack-up details.

2.9 of these HF caps are inside the processor socket cavity.

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