Package Information
Figure 7. Side View - 41210 Bridge 567-Ball FCBGA Package Dimensions
FC BGA Substrate
Die 
J 
1.940 – 0.150
|
| Detail | J |
H |
| Scale | 5:1 |
|
|
| |
|
|
| 0.74 – 0.025 |
|
|
| 0.100 – 0.025 |
|
|
| Die Solder |
|
|
| Bumps |
|
| Underfill |
|
Detail | H | Epoxy |
|
Scale | 5:1 |
|
|
|
| 1.170 – 0.085 |
|
|
| 0.600 – 0.100 |
|
BGA Solder Balls
Intel® 41210 Serial to Parallel PCI Bridge Design Guide | 17 |
