Si53xx-RM

APPENDIX I—Si5374AND Si5375 PCB LAYOUT RECOMMENDATIONS

The following is a set of recommendations and guidelines for printed circuit board layout with the Si5374 and Si5374 devices. Because the four DSPLLs are in close physical and electrical proximity to one another, PCB layout is critical to achieving the highest levels of jitter performance. The following images were taken from the Si537x- EVB (evaluation board) layout. For more details about this board, refer to the Si537x-EVB Evaluation Board User's Guide.

Isolated Vdd’s

Main Vdd

Isolated Vdd’s

The four Vdd supplies should be isolated from one another with four ferrite beads. They should be separately bypassed with capacitors that are located very close to the Si537x device.

Figure 95. Vdd Plane

Use a solid and undisturbed ground plane for the Si537x and all of the clock input and output return paths.

For applications that wish to logically connect the four RSTL_x signals, do not tie them together underneath the BGA package. Instead connect them outside of the BGA footprint.

Where possible, place the CKOUT and CKIN signals on separate PCB layers with a ground layer between them. The use of ground guard traces between all clock inputs and outputs is recommended.

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Silicon Laboratories SI5374, SI5369, SI5365, SI5366, SI5367, SI5375 Appendix I-Si5374AND Si5375 PCB Layout Recommendations