Application Information
5.2Designing With PowerPADt Devices
The TVP5147 device is housed in a
It is recommended that there be a thermal land, which is an area of
Other requirements for using thermal lands and thermal vias are detailed in the TI application note PowerPADt Thermally Enhanced Package Application Report, (SLMA002), available via the TI Web pages beginning at URL: http://www.ti.com
For the TVP5147 device, this thermal land must be grounded to the
While the thermal land can be electrically floated and configured to remove heat to an external heat sink, it is recommended that the thermal land be connected to the
PowerPAD is a trademark of Texas Instruments.
88 | TVP5147M1PFP |