Application Information

5.2Designing With PowerPADt Devices

The TVP5147 device is housed in a high-performance, thermally enhanced, 80-terminal PowerPAD package (TI package designator: 80PFP). Use of the PowerPAD package does not require any special considerations except to note that the thermal pad, which is an exposed die pad on the bottom of the device, is a metallic thermal and electrical conductor. Therefore, if not implementing the PowerPAD PCB features, the use of solder masks (or other assembly techniques) can be required to prevent any inadvertent shorting by the exposed thermal pad of connection etches or vias under the package. The recommended option, however, is not to run any etches or signal vias under the device, but to have only a grounded thermal land as in the following explanation. Although the actual size of the exposed die pad may vary, the minimum size required for the keep-out area for the 80-terminal PFP PowerPAD package is 8 mm ⋅ 8 mm.

It is recommended that there be a thermal land, which is an area of solder-tinned-copper, underneath the PowerPAD package. The thermal land varies in size, depending on the PowerPAD package being used, the PCB construction, and the amount of heat that needs to be removed. In addition, the thermal land may or may not contain numerous thermal vias depending on PCB construction.

Other requirements for using thermal lands and thermal vias are detailed in the TI application note PowerPADt Thermally Enhanced Package Application Report, (SLMA002), available via the TI Web pages beginning at URL: http://www.ti.com

For the TVP5147 device, this thermal land must be grounded to the low-impedance ground plane of the device. This improves not only thermal performance but also the electrical grounding of the device. It is also recommended that the device ground terminal landing pads be connected directly to the grounded thermal land. The land size must be as large as possible without shorting device signal terminals. The thermal land can be soldered to the exposed thermal pad using standard reflow soldering techniques.

While the thermal land can be electrically floated and configured to remove heat to an external heat sink, it is recommended that the thermal land be connected to the low-impedance ground plane for the device. More information can be obtained from the TI application note PHY Layout (SLLA020).

PowerPAD is a trademark of Texas Instruments.

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TVP5147M1PFP

SLES140A—March 2007

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Texas Instruments TVP5147M1PFP manual Designing With PowerPADt Devices
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TVP5147M1PFP specifications

The Texas Instruments TVP5147M1PFP is a versatile video decoder that stands out in the realm of analog video processing. This device is particularly designed for high-quality video applications, making it an excellent choice for a variety of consumer and professional electronics that require reliable video decoding capabilities.

One of the main features of the TVP5147 is its ability to decode multiple video formats, including NTSC, PAL, and SECAM. This flexibility allows the decoder to seamlessly interface with various video sources from different geographic regions, providing a global solution for video applications. The TVP5147 includes advanced synchronization features, ensuring it can effectively handle video signals that may vary in timing and quality.

The device is equipped with a sophisticated 10-bit analog-to-digital converter (ADC), which enhances the precision and clarity of the digital video output. This high-resolution capability allows for improved color accuracy and detail, leading to a more lifelike video representation. Additionally, the TVP5147 utilizes advanced digital processing technologies, including noise reduction and image enhancement features, contributing to outstanding image quality even in less than ideal input conditions.

Another notable characteristic of the TVP5147M1PFP is its support for various output formats, including ITU-R BT.601 and 656, which facilitates easy integration into different systems. The device can also provide various output resolutions, catering to the needs of diverse applications ranging from standard definition to high definition displays.

In terms of connectivity, the TVP5147 offers multiple input options, including composite video, S-video, and component video interfaces. This versatility ensures that it can accommodate a wide range of video sources, from traditional VHS players to modern digital cameras. Furthermore, the integrated video control features allow for easy adjustment of parameters such as brightness, contrast, and saturation.

The power consumption of the TVP5147M1PFP is optimized for low-energy applications while maintaining high performance, making it suitable for battery-powered devices and energy-efficient designs. Overall, the Texas Instruments TVP5147M1PFP is an exceptional video decoder that blends flexibility, high quality, and advanced technology, making it a preferred choice for video processing in numerous consumer and industrial applications. Its combination of features ensures reliable performance and high-quality output, fulfilling the demands of modern multimedia environments.
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