Texas Instruments TVP5147M1PFP manual Package Option Addendum, Packaging Information

PACKAGE OPTION ADDENDUM

www.ti.com 26-Feb-2007

PACKAGING INFORMATION

Orderable Device	Status (1)	Package	Package	Pins Package Eco Plan (2)			Lead/Ball Finish	MSL Peak Temp (3)
		Type	Drawing		Qty
TVP5147M1PFP	ACTIVE	HTQFP	PFP	80	96	Green (RoHS &	CU NIPDAU	Level-3-260C-168 HR
						no Sb/Br)
TVP5147M1PFPG4	ACTIVE	HTQFP	PFP	80	96	Green (RoHS &	CU NIPDAU	Level-3-260C-168 HR
						no Sb/Br)
TVP5147M1PFPR	ACTIVE	HTQFP	PFP	80	1000	Green (RoHS &	CU NIPDAU	Level-3-260C-168 HR
						no Sb/Br)
TVP5147M1PFPRG4	ACTIVE	HTQFP	PFP	80	1000	Green (RoHS &	CU NIPDAU	Level-3-260C-168 HR
						no Sb/Br)

(1)The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

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