Motorola TMS320C6711D warranty Important Notice

Page 107

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.

Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products

 

Applications

 

Amplifiers

amplifier.ti.com

Audio

www.ti.com/audio

Data Converters

dataconverter.ti.com

Automotive

www.ti.com/automotive

DSP

dsp.ti.com

Broadband

www.ti.com/broadband

Interface

interface.ti.com

Digital Control

www.ti.com/digitalcontrol

Logic

logic.ti.com

Military

www.ti.com/military

Power Mgmt

power.ti.com

Optical Networking

www.ti.com/opticalnetwork

Microcontrollers

microcontroller.ti.com

Security

www.ti.com/security

 

 

Telephony

www.ti.com/telephony

 

 

Video & Imaging

www.ti.com/video

 

 

Wireless

www.ti.com/wireless

Mailing Address:

Texas Instruments

 

 

 

Post Office Box 655303 Dallas, Texas 75265

 

Copyright 2005, Texas Instruments Incorporated

Image 107
Contents SPRS292A − October 2005 − Revised November Table of Contents Multichannel Buffered Serial Port Timing Revision HistoryPages ADDITIONS/CHANGES/DELETIONS Bottom View GDP and ZDP BGA packages bottom viewGDP and ZDP 272-PIN Ball Grid Array BGA PACKAGES† Description C6711D Device characteristicsCharacteristics of the C6711D Processor Hardware Features Internal ClockDevice compatibility Digital Signal Processor Functional block and CPU DSP core diagramCPU DSP core description ST2 ST1DA1 DA2Memory Block Description Block Size Bytes HEX Address Range Memory map summaryTMS320C6711D Memory Map Summary HEX Address Range Acronym Register Name Peripheral register descriptionsEmif Registers L2 Cache RegistersHEX Address Range Acronym Register Name Comments Interrupt Selector RegistersDevice Registers Edma Parameter RAM†Quick DMA Qdma and Pseudo Registers† Edma RegistersHPI Registers PLL Controller RegistersGpio Registers McBSP0 McBSP1 Timer 0 and Timer 1 RegistersHEX Address Range Acronym Register Name Comments Timer McBSP0 and McBSP1 RegistersSignal groups description CE0 CE3CE2 CE1General-Purpose Input/Output Gpio Port GpioGP7EXTINT7 GP6EXTINT6 GP5EXTINT5 GP4EXTINT4 CLKOUT2/GP2Device configurations at device reset Device ConfigurationsCLKMODE0 Configuration GDP/ZDP Functional Description PINBOOTMODE‡ BIT # Name Description Devcfg register descriptionEksrc Terminal Functions IPD Description Name GDP IPU‡ ZDP PIN SignalTerminal Functions IPD Description Name GDP IPU‡ ZDP Jtag Emulation Resets and InterruptsHD12 IPD Description Name GDP IPU‡ ZDP HOST-PORT Interface HPIUsed for transfer of data, address, and control Little EndianEmif − ASYNCHRONOUS/SYNCHRONOUS Memory Control ¶ Only one asserted during any external data accessDecoded from the two lowest bits of the internal address EA9 EA8 EA7 EA6 EA5 EA4 EA3 EA2 IPD Description Name GDP IPU‡ ZDP Emif − Address ¶Multichannel Buffered Serial Port 1 McBSP1 IPD Description Name GDP IPU‡ ZDP Emif − Data ¶GENERAL-PURPOSE INPUT/OUTPUT Gpio Module Multichannel Buffered Serial Port 0 McBSP0RSV IPD RSVRSV IPU Supply voltage See Note Name GDP ZDP Supply Voltage PinsDvdd CvddGND Description Name GDP ZDP Supply Voltage PinsGround Pins VSSVSS PIN Signal TYPE† Description Name GDP ZDP Ground PinsVSS GND Description Name GDP ZDP Ground PinsHardware Development Tools Development supportSoftware Development Tools Fully qualified production device Device supportDevice and development-support tool nomenclature Technology Device Family Temperature Range Default 0 C to 90 CPrefix Device Speed RangeDocumentation support PCC DCC Pgie GIE CPU CSR register descriptionRevision ID PwrdPCC CPU CSR Register Bit Field DescriptionCPU ID L2MODE Cache configuration Ccfg register descriptionCcfg Register Bit Field Description Event DSP Interrupt Default Selector Module ControlInterrupt sources and interrupt selector DSP Interrupts Interrupt SelectorEdma Selector Edma module and Edma selectorEdma Channels ESEL3 Register 0x01A0 FF0C ESEL1 Register 0x01A0 FF04PLL and PLL controller MIN TYP MAX Unit PLL Lock and Reset TimesClkout Signals, Default Settings, and Control Enabled or DisabledGDPA−167, ZDPA-167 Clock SignalPLL Clock Frequency Ranges†‡ PLL Control/Status Register Pllcsr Pllcsr Register 0x01B7 C100PLL Multiplier Control Register Pllm Pllm Register 0x01B7 C110DxEN OD1EN OSCDIV1 Register 0x01B7 C124Oscillator Divider 1 Register OSCDIV1 DIR General-purpose input/output GpioGP7 GP6 GP5 GP4 GP2 Power-down mode logic PD3 PD2 PD1 Pwrd Field of the CSR RegisterMode Power-supply sequencingCharacteristics of the Power-Down Modes System-level design considerationsDSP Cvdd VSS GND Power-supply decouplingPower-supply design considerations DvddIeee 1149.1 Jtag compatibility statement Example Boards and Maximum Emif Speed Emif device speedED3124 BE3 ED2316 BE2 ED158 BE1 ED70 BE0 Emif big endian mode correctnessEmif Data Lines Pins Where Data Present Reset BootmodeIOH Recommended operating conditions‡MIN NOM MAX Unit IOZ Parameter Test Conditions MIN TYP MAX UnitOutput Under Test Signal transition levelsParameter Measurement Information Tester Pin Electronics= 0.3 tcmax† VIL max VUS max Ground AC transient rise/fall time specificationsTiming parameters and board routing analysis Output from DSP Control Signals † Output from DSPBoard-Level Timings Example see Figure See Figure PLL Mode Bypass Mode UnitInput and Output Clocks Timing requirements for Clkin †‡§Clkin CLKOUT3 GDPA-167Parameter −250 Timing requirements for ECLKIN† see FigureGDPA-167 ZDPA−167 −200Are Asynchronous Memory TimingTiming requirements for asynchronous memory cycles†‡§ See −FigureAWE/SDWE/SSWE † Ardy Setup = Strobe = Not ReadyCEx BE30 EA212 Address ED310 Read Data AOE/SDRAS/SSOE †AOE/SDRAS/SSOE † ARE/SDCAS/SSADS † AWE/SDWE/SSWE † Ardy Setup = Strobe = Not Ready Hold =CEx BE30 EA212 Timing requirements for synchronous-burst Sram cycles† SYNCHRONOUS-BURST Memory TimingARE/SDCAS/SSADS† AOE/SDRAS/SSOE† AWE/SDWE/SSWE† CEx BE30BE1 BE2 BE3 BE4 EA212 ED310Timing requirements for synchronous Dram cycles† see Figure Synchronous Dram TimingAOE/SDRAS/SSOE † ARE/SDCAS/SSADS† AWE/SDWE/SSWE† Read EclkoutEA2113 Bank EA112 Column EA12 ED310 AOE/SDRAS/SSOE † ARE/SDCAS/SSADS † AWE/SDWE/SSWE † Write EclkoutEA2113 EA12 ED310Dcab Eclkout Actv EclkoutCEx BE30 EA2113 Bank Activate EA112 Row Address EA12 ED310 AOE/SDRAS/SSOE† ARE/SDCAS/SSADS† AWE/SDWE/SSWE†CEx BE30 EA212 EA12 ED310 Deac EclkoutCEx BE30 EA2113 Bank EA112 EA12 ED310 Refr EclkoutCEx BE30 EA212 MRS value ED310 MRS EclkoutHold Holda HOLD/HOLDA TimingTiming requirements for See Figure HOLD/HOLDA cycles† Eclkout Busreq Busreq TimingCLKMODE0 = Reset TimingTiming requirements for reset†‡ see Figure Emif Z Group† Emif Low Group† Group 2† Boot and Device PhaseClkin Eclkin Reset EXTINT, NMI External Interrupt TimingTiming requirements for external interrupts† see Figure Hstrobe Hrdy HOST-PORT Interface TimingGDPA−167 HstrobeHCS Hrdy HR/W Hhwil Hstrobe ‡ HCS HasHR/W Hhwil Hstrobe † HCS Has †HD150 input 1st half-word 2nd half-word HD150 input 1st halfword 2nd halfwordHrdy −1 ¶ Multichannel Buffered Serial Port Timing Clkx Clks ClkrFSR int Bitn-1Master Slave MIN MAX Timing requirements for FSR when Gsync = 1 see FigureClks FSR external CLKR/X no need to resync CLKR/X needs resyncBit Bitn-1 MASTER§ Slave MINClkx FSX MASTER§ Slave MIN MAX GDPA-167 McBSP Timing as SPI Master or Slave Clkstp = 10b, Clkxp = McBSP Timing as SPI Master or Slave Clkstp = 11b, Clkxp = TINPx TOUTx Timer TimingTiming requirements for timer inputs† GPIx GPOx GENERAL-PURPOSE INPUT/OUTPUT Gpio Port TimingTiming requirements for Gpio inputs†‡ TCK TDO TDI/TMS/TRST DTCKL-TDOV Delay time, TCK low to TDO validJtag TEST-PORT Timing Timing requirements for Jtag test port see FigureMechanical Data Package thermal resistance characteristicsThermal resistance characteristics S-PBGA package for GDP Thermal resistance characteristics S-PBGA package for ZDPQty Orderable Device Status Package Pins Package Eco PlanPackaging Information MSL Peak TempSeating Plane 4204396/A 04/02 GDP S-PBGA-N272Seating Plane 4204398/A 04/02 ZDP S-PBGA-N272Important Notice