Motorola TMS320C6711D warranty Emif device speed, Example Boards and Maximum Emif Speed

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SPRS292A − OCTOBER 2005 − REVISED NOVEMBER 2005

EMIF device speed

The maximum EMIF speed on the device is 100 MHz. TI recommends utilizing I/O buffer information specification (IBIS) to analyze all AC timings to determine if the maximum EMIF speed is achievable for a given board layout. To properly use IBIS models to attain accurate timing analysis for a given system, see the Using IBIS Models for Timing Analysis application report (literature number SPRA839).

For ease of design evaluation, Table 34 contains IBIS simulation results showing the maximum EMIF-SDRAM interface speeds for the given example boards (TYPE) and SDRAM speed grades. Timing analysis should be performed to verify that all AC timings are met for the specified board layout. Other configurations are also possible, but again, timing analysis must be done to verify proper AC timings.

To maintain signal integrity, serial termination resistors should be inserted into all EMIF output signal lines (see the Terminal Functions table for the EMIF output signals).

Table 34. Example Boards and Maximum EMIF Speed

 

BOARD CONFIGURATION

 

MAXIMUM ACHIEVABLE

 

 

 

 

TYPE

EMIF INTERFACE

BOARD TRACE

SDRAM SPEED GRADE

EMIF-SDRAM

COMPONENTS

 

INTERFACE SPEED

 

 

 

 

 

 

 

 

 

 

 

143 MHz 32-bit SDRAM (−7)

100 MHz

 

 

 

 

 

1-Load

One bank of one

1 to 3-inch traces with proper

166 MHz 32-bit SDRAM (−6)

For short traces, SDRAM data

 

output hold time on these

termination resistors;

 

 

Short Traces

32-Bit SDRAM

183 MHz 32-bit SDRAM (−55)

SDRAM speed grades cannot

Trace impedance ~ 50

 

 

 

meet EMIF input hold time

 

 

 

200 MHz 32-bit SDRAM (−5)

 

 

 

requirement (see NOTE 1).

 

 

 

 

 

 

 

 

125 MHz 16-bit SDRAM (−8E)

100 MHz

 

 

1.2 to 3 inches from EMIF to

 

 

2-Loads

One bank of two

133 MHz 16-bit SDRAM (−75)

100 MHz

each load, with proper

 

 

143 MHz 16-bit SDRAM (−7E)

100 MHz

Short Traces

16-Bit SDRAMs

termination resistors;

 

 

167 MHz 16-bit SDRAM (−6A)

100 MHz

 

 

Trace impedance ~ 78

 

 

 

167 MHz 16-bit SDRAM (−6)

100 MHz

 

 

 

 

 

 

 

 

 

For short traces, EMIF cannot

 

 

 

125 MHz 16-bit SDRAM (−8E)

meet SDRAM input hold

 

 

 

 

requirement (see NOTE 1).

 

 

1.2 to 3 inches from EMIF to

 

 

3-Loads

One bank of two

133 MHz 16-bit SDRAM (−75)

100 MHz

each load, with proper

 

 

32-Bit SDRAMs

143 MHz 16-bit SDRAM (−7E)

100 MHz

Short Traces

termination resistors;

One bank of buffer

 

 

167 MHz 16-bit SDRAM (−6A)

100 MHz

 

Trace impedance ~ 78

 

 

 

 

 

 

For short traces, EMIF cannot

 

 

 

167 MHz 16-bit SDRAM (−6)

meet SDRAM input hold

 

 

 

 

requirement (see NOTE 1).

 

 

 

 

 

 

 

 

143 MHz 32-bit SDRAM (−7)

83 MHz

 

One bank of one

 

 

 

 

 

166 MHz 32-bit SDRAM (−6)

83 MHz

 

32-Bit SDRAM

 

3-Loads

4 to 7 inches from EMIF;

 

 

183 MHz 32-bit SDRAM (−55)

83 MHz

One bank of one

Long Traces

Trace impedance ~ 63

 

 

32-Bit SBSRAM

 

SDRAM data output hold time

 

 

 

 

One bank of buffer

 

200 MHz 32-bit SDRAM (−5)

cannot meet EMIF input hold

 

 

 

 

requirement (see NOTE 1).

NOTE 1: Results are based on IBIS simulations for the given example boards (TYPE). Timing analysis should be performed to determine if timing requirements can be met for the particular system.

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Contents SPRS292A − October 2005 − Revised November Table of Contents Multichannel Buffered Serial Port Timing Revision HistoryPages ADDITIONS/CHANGES/DELETIONS Bottom View GDP and ZDP BGA packages bottom viewGDP and ZDP 272-PIN Ball Grid Array BGA PACKAGES† Description C6711D Device characteristicsCharacteristics of the C6711D Processor Hardware Features Internal ClockDevice compatibility Digital Signal Processor Functional block and CPU DSP core diagramCPU DSP core description ST2 ST1DA1 DA2Memory Block Description Block Size Bytes HEX Address Range Memory map summaryTMS320C6711D Memory Map Summary HEX Address Range Acronym Register Name Peripheral register descriptionsEmif Registers L2 Cache RegistersHEX Address Range Acronym Register Name Comments Interrupt Selector RegistersDevice Registers Edma Parameter RAM†Quick DMA Qdma and Pseudo Registers† Edma RegistersHPI Registers PLL Controller RegistersGpio Registers McBSP0 McBSP1 Timer 0 and Timer 1 RegistersHEX Address Range Acronym Register Name Comments Timer McBSP0 and McBSP1 RegistersSignal groups description CE0 CE3CE2 CE1General-Purpose Input/Output Gpio Port GpioGP7EXTINT7 GP6EXTINT6 GP5EXTINT5 GP4EXTINT4 CLKOUT2/GP2Device configurations at device reset Device ConfigurationsCLKMODE0 Configuration GDP/ZDP Functional Description PINBOOTMODE‡ BIT # Name Description Devcfg register descriptionEksrc Terminal Functions IPD Description Name GDP IPU‡ ZDP PIN SignalTerminal Functions IPD Description Name GDP IPU‡ ZDP Jtag Emulation Resets and InterruptsHD12 IPD Description Name GDP IPU‡ ZDP HOST-PORT Interface HPIUsed for transfer of data, address, and control Little EndianEmif − ASYNCHRONOUS/SYNCHRONOUS Memory Control ¶ Only one asserted during any external data accessDecoded from the two lowest bits of the internal address EA9 EA8 EA7 EA6 EA5 EA4 EA3 EA2 IPD Description Name GDP IPU‡ ZDP Emif − Address ¶Multichannel Buffered Serial Port 1 McBSP1 IPD Description Name GDP IPU‡ ZDP Emif − Data ¶GENERAL-PURPOSE INPUT/OUTPUT Gpio Module Multichannel Buffered Serial Port 0 McBSP0RSV IPD RSVRSV IPU Supply voltage See Note Name GDP ZDP Supply Voltage PinsDvdd CvddGND Description Name GDP ZDP Supply Voltage PinsGround Pins VSSVSS PIN Signal TYPE† Description Name GDP ZDP Ground PinsVSS GND Description Name GDP ZDP Ground PinsHardware Development Tools Development supportSoftware Development Tools Fully qualified production device Device supportDevice and development-support tool nomenclature Technology Device Family Temperature Range Default 0 C to 90 CPrefix Device Speed RangeDocumentation support PCC DCC Pgie GIE CPU CSR register descriptionRevision ID PwrdPCC CPU CSR Register Bit Field DescriptionCPU ID L2MODE Cache configuration Ccfg register descriptionCcfg Register Bit Field Description Event DSP Interrupt Default Selector Module ControlInterrupt sources and interrupt selector DSP Interrupts Interrupt SelectorEdma Selector Edma module and Edma selectorEdma Channels ESEL3 Register 0x01A0 FF0C ESEL1 Register 0x01A0 FF04PLL and PLL controller MIN TYP MAX Unit PLL Lock and Reset TimesClkout Signals, Default Settings, and Control Enabled or DisabledGDPA−167, ZDPA-167 Clock SignalPLL Clock Frequency Ranges†‡ PLL Control/Status Register Pllcsr Pllcsr Register 0x01B7 C100PLL Multiplier Control Register Pllm Pllm Register 0x01B7 C110DxEN OD1EN OSCDIV1 Register 0x01B7 C124Oscillator Divider 1 Register OSCDIV1 DIR General-purpose input/output GpioGP7 GP6 GP5 GP4 GP2 Power-down mode logic PD3 PD2 PD1 Pwrd Field of the CSR RegisterMode Power-supply sequencingCharacteristics of the Power-Down Modes System-level design considerationsDSP Cvdd VSS GND Power-supply decouplingPower-supply design considerations DvddIeee 1149.1 Jtag compatibility statement Example Boards and Maximum Emif Speed Emif device speedED3124 BE3 ED2316 BE2 ED158 BE1 ED70 BE0 Emif big endian mode correctnessEmif Data Lines Pins Where Data Present Reset BootmodeIOH Recommended operating conditions‡MIN NOM MAX Unit IOZ Parameter Test Conditions MIN TYP MAX UnitOutput Under Test Signal transition levelsParameter Measurement Information Tester Pin Electronics= 0.3 tcmax† VIL max VUS max Ground AC transient rise/fall time specificationsTiming parameters and board routing analysis Output from DSP Control Signals † Output from DSPBoard-Level Timings Example see Figure See Figure PLL Mode Bypass Mode UnitInput and Output Clocks Timing requirements for Clkin †‡§Clkin CLKOUT3 GDPA-167Parameter −250 Timing requirements for ECLKIN† see FigureGDPA-167 ZDPA−167 −200Are Asynchronous Memory TimingTiming requirements for asynchronous memory cycles†‡§ See −FigureAWE/SDWE/SSWE † Ardy Setup = Strobe = Not ReadyCEx BE30 EA212 Address ED310 Read Data AOE/SDRAS/SSOE †AOE/SDRAS/SSOE † ARE/SDCAS/SSADS † AWE/SDWE/SSWE † Ardy Setup = Strobe = Not Ready Hold =CEx BE30 EA212 Timing requirements for synchronous-burst Sram cycles† SYNCHRONOUS-BURST Memory TimingARE/SDCAS/SSADS† AOE/SDRAS/SSOE† AWE/SDWE/SSWE† CEx BE30BE1 BE2 BE3 BE4 EA212 ED310Timing requirements for synchronous Dram cycles† see Figure Synchronous Dram TimingAOE/SDRAS/SSOE † ARE/SDCAS/SSADS† AWE/SDWE/SSWE† Read EclkoutEA2113 Bank EA112 Column EA12 ED310 AOE/SDRAS/SSOE † ARE/SDCAS/SSADS † AWE/SDWE/SSWE † Write EclkoutEA2113 EA12 ED310Dcab Eclkout Actv EclkoutCEx BE30 EA2113 Bank Activate EA112 Row Address EA12 ED310 AOE/SDRAS/SSOE† ARE/SDCAS/SSADS† AWE/SDWE/SSWE†CEx BE30 EA212 EA12 ED310 Deac EclkoutCEx BE30 EA2113 Bank EA112 EA12 ED310 Refr EclkoutCEx BE30 EA212 MRS value ED310 MRS EclkoutHold Holda HOLD/HOLDA TimingTiming requirements for See Figure HOLD/HOLDA cycles† Eclkout Busreq Busreq TimingCLKMODE0 = Reset TimingTiming requirements for reset†‡ see Figure Emif Z Group† Emif Low Group† Group 2† Boot and Device PhaseClkin Eclkin Reset EXTINT, NMI External Interrupt TimingTiming requirements for external interrupts† see Figure Hstrobe Hrdy HOST-PORT Interface TimingGDPA−167 HstrobeHCS Hrdy HR/W Hhwil Hstrobe ‡ HCS HasHR/W Hhwil Hstrobe † HCS Has †HD150 input 1st half-word 2nd half-word HD150 input 1st halfword 2nd halfwordHrdy −1 ¶ Multichannel Buffered Serial Port Timing Clkx Clks ClkrFSR int Bitn-1Master Slave MIN MAX Timing requirements for FSR when Gsync = 1 see FigureClks FSR external CLKR/X no need to resync CLKR/X needs resyncBit Bitn-1 MASTER§ Slave MINClkx FSX MASTER§ Slave MIN MAX GDPA-167 McBSP Timing as SPI Master or Slave Clkstp = 10b, Clkxp = McBSP Timing as SPI Master or Slave Clkstp = 11b, Clkxp = TINPx TOUTx Timer TimingTiming requirements for timer inputs† GPIx GPOx GENERAL-PURPOSE INPUT/OUTPUT Gpio Port TimingTiming requirements for Gpio inputs†‡ TCK TDO TDI/TMS/TRST DTCKL-TDOV Delay time, TCK low to TDO validJtag TEST-PORT Timing Timing requirements for Jtag test port see FigureMechanical Data Package thermal resistance characteristicsThermal resistance characteristics S-PBGA package for GDP Thermal resistance characteristics S-PBGA package for ZDPQty Orderable Device Status Package Pins Package Eco PlanPackaging Information MSL Peak TempSeating Plane 4204396/A 04/02 GDP S-PBGA-N272Seating Plane 4204398/A 04/02 ZDP S-PBGA-N272Important Notice