24888 Rev 3.03 - July 12, 2004 |
Cover page
Data Sheet
1Overview
The
1.1Device Features
•HyperTransport technology tunnel with side A and side B.
•Side A is 16 bits (input and output); side B is 8 bits.
•Either side may connect to the host or to a downstream HyperTransport technology compliant device.
•Each side supports HyperTransport technol-
•Side A supports transfer rates of 1600, 1200, 800, and 400
•Maximum bandwidth is 6.4 gigabytes per second across side A (half upstream and half downstream) and 1.6 gigabytes per second across side B.
•Independent transfer rate and bit width selection for each side.
•Link disconnect protocol supported.
•AGP 8x bridge.
•Compliance with AGP 3.0 specification sig- naling, supporting 4x and 8x transfer rates.
•Compliance with AGP 2.0 specification 1.5- volt signaling, supporting 1x, 2x, and 4x
•Supports up to 32 outstanding requests.
•31 x 31 millimeter,
•1.5 volt AGP signaling; some 3.3 volt IO; 1.2 volt link signaling; 1.8 volt core.
Host
HyperTransportTM
Link
16 bits upstream,
16 bits downstream
Side A | Side B |
| tunnel |
| AGP |
| Bridge |
HyperTransport
Link |
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| Downstream | ||
8 bits upstream, |
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| Device | ||
8 bits downstream |
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| AGP Graphics |
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| Controller |
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Figure 1: System block diagram.
1