HP 1GSa/s Digitizing Oscilloscope 16532A manual Reference Designator and Abbreviations

HP 16532A - Replaceable Parts

Table 5-1. Reference Designator and Abbreviations

REFERENCE DESIGNATOR

A	= assembly	F	= fuse	Q	= transistor;SCR;	U	= integrated circuit;
B	= fan;motor	FL	= filter		triode thyristor		microcircuit
BT	= battery	H	= hardware	R	= resistor	V	= electron tube; glow
C	= capacitor	J	= electrical connector	RT	= thermistor		lamp
CR	= diode;diode thyristor;		(stationary portion);jack	S	= switch;jumper	VR	= voltage regulator;
	varactor	L	= coil;inductor	T	= transformer		breakdown diode
DL	= delay line	MP	= misc. mechanical part	TB	= terminal board	W	= cable
DS	= annunciator;lamp;LED	P	= electrical connector	TP	= test point	X	= socket
E	= misc. electrical part		(moveable portion);plug			Y	= crystal unit(piezo-
							electric or quartz)
			ABBREVIATIONS
A	= amperes	DWL	= dowel	MFR	= manufacturer	RND	= Round
A/D	= analog-to-digital	ECL	= emitter coupled logic	MICPROC	= microprocessor	ROM	= read-only memory
AC	= alternating current	ELAS	= elastomeric	MINTR	= miniature	RPG	= rotary pulse generator
ADJ	= adjust(ment)	EXT	= external	MISC	= miscellaneous	RX	= receiver
AL	= aluminum	F	= farads;metal film	MLD	= molded	S	= Schottky-clamped;
AMPL	= amplifier		(resistor)	MM	= millimeter		seconds(time)
ANLG	= analog	FC	= carbon film/	MO	= metal oxide	SCR	= screw;silicon
ANSI	= American National		composition	MTG	= mounting		controlled rectifier
	Standards Institute	FD	= feed	MTLC	= metallic	SEC	= second(time);secon-
ASSY	= assembly	FEM	= female	MUX	= multiplexer		dary
ASTIG	= astigmatism	FF	= flip-flop	MW	= milliwatt	SEG	= segment
ASYNCHRO	= asynchronous	FL	= flat	N	= nano(10-9)	SEL	= selector
ATTEN	= attenuator	FM	= foam;from	NC	= no connection	SGL	= single
AWG	= American wire gauge	FR	= front	NMOS	= n-channel metal-	SHF	= shift
BAL	= balance	FT	= gain bandwidth		oxide-semiconductor	SI	= silicon
BCD	= binary-code decimal		product	NPN	= negative-positive-	SIP	= single in-line
BD	= board	FW	= full wave		negative		package
BFR	= buffer	FXD	= fixed	NPRN	= neoprene	SKT	= skirt
BIN	= binary	GEN	= generator	NRFR	= not recommended for	SL	= slide
BRDG	= bridge	GND	= ground(ed)		field replacement	SLDR	= solder
BSHG	= bushing	GP	= general purpose	NSR	= not separately	SLT	= slot(ted)
BW	= bandwidth	GRAT	= graticule		replaceable	SOLD	= solenoid
C	= ceramic;cermet	GRV	= groove	NUM	= numeric	SPCL	= special
	(resistor)	H	= henries;high	OBD	= order by description	SQ	= square
CAL	= calibrate;calibration	HD	= hardware	OCTL	= octal	SREG	= shift register
CC	= carbon composition	HDND	= hardened	OD	= outside diameter	SRQ	= service request
CCW	= counterclockwise	HG	= mercury	OP AMP	= operational amplifier	STAT	= static
CER	= ceramic	HGT	= height	OSC	= oscillator	STD	= standard
CFM	= cubic feet/minute	HLCL	= helical	P	= plastic	SYNCHRO	= synchronous
CH	= choke	HORIZ	= horizontal	P/O	= part of	TA	= tantalum
CHAM	= chamfered	HP	= Hewlett-Packard	PC	= printed circuit	TBAX	= tubeaxial
CHAN	= channel	HP-IB	= Hewlett-Packard	PCB	= printed circuit board	TC	= temperature coefficient
CHAR	= character		Interface Bus	PD	= power dissipation	TD	= time delay
CM	= centimeter	HR	= hour(s)	PF	= picofarads	THD	= thread(ed)
CMOS	= complementary metal-	HV	= high voltage	PI	= plug in	THK	= thick
	oxide-semiconductor	HZ	= Hertz	PL	= plate(d)	THRU	= through
CMR	= common mode rejec-	I/O	= input/output	PLA	= programmable logic	TP	= test point
	tion	IC	= integrated circuit		array	TPG	= tapping
CNDCT	= conductor	ID	= inside diameter	PLST	= plastic	TPL	= triple
CNTR	= counter	IN	= inch	PNP	= positive-negative-	TRANS	= transformer
CON	= connector	INCL	= include(s)		positive	TRIG	= trigger(ed)
CONT	= contact	INCAND	= incandescent	POLYE	= polyester	TRMR	= trimmer
CRT	= cathode-ray tube	INP	= input	POS	= positive;position	TRN	= turn(s)
CW	= clockwise	INTEN	= intensity	POT	= potentiometer	TTL	= transistor-transistor
D	= diameter	INTL	= internal	POZI	= pozidrive	TX	= transmitter
D/A	= digital-to-analog	INV	= inverter	PP	= peak-to-peak	U	= micro(10-6)
DAC	= digital-to-analog	JFET	= junction field-	PPM	= parts per million	UL	= Underwriters
	converter		effect transistor	PRCN	= precision		Laboratory
DARL	= darlington	JKT	= jacket	PREAMP	= preamplifier	UNREG	= unregulated
DAT	= data	K	= kilo(103)	PRGMBL	= programmable	VA	= voltampere
DBL	= double	L	= low	PRL	= parallel	VAC	= volt,ac
DBM	= decibel referenced	LB	= pound	PROG	= programmable	VAR	= variable
	to 1mW	LCH	= latch	PSTN	= position	VCO	= voltage-controlled
DC	= direct current	LCL	= local	PT	= point		oscillator
DCDR	= decoder	LED	= light-emitting	PW	= potted wirewound	VDC	= volt,dc
DEG	= degree		diode	PWR	= power	VERT	= vertical
DEMUX	= demultiplexer	LG	= long	R-S	= reset-set	VF	= voltage,filtered
DET	= detector	LI	= lithium	RAM	= random-access	VS	= versus
DIA	= diameter	LK	= lock		memory	W	= watts
DIP	= dual in-line package	LKWR	= lockwasher	RECT	= rectifier	W/	= with
DIV	= division	LS	= low power Schottky	RET	= retainer	W/O	= without
DMA	= direct memory access	LV	= low voltage	RF	= radio frequency	WW	= wirewound
DPDT	= double-pole,	M	= mega(106);megohms;	RGLTR	= regulator	XSTR	= transistor
	double-throw		meter(distance)	RGTR	= register	ZNR	= zener
DRC	= DAC refresh controller	MACH	= machine	RK	= rack	oC	= degree Celsius
DRVR	= driver	MAX	= maximum	RMS	= root-mean-square		(Centigrade)
						oF	= degree Fahrenheit
						oK	= degree Kelvin

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