Sun Microsystems CP3250 manual Form Factor, Power and Thermal Metrics, Connectors and Pinouts

B.1 Form Factor

The Sun Netra CP3250 blade server is a standard 8-rack unit (8U) factor, single-slot wide. It complies with the board mechanical dimensions that are required by the PICMG 3.0 specification:

■322.25 mm x 280 mm (12.7 inches x 11.0 inches)

■30.48 mm (1.2 inch) front panel

B.2 Power and Thermal Metrics

Typical heat dissipation and power consumption metrics for a Sun Netra CP3250 blade server:

■225W maximum power (includes 25W to ARTM, 20W to AMC, and two Intel Harpertown CPUs)

■-5C - 55C for NEBS compliance

■Power input: -36 VDC to -72 VDC (-48VDC nominal)

■CPU temperature thresholds are set relative to the Thermal Control Circuit (TCC) activation point of the Intel Harpertown CPUs. An offset of 95C is added to provide an approximate CPU die temperature.

Two heatsinks are mounted to the Sun Netra CP3250 blade server. The heatsinks and DIMMs are positioned on the blade server to provide adequate airflow (bottom to top).

B.3 Connectors and Pinouts

B.3.1 Front Panel Connectors

The front panel has the following connectors, see FIGURE 1-1:

■One 10/100/1000BASE-T Ethernet port (RJ-45)

■One serial port (RJ-45)

■Two USB ports

B-2Sun Netra CP3250 Blade Server User’s Guide • April 2009