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Texas Instruments TMS320C6712D warranty ST1, DA1, DA2, ST2

Models: TMS320C6712D

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SPRS293A − OCTOBER 2005 − REVISED NOVEMBER 2005

CPU (DSP core) description (continued)

Data Path A

Data Path B

		src1
	.L1†	src2
		dst	8
	long dst		8
	long dst		8
	long src		8
	long src		32
LD1 32 MSB			32
LD1 32 MSB
ST1			32	Register
	long src		32	Register
	long src		8	File A
	long dst		8	File A
	long dst		8	(A0−A15)
		dst		(A0−A15)
	.S1†

		src1
		src1
		src2
		dst
	.M1†	src1
		src2
LD1 32 LSB
		dst
DA1	.D1	src1
DA1		src2		2X
		src2

				1X
DA2		src2
DA2	.D2	src1
	.D2	src1
		dst
LD2 32 LSB
		src2
	.M2†	src1
		dst
		src2		Register
				Register
	.S2†	src1		File B
	.S2†	dst		(B0−B15)
		dst	8	(B0−B15)
	long dst		8
	long dst		8
	long src		8
	long src		32
LD2 32 MSB			32
LD2 32 MSB
ST2			32
	long src		32
	long src		8
	long dst		8
	long dst		8
		dst	8
	.L2†	dst
	.L2†	src2
		src2
		src1
				Control
				Register File

†In addition to fixed-point instructions, these functional units execute floating-point instructions.

Figure 1. TMS320C67x CPU (DSP Core) Data Paths

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Texas Instruments TMS320C6712D warranty ST1, DA1, DA2, ST2

Contents

SPRS293A − October 2005 − Revised November Table of Contents Pages ADDITIONS/CHANGES/DELETIONS Revision HistoryMultichannel Buffered Serial Port Timing Bottom View GDP and ZDP BGA package bottom viewGDP and ZDP 272-PIN Ball Grid Array BGA Package Description C6712D Device characteristicsCharacteristics of the C6712D Processor Hardware Features Internal ClockDevice compatibility Digital Signal Processor Functional block and CPU DSP core diagramCPU DSP core description ST2 ST1DA1 DA2Memory Block Description Block Size Bytes HEX Address Range Memory map summaryMemory Map Summary HEX Address Range Acronym Register Name Peripheral register descriptionsEmif Registers L2 Cache RegistersHEX Address Range Acronym Register Name Comments Interrupt Selector RegistersDevice Registers Edma Parameter RAM†Quick DMA Qdma and Pseudo Registers† Edma RegistersGpio Registers PLL Controller RegistersMcBSP0 and McBSP1 Registers HEX Address Range Acronym Register Name Comments TimerBIG/LITTLE Endian Signal groups descriptionClkin CLKOUT3 CLKOUT2† CLKMODE0 Pllhv TMS TDO TDI TCK Trst JtagGpio TOUT1 TINP1CLKR1 CLKS1†Device configurations at device reset Device ConfigurationsLendian Configuration GDP/ZDP Functional Description PINBOOTMODE10 EmifbeBIT # Name Description Devcfg register descriptionEksrc Terminal Functions IPD Description Name GDP IPU‡ ZDP PIN SignalTerminal Functions LITTLE/BIG Endian Format BootmodeBOOTMODE1 C19 BOOTMODE0 C20 IPD EMU1B9 EMU0D9 IPUDecoded from the two lowest bits of the internal address IPD Description Name GDP IPU‡ ZDP Resets and InterruptsOnly one asserted during any external data access Edge-drivenEmif − Data # Emif − Address #Multichannel Buffered Serial Port 1 McBSP1 TIMER1TIMER0 IPD Description Name GDP IPU‡ ZDP Emif − Data #Reserved for Test Multichannel Buffered Serial Port 0 McBSP0GENERAL-PURPOSE INPUT/OUTPUT Gpio Module Additional Reserved for Test IPD Description Name GDP IPU ZDPRSV IPU RSV IPDSPRS293A − October 2005 − Revised November Cvdd Name GDP ZDP Supply Voltage PinsSee the power-supply decoupling portion of this data sheet DvddGND Description Name GDP ZDP Supply Voltage PinsGround Pins VSSVSS GND Signal Name PIN GDP ZDP TYPE†VSS Description GDP Name ZDP Ground PinsHardware Development Tools Development supportSoftware Development Tools Fully qualified production device Device supportDevice and development-support tool nomenclature Technology Temperature Range Default 0C to 90CPrefix Device FamilyDocumentation support PCC DCC Pgie GIE CPU CSR register descriptionRevision ID PwrdPCC CPU CSR Register Bit Field DescriptionCPU ID L2MODE Cache configuration Ccfg register descriptionCcfg Register Bit Field Description Event DSP Interrupt Default Selector Module ControlInterrupt sources and interrupt selector DSP Interrupts Interrupt SelectorEdma Selector Edma module and Edma selectorEdma Channels ESEL3 Register 0x01A0 FF0C ESEL1 Register 0x01A0 FF04PLL and PLL controller MIN TYP MAX Unit PLL Lock and Reset TimesClkout Signals, Default Settings, and Control Enabled or DisabledGDP 150and ZDP Clock SignalPLL Clock Frequency Ranges†‡ PLL Control/Status Register Pllcsr Pllcsr Register 0x01B7 C100PLL Multiplier Control Register Pllm Pllm Register 0x01B7 C110DxEN OD1EN OSCDIV1 Register 0x01B7 C124Oscillator Divider 1 Register OSCDIV1 DIR General-purpose input/output GpioGP7 GP6 GP5 GP4 GP2 Power-down mode logic PD3 PD2 PD1 Pwrd Field of the CSR RegisterSystem-level design considerations Power-supply sequencingCharacteristics of the Power-Down Modes Power-supply design considerationsC6000 Power-supply decouplingSupply Schottky Diode Core Supply GND DvddIeee 1149.1 Jtag compatibility statement Example Boards and Maximum Emif Speed Emif device speedEmif Data Lines Pins Where Data Present Emif big endian mode correctnessBootmode ResetIOH Recommended operating conditionsMIN NOM MAX Unit IOZ Parameter Test Conditions MIN TYP MAX UnitVref = 1.5 Signal transition levelsParameter Measurement Information 42 Ω= 0.3 tcmax† VIL max VUS max Ground AC transient rise/fall time specificationsTiming parameters and board routing analysis Output from DSP Control Signals † Output from DSPBoard-Level Timings Example see Figure See Figure Input and Output ClocksTiming requirements for CLKIN†‡§ Clkin CLKOUT3 Timing requirements for ECLKIN§ see FigureEclkin Eclkout MINAre Asynchronous Memory TimingTiming requirements for asynchronous memory cycles†‡ See −FigureAOE/SDRAS/SSOE† ARE/SDCAS/SSADS† AWE/SDWE/SSWE† Ardy Setup = Strobe = Not Ready Hold =CE30 BE10 EA212 ED150 Read DataAOE/SDRAS/SSOE † ARE/SDCAS/SSADS † AWE/SDWE/SSWE † Ardy CEx BE30 EA212ED310 Unit MIN MAX SYNCHRONOUS-BURST Memory TimingARE/SDCAS/SSADS † AOE/SDRAS/SSOE † AWE/SDWE/SSWE† CE30 BE10BE1 BE2 BE3 BE4 EA212 ED150150 Synchronous Dram TimingTiming requirements for synchronous Dram cycles† see Figure AOE/SDRAS/SSOE † ARE/SDCAS/SSADS† AWE/SDWE/SSWE† Read EclkoutEA2113 Bank EA112 Column EA12 ED150 AOE/SDRAS/SSOE † ARE/SDCAS/SSADS † AWE/SDWE/SSWE † Write EclkoutEA2113 EA12 ED150Dcab Eclkout Actv EclkoutCE30 BE10 EA2113 Bank Activate EA112 Row Address EA12 ED150 AOE/SDRAS/SSOE† ARE/SDCAS/SSADS† AWE/SDWE/SSWE†Refr Eclkout Deac EclkoutCE30 BE10 EA2113 EA112 EA12 ED150CE30 BE10 EA212 MRS value ED150 MRS EclkoutHold Holda HOLD/HOLDA TimingTiming requirements for the HOLD/HOLDA cycles† see Figure HoldEclkout Busreq Busreq TimingCLKMODE0 = Reset TimingTiming requirements for reset†‡ see Figure Emif Z Group † Emif Low Group † Boot and Device PhaseEXTINT, NMI External Interrupt TimingTiming requirements for external interrupts† see Figure Timing requirements for McBSP†‡ see Figure Multichannel Buffered Serial Port TimingParameter Clkx Clks ClkrFSR int Bitn-1Master Slave Unit MIN MAX Timing requirements for FSR when Gsync = 1 see FigureClks FSR external CLKR/X no need to resync CLKR/X needs resyncBit Bitn-1 Parameter MASTER§ Slave Unit MIN MAXClkx FSX McBSP Timing as SPI Master or Slave Clkstp = 11b, Clkxp = Multichannel Buffered Serial Port Timing McBSP Timing as SPI Master or Slave Clkstp = 10b, Clkxp = McBSP Timing as SPI Master or Slave Clkstp = 11b, Clkxp = TINPx TOUTx Timer TimingTiming requirements for timer inputs† GPIx GPOx GENERAL-PURPOSE INPUT/OUTPUT Gpio Port TimingTiming requirements for Gpio inputs†‡ Unit MIN MAX TCK TDO TDI/TMS/TRST Jtag TEST-PORT TimingTiming requirements for Jtag test port see Figure Mechanical Data Package thermal resistance characteristicsThermal resistance characteristics S-PBGA package for GDP Thermal resistance characteristics S-PBGA package for ZDPQty Orderable Device Status Package Pins Package Eco PlanPackaging Information MSL Peak TempSeating Plane 4204396/A 04/02 GDP S-PBGA-N272Seating Plane 4204398/A 04/02 ZDP S-PBGA-N272Important Notice

SPRS293A − OCTOBER 2005 − REVISED NOVEMBER 2005

CPU (DSP core) description (continued)

ST1

DA1

DA2

ST2

long src

long dst

dst

.L2†

Figure 1. TMS320C67x CPU (DSP Core) Data Paths