Deac Eclkout, CE30 BE10 EA2113 | Texas Instruments TMS320C6712D

SPRS293A − OCTOBER 2005 − REVISED NOVEMBER 2005

SYNCHRONOUS DRAM TIMING (CONTINUED)

DEAC

ECLKOUT

CE[3:0]

BE[1:0]

EA[21:13]	Bank
EA[11:2]

EA12

ED[15:0]

AOE/SDRAS/SSOE†

ARE/SDCAS/SSADS†

AWE/SDWE/SSWE†

†ARE/SDCAS/SSADS, AWE/SDWE/SSWE, and AOE/SDRAS/SSOE operate as SDCAS, SDWE, and SDRAS, respectively, during SDRAM accesses.

Figure 34. SDRAM DEAC Command

REFR

ECLKOUT

CE[3:0]

BE[1:0]

EA[21:2]

EA12

ED[15:0]

12	12
AOE/SDRAS/SSOE†
8	8

ARE/SDCAS/SSADS†

AWE/SDWE/SSWE†

†ARE/SDCAS/SSADS, AWE/SDWE/SSWE, and AOE/SDRAS/SSOE operate as SDCAS, SDWE, and SDRAS, respectively, during SDRAM

accesses.

Figure 35. SDRAM REFR Command

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Texas Instruments TMS320C6712D Deac Eclkout, CE30 BE10 EA2113, EA112 EA12 ED150, Refr Eclkout, CE30 BE10 EA212 EA12 ED150

TMS320C6712D specifications

The Texas Instruments TMS320C6712D is a high-performance, fixed-point digital signal processor (DSP) that belongs to the TMS320C6000 family, well known for its advanced processing capabilities tailored for demanding signal processing applications. Launched in the early 2000s, the C6712D combines high computational power with a rich set of features, making it suitable for a variety of applications such as telecommunications, audio processing, and industrial control systems.

One of the standout characteristics of the TMS320C6712D is its architecture, which is based on a highly efficient VLIW (Very Long Instruction Word) design. This architecture allows the processor to execute multiple instructions in a single clock cycle, significantly increasing performance. The device operates at clock speeds of up to 150 MHz, providing substantial computational throughput that can handle complex algorithms and real-time processing tasks.

Another key feature of the TMS320C6712D is its 32-bit fixed-point processing capabilities, which allows it to perform difficult mathematical computations efficiently. With an instruction set optimized for DSP applications, the processor includes specialized instructions for multiplying and accumulating operations, as well as support for advanced filtering and generation of audio signals.

The C6712D offers an extensive memory architecture, supporting up to 128 MB of external memory via a 32-bit data bus. It features on-chip SRAM, which provides fast access to data and program storage, enhancing the system's overall performance. Additionally, the device includes a powerful set of peripherals, such as dual asynchronous serial ports (UART), I2C interfaces, and DSP-specific interfaces that facilitate connectivity with other components and systems.

Power consumption is another vital aspect of the TMS320C6712D. It incorporates technologies allowing for low-power operation, which is essential for portable and battery-operated devices. The capability to operate in various power modes helps optimize performance while minimizing energy usage.

In conclusion, the Texas Instruments TMS320C6712D is a versatile and powerful DSP that excels in high-performance applications. Its VLIW architecture, fixed-point processing capabilities, extensive memory options, and low power consumption make it an ideal choice for engineers looking to implement complex signal processing tasks efficiently. Whether used in telecommunications, audio processing, or industrial applications, the C6712D remains a reliable and capable solution in the digital signal processing landscape.

Contents

SPRS293A − October 2005 − Revised November Table of Contents Pages ADDITIONS/CHANGES/DELETIONS Revision History Multichannel Buffered Serial Port Timing GDP and ZDP 272-PIN Ball Grid Array BGA Package GDP and ZDP BGA package bottom viewBottom View Description C6712D Device characteristicsCharacteristics of the C6712D Processor Hardware Features Internal Clock Device compatibility Digital Signal Processor Functional block and CPU DSP core diagram CPU DSP core description ST2 ST1DA1 DA2 Memory Map Summary Memory map summaryMemory Block Description Block Size Bytes HEX Address Range HEX Address Range Acronym Register Name Peripheral register descriptionsEmif Registers L2 Cache Registers HEX Address Range Acronym Register Name Comments Interrupt Selector RegistersDevice Registers Edma Parameter RAM† Quick DMA Qdma and Pseudo Registers† Edma Registers Gpio Registers PLL Controller Registers McBSP0 and McBSP1 Registers HEX Address Range Acronym Register Name Comments Timer BIG/LITTLE Endian Signal groups descriptionClkin CLKOUT3 CLKOUT2† CLKMODE0 Pllhv TMS TDO TDI TCK Trst Jtag Gpio TOUT1 TINP1CLKR1 CLKS1† Device configurations at device reset Device Configurations Lendian Configuration GDP/ZDP Functional Description PINBOOTMODE10 Emifbe Eksrc Devcfg register descriptionBIT # Name Description Terminal Functions Terminal Functions PIN SignalIPD Description Name GDP IPU‡ ZDP LITTLE/BIG Endian Format BootmodeBOOTMODE1 C19 BOOTMODE0 C20 IPD EMU1B9 EMU0D9 IPU Decoded from the two lowest bits of the internal address IPD Description Name GDP IPU‡ ZDP Resets and InterruptsOnly one asserted during any external data access Edge-driven Emif − Data # Emif − Address # Multichannel Buffered Serial Port 1 McBSP1 TIMER1TIMER0 IPD Description Name GDP IPU‡ ZDP Emif − Data # GENERAL-PURPOSE INPUT/OUTPUT Gpio Module Multichannel Buffered Serial Port 0 McBSP0Reserved for Test Additional Reserved for Test IPD Description Name GDP IPU ZDPRSV IPU RSV IPD SPRS293A − October 2005 − Revised November Cvdd Name GDP ZDP Supply Voltage PinsSee the power-supply decoupling portion of this data sheet Dvdd GND Description Name GDP ZDP Supply Voltage PinsGround Pins VSS VSS GND Signal Name PIN GDP ZDP TYPE† VSS Description GDP Name ZDP Ground Pins Software Development Tools Development supportHardware Development Tools Device and development-support tool nomenclature Device supportFully qualified production device Technology Temperature Range Default 0C to 90CPrefix Device Family Documentation support PCC DCC Pgie GIE CPU CSR register descriptionRevision ID Pwrd CPU ID CPU CSR Register Bit Field DescriptionPCC Ccfg Register Bit Field Description Cache configuration Ccfg register descriptionL2MODE Event DSP Interrupt Default Selector Module ControlInterrupt sources and interrupt selector DSP Interrupts Interrupt Selector Edma Channels Edma module and Edma selectorEdma Selector ESEL3 Register 0x01A0 FF0C ESEL1 Register 0x01A0 FF04 PLL and PLL controller MIN TYP MAX Unit PLL Lock and Reset TimesClkout Signals, Default Settings, and Control Enabled or Disabled PLL Clock Frequency Ranges†‡ Clock SignalGDP 150and ZDP PLL Control/Status Register Pllcsr Pllcsr Register 0x01B7 C100 PLL Multiplier Control Register Pllm Pllm Register 0x01B7 C110 DxEN Oscillator Divider 1 Register OSCDIV1 OSCDIV1 Register 0x01B7 C124OD1EN GP7 GP6 GP5 GP4 GP2 General-purpose input/output GpioDIR Power-down mode logic PD3 PD2 PD1 Pwrd Field of the CSR Register System-level design considerations Power-supply sequencingCharacteristics of the Power-Down Modes Power-supply design considerations C6000 Power-supply decouplingSupply Schottky Diode Core Supply GND Dvdd Ieee 1149.1 Jtag compatibility statement Example Boards and Maximum Emif Speed Emif device speed Emif Data Lines Pins Where Data Present Emif big endian mode correctnessBootmode Reset MIN NOM MAX Unit Recommended operating conditionsIOH IOZ Parameter Test Conditions MIN TYP MAX Unit Vref = 1.5 Signal transition levelsParameter Measurement Information 42 Ω = 0.3 tcmax† VIL max VUS max Ground AC transient rise/fall time specifications Timing parameters and board routing analysis Board-Level Timings Example see Figure Control Signals † Output from DSPOutput from DSP Timing requirements for CLKIN†‡§ Input and Output ClocksSee Figure Clkin CLKOUT3 Timing requirements for ECLKIN§ see Figure Eclkin Eclkout MIN Are Asynchronous Memory TimingTiming requirements for asynchronous memory cycles†‡ See −Figure AOE/SDRAS/SSOE† ARE/SDCAS/SSADS† AWE/SDWE/SSWE† Ardy Setup = Strobe = Not Ready Hold =CE30 BE10 EA212 ED150 Read Data ED310 CEx BE30 EA212AOE/SDRAS/SSOE † ARE/SDCAS/SSADS † AWE/SDWE/SSWE † Ardy Unit MIN MAX SYNCHRONOUS-BURST Memory Timing ARE/SDCAS/SSADS † AOE/SDRAS/SSOE † AWE/SDWE/SSWE† CE30 BE10BE1 BE2 BE3 BE4 EA212 ED150 Timing requirements for synchronous Dram cycles† see Figure Synchronous Dram Timing150 EA2113 Bank EA112 Column EA12 ED150 Read EclkoutAOE/SDRAS/SSOE † ARE/SDCAS/SSADS† AWE/SDWE/SSWE† AOE/SDRAS/SSOE † ARE/SDCAS/SSADS † AWE/SDWE/SSWE † Write EclkoutEA2113 EA12 ED150 Dcab Eclkout Actv EclkoutCE30 BE10 EA2113 Bank Activate EA112 Row Address EA12 ED150 AOE/SDRAS/SSOE† ARE/SDCAS/SSADS† AWE/SDWE/SSWE† Refr Eclkout Deac EclkoutCE30 BE10 EA2113 EA112 EA12 ED150 CE30 BE10 EA212 MRS value ED150 MRS Eclkout Hold Holda HOLD/HOLDA TimingTiming requirements for the HOLD/HOLDA cycles† see Figure Hold Eclkout Busreq Busreq Timing Timing requirements for reset†‡ see Figure Reset TimingCLKMODE0 = Emif Z Group † Emif Low Group † Boot and Device Phase Timing requirements for external interrupts† see Figure External Interrupt TimingEXTINT, NMI Timing requirements for McBSP†‡ see Figure Multichannel Buffered Serial Port Timing Parameter Clkx Clks ClkrFSR int Bitn-1 Master Slave Unit MIN MAX Timing requirements for FSR when Gsync = 1 see FigureClks FSR external CLKR/X no need to resync CLKR/X needs resync Clkx FSX Parameter MASTER§ Slave Unit MIN MAXBit Bitn-1 McBSP Timing as SPI Master or Slave Clkstp = 11b, Clkxp = Multichannel Buffered Serial Port Timing McBSP Timing as SPI Master or Slave Clkstp = 10b, Clkxp = McBSP Timing as SPI Master or Slave Clkstp = 11b, Clkxp = Timing requirements for timer inputs† Timer TimingTINPx TOUTx Timing requirements for Gpio inputs†‡ GENERAL-PURPOSE INPUT/OUTPUT Gpio Port TimingGPIx GPOx Timing requirements for Jtag test port see Figure Jtag TEST-PORT TimingUnit MIN MAX TCK TDO TDI/TMS/TRST Mechanical Data Package thermal resistance characteristicsThermal resistance characteristics S-PBGA package for GDP Thermal resistance characteristics S-PBGA package for ZDP Qty Orderable Device Status Package Pins Package Eco PlanPackaging Information MSL Peak Temp Seating Plane 4204396/A 04/02 GDP S-PBGA-N272 Seating Plane 4204398/A 04/02 ZDP S-PBGA-N272 Important Notice

SPRS293A − OCTOBER 2005 − REVISED NOVEMBER 2005

SYNCHRONOUS DRAM TIMING (CONTINUED)

DEAC

ECLKOUT

CE[3:0]

BE[1:0]

EA[21:13]

EA[11:2]

EA12

ED[15:0]

AOE/SDRAS/SSOE†

Figure 34. SDRAM DEAC Command

REFR

ECLKOUT

CE[3:0]

BE[1:0]

EA[21:2]

EA12

ED[15:0]

AOE/SDRAS/SSOE†

Figure 35. SDRAM REFR Command

TMS320C6712D specifications