SPRS293A − OCTOBER 2005 − REVISED NOVEMBER 2005
device and development-support tool nomenclature (continued)
TMS 320 C 6712D GDP ( ) 150
PREFIX
TMX = Experimental device TMP = Prototype device TMS = Qualified device SMJ =
DEVICE FAMILY
32 or 320 = TMS320 DSP family
TECHNOLOGY
C = CMOS
DEVICE
C6712D
|
| DEVICE SPEED RANGE |
|
| 150 MHz |
TEMPERATURE RANGE (DEFAULT: 0°C TO 90°C) | ||
Blank = | 0°C to 90°C, commercial temperature | |
A | = | −40 °C to 105°C, extended temperature |
PACKAGE TYPE†‡§
GDP =
ZDP =
†BGA = Ball Grid Array
QFP = Quad Flatpack
‡The ZDP mechanical package designator represents the version of the GDP with Pb−Free soldered balls. The ZDP package devices ar e supported in the same speed grades as the GDP package devices (available upon request).
§For actual device part numbers (P/Ns) and ordering information, see the Mechanical Data section of this document or the TI website (www.ti.com).
Figure 5. TMS320C6000 DSP Platform Device Nomenclature (Including the TMS320C6712D Device)
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