Intel 830 manual Introduction

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Introduction

1Introduction

The Intel® Pentium® D processor extends Intel's Desktop dual-core product line. The Pentium D processor uses Flip-Chip Land Grid Array (FC-LGA4) package technology, and plugs into a 775- land LGA socket, referred to as the LGA775 socket. The Pentium D processor, like the Intel® Pentium 4 processor in the 775-land package, utilizes the Intel NetBurst® microarchitecture and maintains the tradition of compatibility with IA-32 software.

The Intel® Pentium® D processor supports Intel® Extended Memory 64 Technology (Intel® EM64T)Φ as an enhancement to Intel's IA-32 architecture, on server and workstation platforms. This enhancement enables the processor to execute operating systems and applications written to take advantage of Intel EM64T. Further details on the 64-bit extension architecture and programming model can be found in the Intel® 64-bit Extension Technology Software Developer's Guide at http://developer.intel.com/technology/64bitextensions/.

Note: In this document the Pentium D processor 800 sequence is also referred to as the Pentium D processor or simply as the processor.

The Pentium D processor functions as two physical processors in one package. This allows a duplication of execution resources to provide increased system responsiveness in multitasking environments, and headroom for next generation multithreaded applications and new usages.

The Pentium D processor supports all the existing Streaming SIMD Extensions 2 (SSE2) and Streaming SIMD Extensions 3 (SSE3). Streaming SIMD Extensions 3 (SSE3) are 13 additional instructions that further extend the capabilities of Intel processor technology. These new instructions enhance the performance of optimized applications for the digital home such as video, image processing, and media compression technology.

The processor’s Intel NetBurst microarchitecture FSB uses a split-transaction, deferred reply protocol like the Intel Pentium 4 processor. The Intel NetBurst microarchitecture FSB uses Source- Synchronous Transfer (SST) of address and data to improve performance by transferring data four times per bus clock (4X data transfer rate, as in AGP 4X). Along with the 4X data bus, the address bus can deliver addresses two times per bus clock and is referred to as a "double-clocked" or 2X address bus. Working together, the 4X data bus and 2X address bus provide a data bus bandwidth of up to 6.4 GB/s.

The Pentium D processor includes the Execute Disable Bit capability. This feature, combined with a supported operating system, allows memory to be marked as executable or non-executable. If code attempts to run in non-executable memory the processor raises an error to the operating system. This feature can prevent some classes of viruses or worms that exploit buffer over run vulnerabilities and can thus help improve the overall security of the system. See the Intel® Architecture Software Developer's Manual for more detailed information.

Intel will enable support components for the processor including heatsink, heatsink retention mechanism, and socket. Manufacturability is a high priority; hence, mechanical assembly may be completed from the top of the baseboard and should not require any special tooling.

The processor includes an address bus powerdown capability that removes power from the address and data pins when the FSB is not in use. This feature is always enabled on the processor.

Enhanced Intel SpeedStep® Technology allows trade-offs to be made between performance and power consumptions. This may lower average power consumption (in conjunction with OS support).

Datasheet

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Contents Intel Pentium D Processor 800Δ Sequence DatasheetContents Contents Halt and Enhanced Halt Powerdown States Figures Tables Initial release May Revision HistoryRevision Description Date Contents Intel Pentium D Processor 800 Sequence Features Contents Introduction Processor Packaging Terminology TerminologyReferences ReferencesIntroduction VCC Decoupling Electrical SpecificationsPower and Ground Lands Decoupling GuidelinesFSB Decoupling Voltage IdentificationVID5 VID4 VID3 VID2 VID1 VID0 Voltage Identification DefinitionReserved, Unused, FC and Testhi Signals Absolute Maximum and Minimum Ratings Voltage and Current SpecificationsDC Voltage and Current Specifications Symbol Parameter Min Max UnitVttout ICC Voltage and Current SpecificationsSymbol Parameter Min Typ Max Unit VID072 Icc a Voltage Deviation from VID Setting V 1, 2000 065Icc a 020 040 000 019007 026 013 033Icc a Time duration of V CC overshoot above VID VCC Overshoot SpecificationVCC Overshoot Specifications Magnitude of V CC overshoot above VID 050Die Voltage Validation Signaling SpecificationsFSB Signal Groups Signals Associated Strobe FSB Signal GroupsSignal Group SignalsSignal Reference Voltages 2 GTL+ Asynchronous SignalsSignal Characteristics Symbol Parameter Max Unit FSB DC Specifications10. BSEL20 and VID50 Signal Group DC Specifications 11. GTL+ Signal Group DC Specifications13. GTL+ Asynchronous Signal Group DC Specifications 12. Pwrgood Input and TAP Signal Group DC Specifications16. GTL+ Bus Voltage Definitions 14. Vttpwrgd DC Specifications15. Bootselect and MSID10 DC Specifications Symbol Parameter Min Typ Max UnitsFSB Clock BCLK10 and Processor Clocking Clock SpecificationsFSB Frequency Select Signals 17. Core Frequency to FSB Multiplier Configuration133 MHz Phase Lock Loop PLL and Filter18. BSEL20 Frequency Table for BCLK10 FSB FrequencyPhase Lock Loop PLL Filter Requirements Package Mechanical Drawing Package Mechanical SpecificationsProcessor Package Drawing Package Mechanical Specifications Package Mechanical Specifications Package Handling Guidelines Package Loading SpecificationsProcessor Loading Specifications Processor Component Keep-Out ZonesProcessor Markings Package Insertion SpecificationsProcessor Mass Specification Processor MaterialsProcessor Top-Side Marking Example Intel Pentium D Processor Processor Land Coordinates, Top View Processor Land CoordinatesProcessor Land Assignments Land Listing and Signal DescriptionsLandout Diagram Top View Left Side Landout Diagram Top View Right Side Alphabetical Land Assignments Land Name Signal Buffer Direction TypeDBI0# GTLREF1 VCC AC8 VCC AK8 Vccmb AN5 VSS AA3 VSS AJ4 E11 Power/Other Vssmb AN6 Numerical Land Assignment Land Land Name Signal Buffer Direction TypeReserved ADS# Reserved DEFER# J12 N30 AA1 Vttoutright AD4 VSS AH1 VSS AK2 VSS AN1 VSS Name Type Description Alphabetical Signals ReferenceSignal Description Sheet 1 Request SignalsName Signal Description Sheet 2Data Group Signal Description Sheet 3Bus Signal Data Bus Signals Signal Description Sheet 4 Signal Description Sheet 5 Pwrgood Signal Description Sheet 6RESET# Signal Description Sheet 7 Signal Description Sheet 8 Land Listing and Signal Descriptions Thermal Specifications Thermal Specifications and Design ConsiderationsProcessor Thermal Specifications GHz Processor Thermal SpecificationsMinimum Maximum T C C Thermal Profile for the Pentium D Processor with PRB=1 Power Maximum T CThermal Profile for the Pentium D Processor with PRB=0 PowerThermal Monitor Processor Thermal FeaturesThermal Metrology PROCHOT# Signal On-Demand ModeFORCEPR# Signal Pin Thermal Diode Parameters THERMTRIP# SignalTcontrol and Fan Speed Reduction Thermal DiodeDiode anode Signal Name Land Number Signal DescriptionThermal Diode Interface Thermal Specifications and Design Considerations Power-On Configuration Option Signals FeaturesPower-On Configuration Options Clock Control and Low Power StatesNormal State Halt and Enhanced Halt Powerdown StatesStop-Grant State Enhanced Halt Powerdown StateEnhanced Intel SpeedStep Technology Enhanced Halt Snoop or Halt Snoop State, Grant Snoop StateMechanical Representation of the Boxed Processor Boxed Processor SpecificationsBoxed Processor Cooling Solution Dimensions Mechanical SpecificationsElectrical Requirements Boxed Processor Fan Heatsink WeightFan Heatsink Power Supply Sense frequency Fan Heatsink Power and Signal Specifications+12 V 12 volt fan power supply Description Min Typ Max UnitBoxed Processor Cooling Requirements Thermal SpecificationsBoxed Processor Specifications Fan operates at its highest speed Variable Speed FanBoxed Processor Fan Boxed Processor Fan Speed Boxed Processor Specifications Mechanical Representation of the Boxed Processor Cooling Solution Dimensions Boxed Processor Support and Retention Module SRM Assembly Stack Including the Support and Retention ModuleControl Sense Sense frequencyDatasheet 101 Boxed Processor Boxed Processor Fan Speed Boxed Processor TMA Set PointsDatasheet 103 104 Electrical Considerations Debug Tools SpecificationsLogic Analyzer Interface LAI Mechanical Considerations106

830 specifications

The Intel 830 chipset, introduced in the early 2000s, marked a significant evolution in Intel's chipset architecture for desktop and mobile computing. Known for its support of the Pentium 4 processors, the 830 chipset was tailored for both performance and stability, making it an appealing choice for OEMs and enthusiasts alike.

One of the standout features of the Intel 830 chipset is its support for DDR SDRAM, providing a much-needed boost in memory bandwidth compared to its predecessors. With dual-channel memory support, the chipset could utilize two memory modules simultaneously, which effectively doubled the data transfer rate and enhanced overall system performance. This made the Intel 830 particularly beneficial for applications requiring high memory throughput, such as multimedia processing and gaming.

Another important characteristic of the Intel 830 was its integrated graphics support, featuring Intel's Extreme Graphics technology. This integration allowed for decent graphics performance without the need for a dedicated GPU, making it suitable for budget systems and everyday computing tasks. However, for power users and gaming enthusiasts, the option to incorporate a discrete graphics card remained available through the provided PCI Express x16 slot.

The Intel 830 chipset also boasted advanced I/O capabilities, including support for USB 2.0, which provided faster data transfer rates compared to USB 1.1, and enhanced IDE interfaces for connecting hard drives and optical devices. With its Hyper-Threading technology support, the chipset allowed for improved multitasking efficiency, enabling a single processor to execute multiple threads simultaneously, a feature that was particularly beneficial in server environments and complex computing tasks.

In terms of connectivity, the Intel 830 supported multiple bus interfaces, including PCI Express and AGP, thereby enabling users to expand their systems with various add-on cards. This flexibility contributed to the chipset's longevity in the marketplace, as it catered to a wide range of user needs from light computing to intensive gaming and content creation.

In summary, the Intel 830 chipset combined enhanced memory capabilities, integrated graphics performance, robust I/O features, and flexible expansion options, making it a versatile choice for various computing environments during its time. It played a key role in shaping the landscape of early 2000s computing, paving the way for future advancements in chipset technology. Its legacy continues to influence modern computing architectures, illustrating the lasting impact of Intel’s innovative design principles.
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