Intel 830 manual Mechanical Specifications, Boxed Processor Cooling Solution Dimensions

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Boxed Processor Specifications

7.1Mechanical Specifications

7.1.1Boxed Processor Cooling Solution Dimensions

This section documents the mechanical specifications of the boxed Pentium D processor. The boxed processor will be shipped with an unattached fan heatsink. Figure 7-1shows a mechanical representation of the boxed Pentium D processor.

Clearance is required around the fan heatsink to ensure unimpeded airflow for proper cooling. The physical space requirements and dimensions for the boxed processor with assembled fan heatsink are shown in Figure 7-2(Side View), and Figure 7-3(Top View). The airspace requirements for the boxed processor fan heatsink must also be incorporated into new baseboard and system designs.

Airspace requirements are shown in Figure 7-7and Figure 7-8. Note that some figures have centerlines shown (marked with alphabetic designations) to clarify relative dimensioning.

Figure 7-2. Side View Space Requirements for the Boxed Processor (Applies to all four side views)

3.74

[95.0]

3.2

[81.3]

0.39 [10.0]

0.98

[25.0]

Figure 7-3. Top View Space Requirements for the Boxed Processor

3.74

[95.0]

3.74

[95.0]

NOTES:

1.Diagram does not show the attached hardware for the clip design and is provided only as a mechanical representation.

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Datasheet

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Contents Datasheet Intel Pentium D Processor 800Δ SequenceContents Contents Halt and Enhanced Halt Powerdown States Figures Tables Revision History Revision Description DateInitial release May Contents Intel Pentium D Processor 800 Sequence Features Contents Introduction Terminology Processor Packaging TerminologyReferences ReferencesIntroduction Decoupling Guidelines Electrical SpecificationsPower and Ground Lands VCC DecouplingVoltage Identification FSB DecouplingVoltage Identification Definition VID5 VID4 VID3 VID2 VID1 VID0Reserved, Unused, FC and Testhi Signals Symbol Parameter Min Max Unit Voltage and Current SpecificationsDC Voltage and Current Specifications Absolute Maximum and Minimum RatingsVID Voltage and Current SpecificationsSymbol Parameter Min Typ Max Unit Vttout ICC065 Icc a Voltage Deviation from VID Setting V 1, 2000 072Icc a 013 033 000 019007 026 020 040Icc a Magnitude of V CC overshoot above VID 050 VCC Overshoot SpecificationVCC Overshoot Specifications Time duration of V CC overshoot above VIDSignaling Specifications FSB Signal GroupsDie Voltage Validation Signals FSB Signal GroupsSignal Group Signals Associated Strobe2 GTL+ Asynchronous Signals Signal CharacteristicsSignal Reference Voltages 11. GTL+ Signal Group DC Specifications FSB DC Specifications10. BSEL20 and VID50 Signal Group DC Specifications Symbol Parameter Max Unit12. Pwrgood Input and TAP Signal Group DC Specifications 13. GTL+ Asynchronous Signal Group DC SpecificationsSymbol Parameter Min Typ Max Units 14. Vttpwrgd DC Specifications15. Bootselect and MSID10 DC Specifications 16. GTL+ Bus Voltage Definitions17. Core Frequency to FSB Multiplier Configuration Clock SpecificationsFSB Frequency Select Signals FSB Clock BCLK10 and Processor ClockingFSB Frequency Phase Lock Loop PLL and Filter18. BSEL20 Frequency Table for BCLK10 133 MHzPhase Lock Loop PLL Filter Requirements Package Mechanical Specifications Package Mechanical DrawingProcessor Package Drawing Package Mechanical Specifications Package Mechanical Specifications Processor Component Keep-Out Zones Package Loading SpecificationsProcessor Loading Specifications Package Handling GuidelinesProcessor Materials Package Insertion SpecificationsProcessor Mass Specification Processor MarkingsProcessor Top-Side Marking Example Intel Pentium D Processor Processor Land Coordinates Processor Land Coordinates, Top ViewLand Listing and Signal Descriptions Processor Land AssignmentsLandout Diagram Top View Left Side Landout Diagram Top View Right Side Land Name Signal Buffer Direction Type Alphabetical Land AssignmentsDBI0# GTLREF1 VCC AC8 VCC AK8 Vccmb AN5 VSS AA3 VSS AJ4 E11 Power/Other Vssmb AN6 Land Land Name Signal Buffer Direction Type Numerical Land AssignmentReserved ADS# Reserved DEFER# J12 N30 AA1 Vttoutright AD4 VSS AH1 VSS AK2 VSS AN1 VSS Request Signals Alphabetical Signals ReferenceSignal Description Sheet 1 Name Type DescriptionSignal Description Sheet 2 NameSignal Description Sheet 3 Bus Signal Data Bus SignalsData Group Signal Description Sheet 4 Signal Description Sheet 5 Signal Description Sheet 6 RESET#Pwrgood Signal Description Sheet 7 Signal Description Sheet 8 Land Listing and Signal Descriptions Thermal Specifications and Design Considerations Processor Thermal SpecificationsThermal Specifications Processor Thermal Specifications Minimum Maximum T C CGHz Power Maximum T C Thermal Profile for the Pentium D Processor with PRB=1Power Thermal Profile for the Pentium D Processor with PRB=0Processor Thermal Features Thermal MetrologyThermal Monitor On-Demand Mode PROCHOT# SignalFORCEPR# Signal Pin Thermal Diode THERMTRIP# SignalTcontrol and Fan Speed Reduction Thermal Diode ParametersSignal Name Land Number Signal Description Thermal Diode InterfaceDiode anode Thermal Specifications and Design Considerations Clock Control and Low Power States FeaturesPower-On Configuration Options Power-On Configuration Option SignalsHalt and Enhanced Halt Powerdown States Normal StateEnhanced Halt Powerdown State Stop-Grant StateEnhanced Halt Snoop or Halt Snoop State, Grant Snoop State Enhanced Intel SpeedStep TechnologyBoxed Processor Specifications Mechanical Representation of the Boxed ProcessorMechanical Specifications Boxed Processor Cooling Solution DimensionsBoxed Processor Fan Heatsink Weight Fan Heatsink Power SupplyElectrical Requirements Description Min Typ Max Unit Fan Heatsink Power and Signal Specifications+12 V 12 volt fan power supply Sense frequencyThermal Specifications Boxed Processor Cooling RequirementsBoxed Processor Specifications Variable Speed Fan Boxed Processor Fan Boxed Processor Fan SpeedFan operates at its highest speed Boxed Processor Specifications Mechanical Representation of the Boxed Processor Cooling Solution Dimensions Assembly Stack Including the Support and Retention Module Boxed Processor Support and Retention Module SRMSense Sense frequency ControlDatasheet 101 Boxed Processor TMA Set Points Boxed Processor Boxed Processor Fan SpeedDatasheet 103 104 Mechanical Considerations Debug Tools SpecificationsLogic Analyzer Interface LAI Electrical Considerations106

830 specifications

The Intel 830 chipset, introduced in the early 2000s, marked a significant evolution in Intel's chipset architecture for desktop and mobile computing. Known for its support of the Pentium 4 processors, the 830 chipset was tailored for both performance and stability, making it an appealing choice for OEMs and enthusiasts alike.

One of the standout features of the Intel 830 chipset is its support for DDR SDRAM, providing a much-needed boost in memory bandwidth compared to its predecessors. With dual-channel memory support, the chipset could utilize two memory modules simultaneously, which effectively doubled the data transfer rate and enhanced overall system performance. This made the Intel 830 particularly beneficial for applications requiring high memory throughput, such as multimedia processing and gaming.

Another important characteristic of the Intel 830 was its integrated graphics support, featuring Intel's Extreme Graphics technology. This integration allowed for decent graphics performance without the need for a dedicated GPU, making it suitable for budget systems and everyday computing tasks. However, for power users and gaming enthusiasts, the option to incorporate a discrete graphics card remained available through the provided PCI Express x16 slot.

The Intel 830 chipset also boasted advanced I/O capabilities, including support for USB 2.0, which provided faster data transfer rates compared to USB 1.1, and enhanced IDE interfaces for connecting hard drives and optical devices. With its Hyper-Threading technology support, the chipset allowed for improved multitasking efficiency, enabling a single processor to execute multiple threads simultaneously, a feature that was particularly beneficial in server environments and complex computing tasks.

In terms of connectivity, the Intel 830 supported multiple bus interfaces, including PCI Express and AGP, thereby enabling users to expand their systems with various add-on cards. This flexibility contributed to the chipset's longevity in the marketplace, as it catered to a wide range of user needs from light computing to intensive gaming and content creation.

In summary, the Intel 830 chipset combined enhanced memory capabilities, integrated graphics performance, robust I/O features, and flexible expansion options, making it a versatile choice for various computing environments during its time. It played a key role in shaping the landscape of early 2000s computing, paving the way for future advancements in chipset technology. Its legacy continues to influence modern computing architectures, illustrating the lasting impact of Intel’s innovative design principles.
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