Intel 830 manual Vccmb AN5

Page 51

Land Listing and Signal Descriptions

Table 4-1. Alphabetical Land

Assignments

Land Name

Land

Signal Buffer

Direction

#

Type

 

 

 

 

 

 

VCC

K30

Power/Other

 

 

 

 

 

VCC

K8

Power/Other

 

 

 

 

 

VCC

L8

Power/Other

 

 

 

 

 

VCC

M23

Power/Other

 

 

 

 

 

VCC

M24

Power/Other

 

 

 

 

 

VCC

M25

Power/Other

 

 

 

 

 

VCC

M26

Power/Other

 

 

 

 

 

VCC

M27

Power/Other

 

 

 

 

 

VCC

M28

Power/Other

 

 

 

 

 

VCC

M29

Power/Other

 

 

 

 

 

VCC

M30

Power/Other

 

 

 

 

 

VCC

M8

Power/Other

 

 

 

 

 

VCC

N23

Power/Other

 

 

 

 

 

VCC

N24

Power/Other

 

 

 

 

 

VCC

N25

Power/Other

 

 

 

 

 

VCC

N26

Power/Other

 

 

 

 

 

VCC

N27

Power/Other

 

 

 

 

 

VCC

N28

Power/Other

 

 

 

 

 

VCC

N29

Power/Other

 

 

 

 

 

VCC

N30

Power/Other

 

 

 

 

 

VCC

N8

Power/Other

 

 

 

 

 

VCC

P8

Power/Other

 

 

 

 

 

VCC

R8

Power/Other

 

 

 

 

 

VCC

T23

Power/Other

 

 

 

 

 

VCC

T24

Power/Other

 

 

 

 

 

VCC

T25

Power/Other

 

 

 

 

 

VCC

T26

Power/Other

 

 

 

 

 

VCC

T27

Power/Other

 

 

 

 

 

VCC

T28

Power/Other

 

 

 

 

 

VCC

T29

Power/Other

 

 

 

 

 

VCC

T30

Power/Other

 

 

 

 

 

VCC

T8

Power/Other

 

 

 

 

 

VCC

U23

Power/Other

 

 

 

 

 

VCC

U24

Power/Other

 

 

 

 

 

VCC

U25

Power/Other

 

 

 

 

 

VCC

U26

Power/Other

 

 

 

 

 

VCC

U27

Power/Other

 

 

 

 

 

VCC

U28

Power/Other

 

 

 

 

 

VCC

U29

Power/Other

 

 

 

 

 

VCC

U30

Power/Other

 

 

 

 

 

Table 4-1. Alphabetical Land

Assignments

Land Name

Land

Signal Buffer

Direction

#

Type

 

 

 

 

 

 

VCC

U8

Power/Other

 

 

 

 

 

VCC

V8

Power/Other

 

 

 

 

 

VCC

W23

Power/Other

 

 

 

 

 

VCC

W24

Power/Other

 

 

 

 

 

VCC

W25

Power/Other

 

 

 

 

 

VCC

W26

Power/Other

 

 

 

 

 

VCC

W27

Power/Other

 

 

 

 

 

VCC

W28

Power/Other

 

 

 

 

 

VCC

W29

Power/Other

 

 

 

 

 

VCC

W30

Power/Other

 

 

 

 

 

VCC

W8

Power/Other

 

 

 

 

 

VCC

Y23

Power/Other

 

 

 

 

 

VCC

Y24

Power/Other

 

 

 

 

 

VCC

Y25

Power/Other

 

 

 

 

 

VCC

Y26

Power/Other

 

 

 

 

 

VCC

Y27

Power/Other

 

 

 

 

 

VCC

Y28

Power/Other

 

 

 

 

 

VCC

Y29

Power/Other

 

 

 

 

 

VCC

Y30

Power/Other

 

 

 

 

 

VCC

Y8

Power/Other

 

 

 

 

 

VCC_MB_

AN5

Power/Other

Output

REGULATION

 

 

 

 

 

 

 

VCC_SENSE

AN3

Power/Other

Output

 

 

 

 

VCCA

A23

Power/Other

 

 

 

 

 

VCCIOPLL

C23

Power/Other

 

 

 

 

 

VCCPLL

D23

Power/Other

Input

 

 

 

 

VID0

AM2

Power/Other

Output

 

 

 

 

VID1

AL5

Power/Other

Output

 

 

 

 

VID2

AM3

Power/Other

Output

 

 

 

 

VID3

AL6

Power/Other

Output

 

 

 

 

VID4

AK4

Power/Other

Output

 

 

 

 

VID5

AL4

Power/Other

Output

 

 

 

 

VSS

A12

Power/Other

 

 

 

 

 

VSS

A15

Power/Other

 

 

 

 

 

VSS

A18

Power/Other

 

 

 

 

 

VSS

A2

Power/Other

 

 

 

 

 

VSS

A21

Power/Other

 

 

 

 

 

VSS

A24

Power/Other

 

 

 

 

 

VSS

A6

Power/Other

 

 

 

 

 

VSS

A9

Power/Other

 

 

 

 

 

VSS

AA23

Power/Other

 

 

 

 

 

Datasheet

51

Image 51
Contents Intel Pentium D Processor 800Δ Sequence DatasheetContents Contents Halt and Enhanced Halt Powerdown States Figures Tables Revision History Revision Description DateInitial release May Contents Intel Pentium D Processor 800 Sequence Features Contents Introduction Processor Packaging Terminology TerminologyReferences ReferencesIntroduction VCC Decoupling Electrical SpecificationsPower and Ground Lands Decoupling GuidelinesFSB Decoupling Voltage IdentificationVID5 VID4 VID3 VID2 VID1 VID0 Voltage Identification DefinitionReserved, Unused, FC and Testhi Signals Absolute Maximum and Minimum Ratings Voltage and Current SpecificationsDC Voltage and Current Specifications Symbol Parameter Min Max UnitVttout ICC Voltage and Current SpecificationsSymbol Parameter Min Typ Max Unit VID072 Icc a Voltage Deviation from VID Setting V 1, 2000 065Icc a 020 040 000 019007 026 013 033Icc a Time duration of V CC overshoot above VID VCC Overshoot SpecificationVCC Overshoot Specifications Magnitude of V CC overshoot above VID 050Signaling Specifications FSB Signal GroupsDie Voltage Validation Signals Associated Strobe FSB Signal GroupsSignal Group Signals2 GTL+ Asynchronous Signals Signal CharacteristicsSignal Reference Voltages Symbol Parameter Max Unit FSB DC Specifications10. BSEL20 and VID50 Signal Group DC Specifications 11. GTL+ Signal Group DC Specifications13. GTL+ Asynchronous Signal Group DC Specifications 12. Pwrgood Input and TAP Signal Group DC Specifications16. GTL+ Bus Voltage Definitions 14. Vttpwrgd DC Specifications15. Bootselect and MSID10 DC Specifications Symbol Parameter Min Typ Max UnitsFSB Clock BCLK10 and Processor Clocking Clock SpecificationsFSB Frequency Select Signals 17. Core Frequency to FSB Multiplier Configuration133 MHz Phase Lock Loop PLL and Filter18. BSEL20 Frequency Table for BCLK10 FSB FrequencyPhase Lock Loop PLL Filter Requirements Package Mechanical Drawing Package Mechanical SpecificationsProcessor Package Drawing Package Mechanical Specifications Package Mechanical Specifications Package Handling Guidelines Package Loading SpecificationsProcessor Loading Specifications Processor Component Keep-Out ZonesProcessor Markings Package Insertion SpecificationsProcessor Mass Specification Processor MaterialsProcessor Top-Side Marking Example Intel Pentium D Processor Processor Land Coordinates, Top View Processor Land CoordinatesProcessor Land Assignments Land Listing and Signal DescriptionsLandout Diagram Top View Left Side Landout Diagram Top View Right Side Alphabetical Land Assignments Land Name Signal Buffer Direction TypeDBI0# GTLREF1 VCC AC8 VCC AK8 Vccmb AN5 VSS AA3 VSS AJ4 E11 Power/Other Vssmb AN6 Numerical Land Assignment Land Land Name Signal Buffer Direction TypeReserved ADS# Reserved DEFER# J12 N30 AA1 Vttoutright AD4 VSS AH1 VSS AK2 VSS AN1 VSS Name Type Description Alphabetical Signals ReferenceSignal Description Sheet 1 Request SignalsName Signal Description Sheet 2Signal Description Sheet 3 Bus Signal Data Bus SignalsData Group Signal Description Sheet 4 Signal Description Sheet 5 Signal Description Sheet 6 RESET#Pwrgood Signal Description Sheet 7 Signal Description Sheet 8 Land Listing and Signal Descriptions Thermal Specifications and Design Considerations Processor Thermal SpecificationsThermal Specifications Processor Thermal Specifications Minimum Maximum T C CGHz Thermal Profile for the Pentium D Processor with PRB=1 Power Maximum T CThermal Profile for the Pentium D Processor with PRB=0 PowerProcessor Thermal Features Thermal MetrologyThermal Monitor PROCHOT# Signal On-Demand ModeFORCEPR# Signal Pin Thermal Diode Parameters THERMTRIP# SignalTcontrol and Fan Speed Reduction Thermal DiodeSignal Name Land Number Signal Description Thermal Diode InterfaceDiode anode Thermal Specifications and Design Considerations Power-On Configuration Option Signals FeaturesPower-On Configuration Options Clock Control and Low Power StatesNormal State Halt and Enhanced Halt Powerdown StatesStop-Grant State Enhanced Halt Powerdown StateEnhanced Intel SpeedStep Technology Enhanced Halt Snoop or Halt Snoop State, Grant Snoop StateMechanical Representation of the Boxed Processor Boxed Processor SpecificationsBoxed Processor Cooling Solution Dimensions Mechanical SpecificationsBoxed Processor Fan Heatsink Weight Fan Heatsink Power SupplyElectrical Requirements Sense frequency Fan Heatsink Power and Signal Specifications+12 V 12 volt fan power supply Description Min Typ Max UnitBoxed Processor Cooling Requirements Thermal SpecificationsBoxed Processor Specifications Variable Speed Fan Boxed Processor Fan Boxed Processor Fan SpeedFan operates at its highest speed Boxed Processor Specifications Mechanical Representation of the Boxed Processor Cooling Solution Dimensions Boxed Processor Support and Retention Module SRM Assembly Stack Including the Support and Retention ModuleControl Sense Sense frequencyDatasheet 101 Boxed Processor Boxed Processor Fan Speed Boxed Processor TMA Set PointsDatasheet 103 104 Electrical Considerations Debug Tools SpecificationsLogic Analyzer Interface LAI Mechanical Considerations106

830 specifications

The Intel 830 chipset, introduced in the early 2000s, marked a significant evolution in Intel's chipset architecture for desktop and mobile computing. Known for its support of the Pentium 4 processors, the 830 chipset was tailored for both performance and stability, making it an appealing choice for OEMs and enthusiasts alike.

One of the standout features of the Intel 830 chipset is its support for DDR SDRAM, providing a much-needed boost in memory bandwidth compared to its predecessors. With dual-channel memory support, the chipset could utilize two memory modules simultaneously, which effectively doubled the data transfer rate and enhanced overall system performance. This made the Intel 830 particularly beneficial for applications requiring high memory throughput, such as multimedia processing and gaming.

Another important characteristic of the Intel 830 was its integrated graphics support, featuring Intel's Extreme Graphics technology. This integration allowed for decent graphics performance without the need for a dedicated GPU, making it suitable for budget systems and everyday computing tasks. However, for power users and gaming enthusiasts, the option to incorporate a discrete graphics card remained available through the provided PCI Express x16 slot.

The Intel 830 chipset also boasted advanced I/O capabilities, including support for USB 2.0, which provided faster data transfer rates compared to USB 1.1, and enhanced IDE interfaces for connecting hard drives and optical devices. With its Hyper-Threading technology support, the chipset allowed for improved multitasking efficiency, enabling a single processor to execute multiple threads simultaneously, a feature that was particularly beneficial in server environments and complex computing tasks.

In terms of connectivity, the Intel 830 supported multiple bus interfaces, including PCI Express and AGP, thereby enabling users to expand their systems with various add-on cards. This flexibility contributed to the chipset's longevity in the marketplace, as it catered to a wide range of user needs from light computing to intensive gaming and content creation.

In summary, the Intel 830 chipset combined enhanced memory capabilities, integrated graphics performance, robust I/O features, and flexible expansion options, making it a versatile choice for various computing environments during its time. It played a key role in shaping the landscape of early 2000s computing, paving the way for future advancements in chipset technology. Its legacy continues to influence modern computing architectures, illustrating the lasting impact of Intel’s innovative design principles.