Intel 830 manual On-Demand Mode, PROCHOT# Signal

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Thermal Specifications and Design Considerations

With a properly designed and characterized thermal solution, it is anticipated that the TCC would only be activated for very short periods of time when running the most power intensive applications. The processor performance impact due to these brief periods of TCC activation is expected to be so minor that it would be immeasurable. An under-designed thermal solution that is not able to prevent excessive activation of the TCC in the anticipated ambient environment may cause a noticeable performance loss, and in some cases may result in a TC that exceeds the specified maximum temperature and may affect the long-term reliability of the processor. In addition, a thermal solution that is significantly under-designed may not be capable of cooling the processor even when the TCC is active continuously. Refer to the Intel® Pentium® D Processor and Intel® Pentium® Processor Extreme Edition 840 Thermal and Mechanical Design Guidelines for information on designing a thermal solution.

The duty cycle for the TCC, when activated by the Thermal Monitor, is factory configured and cannot be modified. The Thermal Monitor does not require any additional hardware, software drivers, or interrupt handling routines.

5.2.2On-Demand Mode

The Pentium D processor provides an auxiliary mechanism that allows system software to force the processor to reduce its power consumption. This mechanism is referred to as "On-Demand" mode and is distinct from the Thermal Monitor feature. On-Demand mode is intended as a means to reduce system level power consumption. Systems using the Pentium D processor must not rely on software usage of this mechanism to limit the processor temperature.

If bit 4 of the ACPI P_CNT Control Register (located in the processor IA32_THERM_CONTROL MSR) is written to a '1', the processor will immediately reduce its power consumption via modulation (starting and stopping) of the internal core clock, independent of the processor temperature. When using On-Demand mode, the duty cycle of the clock modulation is programmable via bits 3:1 of the same ACPI P_CNT Control Register. In On-Demand mode, the duty cycle can be programmed from 12.5% on/ 87.5% off, to 87.5% on/12.5% off in 12.5% increments. On-Demand mode may be used in conjunction with the Thermal Monitor. If the system tries to enable On-Demand mode at the same time the TCC is engaged, the factory configured duty cycle of the TCC will override the duty cycle selected by the On-Demand mode.

5.2.3PROCHOT# Signal

An external signal, PROCHOT# (processor hot), is asserted when the processor core temperature has reached its maximum operating temperature. If the Thermal Monitor is enabled (note that the Thermal Monitor must be enabled for the processor to be operating within specification), the TCC will be active when PROCHOT# is asserted. The processor can be configured to generate an interrupt upon the assertion or de-assertion of PROCHOT#. Refer to the Intel Architecture Software Developer's Manuals for specific register and programming details.

For the Pentium D processor, PROCHOT# can be configured via BIOS as an output or a bi- directional signal. As an output, PROCHOT# (Processor Hot) will go active when the processor temperature monitoring sensor detects that one or both cores has reached its maximum safe operating temperature. This indicates that the processor Thermal Control Circuit (TCC) has been activated, if enabled. As an input, assertion of PROCHOT# by the system will activate the TCC, if enabled, for both cores. The TCC will remain active until the system de-asserts PROCHOT#.

If PROCHOT# is configured as an output only, the FORCEPR# signal can be driven from an external source to activate the TCC. This will prevent one core from asserting the PROCHOT# signal of the other core and unnecessarily activating the TCC of that core. Refer to Section 5.2.4 for details on the FORCEPR# signal.

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Datasheet

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Contents Datasheet Intel Pentium D Processor 800Δ SequenceContents Contents Halt and Enhanced Halt Powerdown States Figures Tables Initial release May Revision HistoryRevision Description Date Contents Intel Pentium D Processor 800 Sequence Features Contents Introduction Terminology Processor Packaging TerminologyReferences ReferencesIntroduction Electrical Specifications Power and Ground LandsDecoupling Guidelines VCC DecouplingVoltage Identification FSB DecouplingVoltage Identification Definition VID5 VID4 VID3 VID2 VID1 VID0Reserved, Unused, FC and Testhi Signals Voltage and Current Specifications DC Voltage and Current SpecificationsSymbol Parameter Min Max Unit Absolute Maximum and Minimum RatingsVoltage and Current Specifications Symbol Parameter Min Typ Max UnitVID Vttout ICCIcc a Voltage Deviation from VID Setting V 1, 2 000065 072Icc a 000 019 007 026013 033 020 040Icc a VCC Overshoot Specification VCC Overshoot SpecificationsMagnitude of V CC overshoot above VID 050 Time duration of V CC overshoot above VIDDie Voltage Validation Signaling SpecificationsFSB Signal Groups FSB Signal Groups Signal GroupSignals Signals Associated StrobeSignal Reference Voltages 2 GTL+ Asynchronous SignalsSignal Characteristics FSB DC Specifications 10. BSEL20 and VID50 Signal Group DC Specifications11. GTL+ Signal Group DC Specifications Symbol Parameter Max Unit12. Pwrgood Input and TAP Signal Group DC Specifications 13. GTL+ Asynchronous Signal Group DC Specifications14. Vttpwrgd DC Specifications 15. Bootselect and MSID10 DC SpecificationsSymbol Parameter Min Typ Max Units 16. GTL+ Bus Voltage DefinitionsClock Specifications FSB Frequency Select Signals17. Core Frequency to FSB Multiplier Configuration FSB Clock BCLK10 and Processor ClockingPhase Lock Loop PLL and Filter 18. BSEL20 Frequency Table for BCLK10FSB Frequency 133 MHzPhase Lock Loop PLL Filter Requirements Package Mechanical Specifications Package Mechanical DrawingProcessor Package Drawing Package Mechanical Specifications Package Mechanical Specifications Package Loading Specifications Processor Loading SpecificationsProcessor Component Keep-Out Zones Package Handling GuidelinesPackage Insertion Specifications Processor Mass SpecificationProcessor Materials Processor MarkingsProcessor Top-Side Marking Example Intel Pentium D Processor Processor Land Coordinates Processor Land Coordinates, Top ViewLand Listing and Signal Descriptions Processor Land AssignmentsLandout Diagram Top View Left Side Landout Diagram Top View Right Side Land Name Signal Buffer Direction Type Alphabetical Land AssignmentsDBI0# GTLREF1 VCC AC8 VCC AK8 Vccmb AN5 VSS AA3 VSS AJ4 E11 Power/Other Vssmb AN6 Land Land Name Signal Buffer Direction Type Numerical Land AssignmentReserved ADS# Reserved DEFER# J12 N30 AA1 Vttoutright AD4 VSS AH1 VSS AK2 VSS AN1 VSS Alphabetical Signals Reference Signal Description Sheet 1Request Signals Name Type DescriptionSignal Description Sheet 2 NameData Group Signal Description Sheet 3Bus Signal Data Bus Signals Signal Description Sheet 4 Signal Description Sheet 5 Pwrgood Signal Description Sheet 6RESET# Signal Description Sheet 7 Signal Description Sheet 8 Land Listing and Signal Descriptions Thermal Specifications Thermal Specifications and Design ConsiderationsProcessor Thermal Specifications GHz Processor Thermal SpecificationsMinimum Maximum T C C Power Maximum T C Thermal Profile for the Pentium D Processor with PRB=1Power Thermal Profile for the Pentium D Processor with PRB=0Thermal Monitor Processor Thermal FeaturesThermal Metrology On-Demand Mode PROCHOT# SignalFORCEPR# Signal Pin THERMTRIP# Signal Tcontrol and Fan Speed ReductionThermal Diode Thermal Diode ParametersDiode anode Signal Name Land Number Signal DescriptionThermal Diode Interface Thermal Specifications and Design Considerations Features Power-On Configuration OptionsClock Control and Low Power States Power-On Configuration Option SignalsHalt and Enhanced Halt Powerdown States Normal StateEnhanced Halt Powerdown State Stop-Grant StateEnhanced Halt Snoop or Halt Snoop State, Grant Snoop State Enhanced Intel SpeedStep TechnologyBoxed Processor Specifications Mechanical Representation of the Boxed ProcessorMechanical Specifications Boxed Processor Cooling Solution DimensionsElectrical Requirements Boxed Processor Fan Heatsink WeightFan Heatsink Power Supply Fan Heatsink Power and Signal Specifications +12 V 12 volt fan power supplyDescription Min Typ Max Unit Sense frequencyThermal Specifications Boxed Processor Cooling RequirementsBoxed Processor Specifications Fan operates at its highest speed Variable Speed FanBoxed Processor Fan Boxed Processor Fan Speed Boxed Processor Specifications Mechanical Representation of the Boxed Processor Cooling Solution Dimensions Assembly Stack Including the Support and Retention Module Boxed Processor Support and Retention Module SRMSense Sense frequency ControlDatasheet 101 Boxed Processor TMA Set Points Boxed Processor Boxed Processor Fan SpeedDatasheet 103 104 Debug Tools Specifications Logic Analyzer Interface LAIMechanical Considerations Electrical Considerations106

830 specifications

The Intel 830 chipset, introduced in the early 2000s, marked a significant evolution in Intel's chipset architecture for desktop and mobile computing. Known for its support of the Pentium 4 processors, the 830 chipset was tailored for both performance and stability, making it an appealing choice for OEMs and enthusiasts alike.

One of the standout features of the Intel 830 chipset is its support for DDR SDRAM, providing a much-needed boost in memory bandwidth compared to its predecessors. With dual-channel memory support, the chipset could utilize two memory modules simultaneously, which effectively doubled the data transfer rate and enhanced overall system performance. This made the Intel 830 particularly beneficial for applications requiring high memory throughput, such as multimedia processing and gaming.

Another important characteristic of the Intel 830 was its integrated graphics support, featuring Intel's Extreme Graphics technology. This integration allowed for decent graphics performance without the need for a dedicated GPU, making it suitable for budget systems and everyday computing tasks. However, for power users and gaming enthusiasts, the option to incorporate a discrete graphics card remained available through the provided PCI Express x16 slot.

The Intel 830 chipset also boasted advanced I/O capabilities, including support for USB 2.0, which provided faster data transfer rates compared to USB 1.1, and enhanced IDE interfaces for connecting hard drives and optical devices. With its Hyper-Threading technology support, the chipset allowed for improved multitasking efficiency, enabling a single processor to execute multiple threads simultaneously, a feature that was particularly beneficial in server environments and complex computing tasks.

In terms of connectivity, the Intel 830 supported multiple bus interfaces, including PCI Express and AGP, thereby enabling users to expand their systems with various add-on cards. This flexibility contributed to the chipset's longevity in the marketplace, as it catered to a wide range of user needs from light computing to intensive gaming and content creation.

In summary, the Intel 830 chipset combined enhanced memory capabilities, integrated graphics performance, robust I/O features, and flexible expansion options, making it a versatile choice for various computing environments during its time. It played a key role in shaping the landscape of early 2000s computing, paving the way for future advancements in chipset technology. Its legacy continues to influence modern computing architectures, illustrating the lasting impact of Intel’s innovative design principles.
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