Intel 830 Thermal Specifications and Design Considerations, Processor Thermal Specifications

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Thermal Specifications and Design Considerations

5Thermal Specifications and Design Considerations

5.1Processor Thermal Specifications

The Intel® Pentium® D processor requires a thermal solution to maintain temperatures within operating limits as set forth in Section 5.1.1. Any attempt to operate the processor outside these operating limits may result in permanent damage to the processor and potentially other components within the system. As processor technology changes, thermal management becomes increasingly crucial when building computer systems. Maintaining the proper thermal environment is key to reliable, long-term system operation.

A complete thermal solution includes both component and system level thermal management features. Component level thermal solutions can include active or passive heatsinks attached to the processor Integrated Heat Spreader (IHS). Typical system level thermal solutions may consist of system fans combined with ducting and venting.

For more information on designing a component level thermal solution, refer to the Intel® Pentium® D Processor and Intel® Pentium® Processor Extreme Edition 840 Thermal and Mechanical Design Guidelines.

Note: The boxed processor will ship with a component thermal solution. Refer to Chapter 7 for details on the boxed processor.

5.1.1Thermal Specifications

To allow for the optimal operation and long-term reliability of Intel processor-based systems, the system/processor thermal solution should be designed such that the processor remains within the minimum and maximum case temperature (TC) specifications when operating at or below the Thermal Design Power (TDP) value listed per frequency in Table 5-1. Thermal solutions not designed to provide this level of thermal capability may affect the long-term reliability of the processor and system. For more details on thermal solution design, refer to the appropriate processor thermal design guidelines.

The Pentium D processor has a methodology for managing processor temperatures that is intended to support acoustic noise reduction through fan speed control. Selection of the appropriate fan speed will be based on the temperature reported by the processor’s Thermal Diode. If the diode temperature is greater than or equal to TCONTROL, then the processor case temperature must remain at or below the temperature as specified by the thermal profile. If the diode temperature is less than TCONTROL, then the case temperature is permitted to exceed the thermal profile, but the diode temperature must remain at or below TCONTROL. Systems that implement fan speed control must be designed to take these conditions into account. Systems that do not alter the fan speed only need to ensure the case temperature meets the thermal profile specifications.

To determine a processor's case temperature specification based on the thermal profile, it is necessary to accurately measure processor power dissipation. Intel has developed a methodology for accurate power measurement that correlates to Intel test temperature and voltage conditions.

Datasheet

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Contents Intel Pentium D Processor 800Δ Sequence DatasheetContents Contents Halt and Enhanced Halt Powerdown States Figures Tables Revision History Revision Description DateInitial release May Contents Intel Pentium D Processor 800 Sequence Features Contents Introduction Processor Packaging Terminology TerminologyReferences ReferencesIntroduction VCC Decoupling Electrical SpecificationsPower and Ground Lands Decoupling GuidelinesFSB Decoupling Voltage IdentificationVID5 VID4 VID3 VID2 VID1 VID0 Voltage Identification DefinitionReserved, Unused, FC and Testhi Signals Absolute Maximum and Minimum Ratings Voltage and Current SpecificationsDC Voltage and Current Specifications Symbol Parameter Min Max UnitVttout ICC Voltage and Current SpecificationsSymbol Parameter Min Typ Max Unit VID072 Icc a Voltage Deviation from VID Setting V 1, 2000 065Icc a 020 040 000 019007 026 013 033Icc a Time duration of V CC overshoot above VID VCC Overshoot SpecificationVCC Overshoot Specifications Magnitude of V CC overshoot above VID 050Signaling Specifications FSB Signal GroupsDie Voltage Validation Signals Associated Strobe FSB Signal GroupsSignal Group Signals2 GTL+ Asynchronous Signals Signal CharacteristicsSignal Reference Voltages Symbol Parameter Max Unit FSB DC Specifications10. BSEL20 and VID50 Signal Group DC Specifications 11. GTL+ Signal Group DC Specifications13. GTL+ Asynchronous Signal Group DC Specifications 12. Pwrgood Input and TAP Signal Group DC Specifications16. GTL+ Bus Voltage Definitions 14. Vttpwrgd DC Specifications15. Bootselect and MSID10 DC Specifications Symbol Parameter Min Typ Max UnitsFSB Clock BCLK10 and Processor Clocking Clock SpecificationsFSB Frequency Select Signals 17. Core Frequency to FSB Multiplier Configuration133 MHz Phase Lock Loop PLL and Filter18. BSEL20 Frequency Table for BCLK10 FSB FrequencyPhase Lock Loop PLL Filter Requirements Package Mechanical Drawing Package Mechanical SpecificationsProcessor Package Drawing Package Mechanical Specifications Package Mechanical Specifications Package Handling Guidelines Package Loading SpecificationsProcessor Loading Specifications Processor Component Keep-Out ZonesProcessor Markings Package Insertion SpecificationsProcessor Mass Specification Processor MaterialsProcessor Top-Side Marking Example Intel Pentium D Processor Processor Land Coordinates, Top View Processor Land CoordinatesProcessor Land Assignments Land Listing and Signal DescriptionsLandout Diagram Top View Left Side Landout Diagram Top View Right Side Alphabetical Land Assignments Land Name Signal Buffer Direction TypeDBI0# GTLREF1 VCC AC8 VCC AK8 Vccmb AN5 VSS AA3 VSS AJ4 E11 Power/Other Vssmb AN6 Numerical Land Assignment Land Land Name Signal Buffer Direction TypeReserved ADS# Reserved DEFER# J12 N30 AA1 Vttoutright AD4 VSS AH1 VSS AK2 VSS AN1 VSS Name Type Description Alphabetical Signals ReferenceSignal Description Sheet 1 Request SignalsName Signal Description Sheet 2Signal Description Sheet 3 Bus Signal Data Bus SignalsData Group Signal Description Sheet 4 Signal Description Sheet 5 Signal Description Sheet 6 RESET#Pwrgood Signal Description Sheet 7 Signal Description Sheet 8 Land Listing and Signal Descriptions Thermal Specifications and Design Considerations Processor Thermal SpecificationsThermal Specifications Processor Thermal Specifications Minimum Maximum T C CGHz Thermal Profile for the Pentium D Processor with PRB=1 Power Maximum T CThermal Profile for the Pentium D Processor with PRB=0 PowerProcessor Thermal Features Thermal MetrologyThermal Monitor PROCHOT# Signal On-Demand ModeFORCEPR# Signal Pin Thermal Diode Parameters THERMTRIP# SignalTcontrol and Fan Speed Reduction Thermal DiodeSignal Name Land Number Signal Description Thermal Diode InterfaceDiode anode Thermal Specifications and Design Considerations Power-On Configuration Option Signals FeaturesPower-On Configuration Options Clock Control and Low Power StatesNormal State Halt and Enhanced Halt Powerdown StatesStop-Grant State Enhanced Halt Powerdown StateEnhanced Intel SpeedStep Technology Enhanced Halt Snoop or Halt Snoop State, Grant Snoop StateMechanical Representation of the Boxed Processor Boxed Processor SpecificationsBoxed Processor Cooling Solution Dimensions Mechanical SpecificationsBoxed Processor Fan Heatsink Weight Fan Heatsink Power SupplyElectrical Requirements Sense frequency Fan Heatsink Power and Signal Specifications+12 V 12 volt fan power supply Description Min Typ Max UnitBoxed Processor Cooling Requirements Thermal SpecificationsBoxed Processor Specifications Variable Speed Fan Boxed Processor Fan Boxed Processor Fan SpeedFan operates at its highest speed Boxed Processor Specifications Mechanical Representation of the Boxed Processor Cooling Solution Dimensions Boxed Processor Support and Retention Module SRM Assembly Stack Including the Support and Retention ModuleControl Sense Sense frequencyDatasheet 101 Boxed Processor Boxed Processor Fan Speed Boxed Processor TMA Set PointsDatasheet 103 104 Electrical Considerations Debug Tools SpecificationsLogic Analyzer Interface LAI Mechanical Considerations106

830 specifications

The Intel 830 chipset, introduced in the early 2000s, marked a significant evolution in Intel's chipset architecture for desktop and mobile computing. Known for its support of the Pentium 4 processors, the 830 chipset was tailored for both performance and stability, making it an appealing choice for OEMs and enthusiasts alike.

One of the standout features of the Intel 830 chipset is its support for DDR SDRAM, providing a much-needed boost in memory bandwidth compared to its predecessors. With dual-channel memory support, the chipset could utilize two memory modules simultaneously, which effectively doubled the data transfer rate and enhanced overall system performance. This made the Intel 830 particularly beneficial for applications requiring high memory throughput, such as multimedia processing and gaming.

Another important characteristic of the Intel 830 was its integrated graphics support, featuring Intel's Extreme Graphics technology. This integration allowed for decent graphics performance without the need for a dedicated GPU, making it suitable for budget systems and everyday computing tasks. However, for power users and gaming enthusiasts, the option to incorporate a discrete graphics card remained available through the provided PCI Express x16 slot.

The Intel 830 chipset also boasted advanced I/O capabilities, including support for USB 2.0, which provided faster data transfer rates compared to USB 1.1, and enhanced IDE interfaces for connecting hard drives and optical devices. With its Hyper-Threading technology support, the chipset allowed for improved multitasking efficiency, enabling a single processor to execute multiple threads simultaneously, a feature that was particularly beneficial in server environments and complex computing tasks.

In terms of connectivity, the Intel 830 supported multiple bus interfaces, including PCI Express and AGP, thereby enabling users to expand their systems with various add-on cards. This flexibility contributed to the chipset's longevity in the marketplace, as it catered to a wide range of user needs from light computing to intensive gaming and content creation.

In summary, the Intel 830 chipset combined enhanced memory capabilities, integrated graphics performance, robust I/O features, and flexible expansion options, making it a versatile choice for various computing environments during its time. It played a key role in shaping the landscape of early 2000s computing, paving the way for future advancements in chipset technology. Its legacy continues to influence modern computing architectures, illustrating the lasting impact of Intel’s innovative design principles.
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