Intel 830 manual Signal Description Sheet 7

Page 72

Land Listing and Signal Descriptions

Table 4-3. Signal Description (Sheet 7 of 8)

Name

Type

Description

 

 

 

 

 

RSP# (Response Parity) is driven by the response agent (the agent responsible

 

 

for completion of the current transaction) during assertion of RS[2:0]#, the

 

 

signals for which RSP# provides parity protection. It must connect to the

RSP#

Input

appropriate pins/lands of all processor FSB agents.

A correct parity signal is high if an even number of covered signals are low and

 

 

 

 

low if an odd number of covered signals are low. While RS[2:0]# = 000, RSP# is

 

 

also high, since this indicates it is not being driven by any agent ensuring

 

 

correct parity.

 

 

 

SKTOCC#

Output

SKTOCC# (Socket Occupied) will be pulled to ground by the processor. System

board designers may use this signal to determine if the processor is present.

 

 

 

 

 

 

 

SMI# (System Management Interrupt) is asserted asynchronously by system

 

 

logic. On accepting a System Management Interrupt, the processor saves the

 

 

current state and enters System Management Mode (SMM). An SMI

SMI#

Input

Acknowledge transaction is issued, and the processor begins program

 

 

execution from the SMM handler.

 

 

If SMI# is asserted during the de-assertion of RESET#, the processor will tri-

 

 

state its outputs.

 

 

 

 

 

STPCLK# (Stop Clock), when asserted, causes the processor to enter a low

 

 

power Stop-Grant state. The processor issues a Stop-Grant Acknowledge

 

 

transaction, and stops providing internal clock signals to all processor core units

STPCLK#

Input

except the FSB and APIC units. The processor continues to snoop bus

transactions and service interrupts while in Stop-Grant state. When STPCLK# is

 

 

 

 

de-asserted, the processor restarts its internal clock to all units and resumes

 

 

execution. The assertion of STPCLK# has no effect on the bus clock; STPCLK#

 

 

is an asynchronous input.

 

 

 

TCK

Input

TCK (Test Clock) provides the clock input for the processor Test Bus (also

known as the Test Access Port).

 

 

 

 

 

TDI

Input

TDI (Test Data In) transfers serial test data into the processor. TDI provides the

serial input needed for JTAG specification support.

 

 

 

 

 

TDO

Output

TDO (Test Data Out) transfers serial test data out of the processor. TDO

provides the serial output needed for JTAG specification support.

 

 

 

 

 

 

 

TESTHI[13:0] must be connected to the processor’s appropriate power source

TESTHI[13:0]

Input

(refer to VTT_OUT_LEFT and VTT_OUT_RIGHT signal description) through a

 

 

resistor for proper processor operation. See Section 2.4 for more details.

 

 

 

THERMDA

Other

Thermal Diode Anode. See Section 5.2.7.

 

 

 

THERMDC

Other

Thermal Diode Cathode. See Section 5.2.7.

 

 

 

 

 

In the event of a catastrophic cooling failure, the processor will automatically

 

 

shut down when the silicon has reached a temperature approximately 20 °C

 

 

above the maximum TC. Assertion of THERMTRIP# (Thermal Trip) indicates the

 

 

processor junction temperature has reached a level beyond where permanent

 

 

silicon damage may occur. Upon assertion of THERMTRIP#, the processor will

 

 

shut off its internal clocks (thus, halting program execution) in an attempt to

 

 

reduce the processor junction temperature. To protect the processor, its core

 

 

voltage (VCC) must be removed following the assertion of THERMTRIP#.

THERMTRIP#

Output

Driving of the THERMTRIP# signal is enabled within 10 us of the assertion of

PWRGOOD (provided VTTPWRGD, VTT, and VCC are asserted) and is

 

 

disabled on de-assertion of PWRGOOD (if VTTPWRGD, VTT, or VCC are not

 

 

valid, THERMTRIP# may also be disabled). Once activated, THERMTRIP#

 

 

remains latched until PWRGOOD, VTTPWRGD, VTT or VCC is de-asserted.

 

 

While the de-assertion of the PWRGOOD, VTTPWRGD, VTT or VCC signal will

 

 

de-assert THERMTRIP#, if the processor’s junction temperature remains at or

 

 

above the trip level, THERMTRIP# will again be asserted within 10 us of the

 

 

assertion of PWRGOOD (provided VTTPWRGD, VTT, and VCC are

 

 

asserted).THERMTRIP# should not be sampled until 10 us after PWRGOOD

 

 

assertion.

 

 

 

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Datasheet

Image 72
Contents Datasheet Intel Pentium D Processor 800Δ SequenceContents Contents Halt and Enhanced Halt Powerdown States Figures Tables Revision History Revision Description DateInitial release May Contents Intel Pentium D Processor 800 Sequence Features Contents Introduction Terminology Processor Packaging TerminologyReferences ReferencesIntroduction Electrical Specifications Power and Ground LandsDecoupling Guidelines VCC DecouplingVoltage Identification FSB DecouplingVoltage Identification Definition VID5 VID4 VID3 VID2 VID1 VID0Reserved, Unused, FC and Testhi Signals Voltage and Current Specifications DC Voltage and Current SpecificationsSymbol Parameter Min Max Unit Absolute Maximum and Minimum RatingsVoltage and Current Specifications Symbol Parameter Min Typ Max UnitVID Vttout ICCIcc a Voltage Deviation from VID Setting V 1, 2 000065 072Icc a 000 019 007 026013 033 020 040Icc a VCC Overshoot Specification VCC Overshoot SpecificationsMagnitude of V CC overshoot above VID 050 Time duration of V CC overshoot above VIDSignaling Specifications FSB Signal GroupsDie Voltage Validation FSB Signal Groups Signal GroupSignals Signals Associated Strobe2 GTL+ Asynchronous Signals Signal CharacteristicsSignal Reference Voltages FSB DC Specifications 10. BSEL20 and VID50 Signal Group DC Specifications11. GTL+ Signal Group DC Specifications Symbol Parameter Max Unit12. Pwrgood Input and TAP Signal Group DC Specifications 13. GTL+ Asynchronous Signal Group DC Specifications14. Vttpwrgd DC Specifications 15. Bootselect and MSID10 DC SpecificationsSymbol Parameter Min Typ Max Units 16. GTL+ Bus Voltage DefinitionsClock Specifications FSB Frequency Select Signals17. Core Frequency to FSB Multiplier Configuration FSB Clock BCLK10 and Processor ClockingPhase Lock Loop PLL and Filter 18. BSEL20 Frequency Table for BCLK10FSB Frequency 133 MHzPhase Lock Loop PLL Filter Requirements Package Mechanical Specifications Package Mechanical DrawingProcessor Package Drawing Package Mechanical Specifications Package Mechanical Specifications Package Loading Specifications Processor Loading SpecificationsProcessor Component Keep-Out Zones Package Handling GuidelinesPackage Insertion Specifications Processor Mass SpecificationProcessor Materials Processor MarkingsProcessor Top-Side Marking Example Intel Pentium D Processor Processor Land Coordinates Processor Land Coordinates, Top ViewLand Listing and Signal Descriptions Processor Land AssignmentsLandout Diagram Top View Left Side Landout Diagram Top View Right Side Land Name Signal Buffer Direction Type Alphabetical Land AssignmentsDBI0# GTLREF1 VCC AC8 VCC AK8 Vccmb AN5 VSS AA3 VSS AJ4 E11 Power/Other Vssmb AN6 Land Land Name Signal Buffer Direction Type Numerical Land AssignmentReserved ADS# Reserved DEFER# J12 N30 AA1 Vttoutright AD4 VSS AH1 VSS AK2 VSS AN1 VSS Alphabetical Signals Reference Signal Description Sheet 1Request Signals Name Type DescriptionSignal Description Sheet 2 NameSignal Description Sheet 3 Bus Signal Data Bus SignalsData Group Signal Description Sheet 4 Signal Description Sheet 5 Signal Description Sheet 6 RESET#Pwrgood Signal Description Sheet 7 Signal Description Sheet 8 Land Listing and Signal Descriptions Thermal Specifications and Design Considerations Processor Thermal SpecificationsThermal Specifications Processor Thermal Specifications Minimum Maximum T C CGHz Power Maximum T C Thermal Profile for the Pentium D Processor with PRB=1Power Thermal Profile for the Pentium D Processor with PRB=0Processor Thermal Features Thermal MetrologyThermal Monitor On-Demand Mode PROCHOT# SignalFORCEPR# Signal Pin THERMTRIP# Signal Tcontrol and Fan Speed ReductionThermal Diode Thermal Diode ParametersSignal Name Land Number Signal Description Thermal Diode InterfaceDiode anode Thermal Specifications and Design Considerations Features Power-On Configuration OptionsClock Control and Low Power States Power-On Configuration Option SignalsHalt and Enhanced Halt Powerdown States Normal StateEnhanced Halt Powerdown State Stop-Grant StateEnhanced Halt Snoop or Halt Snoop State, Grant Snoop State Enhanced Intel SpeedStep TechnologyBoxed Processor Specifications Mechanical Representation of the Boxed ProcessorMechanical Specifications Boxed Processor Cooling Solution DimensionsBoxed Processor Fan Heatsink Weight Fan Heatsink Power SupplyElectrical Requirements Fan Heatsink Power and Signal Specifications +12 V 12 volt fan power supplyDescription Min Typ Max Unit Sense frequencyThermal Specifications Boxed Processor Cooling RequirementsBoxed Processor Specifications Variable Speed Fan Boxed Processor Fan Boxed Processor Fan SpeedFan operates at its highest speed Boxed Processor Specifications Mechanical Representation of the Boxed Processor Cooling Solution Dimensions Assembly Stack Including the Support and Retention Module Boxed Processor Support and Retention Module SRMSense Sense frequency ControlDatasheet 101 Boxed Processor TMA Set Points Boxed Processor Boxed Processor Fan SpeedDatasheet 103 104 Debug Tools Specifications Logic Analyzer Interface LAIMechanical Considerations Electrical Considerations106

830 specifications

The Intel 830 chipset, introduced in the early 2000s, marked a significant evolution in Intel's chipset architecture for desktop and mobile computing. Known for its support of the Pentium 4 processors, the 830 chipset was tailored for both performance and stability, making it an appealing choice for OEMs and enthusiasts alike.

One of the standout features of the Intel 830 chipset is its support for DDR SDRAM, providing a much-needed boost in memory bandwidth compared to its predecessors. With dual-channel memory support, the chipset could utilize two memory modules simultaneously, which effectively doubled the data transfer rate and enhanced overall system performance. This made the Intel 830 particularly beneficial for applications requiring high memory throughput, such as multimedia processing and gaming.

Another important characteristic of the Intel 830 was its integrated graphics support, featuring Intel's Extreme Graphics technology. This integration allowed for decent graphics performance without the need for a dedicated GPU, making it suitable for budget systems and everyday computing tasks. However, for power users and gaming enthusiasts, the option to incorporate a discrete graphics card remained available through the provided PCI Express x16 slot.

The Intel 830 chipset also boasted advanced I/O capabilities, including support for USB 2.0, which provided faster data transfer rates compared to USB 1.1, and enhanced IDE interfaces for connecting hard drives and optical devices. With its Hyper-Threading technology support, the chipset allowed for improved multitasking efficiency, enabling a single processor to execute multiple threads simultaneously, a feature that was particularly beneficial in server environments and complex computing tasks.

In terms of connectivity, the Intel 830 supported multiple bus interfaces, including PCI Express and AGP, thereby enabling users to expand their systems with various add-on cards. This flexibility contributed to the chipset's longevity in the marketplace, as it catered to a wide range of user needs from light computing to intensive gaming and content creation.

In summary, the Intel 830 chipset combined enhanced memory capabilities, integrated graphics performance, robust I/O features, and flexible expansion options, making it a versatile choice for various computing environments during its time. It played a key role in shaping the landscape of early 2000s computing, paving the way for future advancements in chipset technology. Its legacy continues to influence modern computing architectures, illustrating the lasting impact of Intel’s innovative design principles.