Intel 830 manual VCC AK8

Page 50

Land Listing and Signal Descriptions

Table 4-1. Alphabetical Land

Assignments

Land Name

Land

Signal Buffer

Direction

#

Type

 

 

 

 

 

 

VCC

AK14

Power/Other

 

 

 

 

 

VCC

AK15

Power/Other

 

 

 

 

 

VCC

AK18

Power/Other

 

 

 

 

 

VCC

AK19

Power/Other

 

 

 

 

 

VCC

AK21

Power/Other

 

 

 

 

 

VCC

AK22

Power/Other

 

 

 

 

 

VCC

AK25

Power/Other

 

 

 

 

 

VCC

AK26

Power/Other

 

 

 

 

 

VCC

AK8

Power/Other

 

 

 

 

 

VCC

AK9

Power/Other

 

 

 

 

 

VCC

AL11

Power/Other

 

 

 

 

 

VCC

AL12

Power/Other

 

 

 

 

 

VCC

AL14

Power/Other

 

 

 

 

 

VCC

AL15

Power/Other

 

 

 

 

 

VCC

AL18

Power/Other

 

 

 

 

 

VCC

AL19

Power/Other

 

 

 

 

 

VCC

AL21

Power/Other

 

 

 

 

 

VCC

AL22

Power/Other

 

 

 

 

 

VCC

AL25

Power/Other

 

 

 

 

 

VCC

AL26

Power/Other

 

 

 

 

 

VCC

AL29

Power/Other

 

 

 

 

 

VCC

AL30

Power/Other

 

 

 

 

 

VCC

AL8

Power/Other

 

 

 

 

 

VCC

AL9

Power/Other

 

 

 

 

 

VCC

AM11

Power/Other

 

 

 

 

 

VCC

AM12

Power/Other

 

 

 

 

 

VCC

AM14

Power/Other

 

 

 

 

 

VCC

AM15

Power/Other

 

 

 

 

 

VCC

AM18

Power/Other

 

 

 

 

 

VCC

AM19

Power/Other

 

 

 

 

 

VCC

AM21

Power/Other

 

 

 

 

 

VCC

AM22

Power/Other

 

 

 

 

 

VCC

AM25

Power/Other

 

 

 

 

 

VCC

AM26

Power/Other

 

 

 

 

 

VCC

AM29

Power/Other

 

 

 

 

 

VCC

AM30

Power/Other

 

 

 

 

 

VCC

AM8

Power/Other

 

 

 

 

 

VCC

AM9

Power/Other

 

 

 

 

 

VCC

AN11

Power/Other

 

 

 

 

 

VCC

AN12

Power/Other

 

 

 

 

 

Table 4-1. Alphabetical Land

Assignments

Land Name

Land

Signal Buffer

Direction

#

Type

 

 

 

 

 

 

VCC

AN14

Power/Other

 

 

 

 

 

VCC

AN15

Power/Other

 

 

 

 

 

VCC

AN18

Power/Other

 

 

 

 

 

VCC

AN19

Power/Other

 

 

 

 

 

VCC

AN21

Power/Other

 

 

 

 

 

VCC

AN22

Power/Other

 

 

 

 

 

VCC

AN25

Power/Other

 

 

 

 

 

VCC

AN26

Power/Other

 

 

 

 

 

VCC

AN29

Power/Other

 

 

 

 

 

VCC

AN30

Power/Other

 

 

 

 

 

VCC

AN8

Power/Other

 

 

 

 

 

VCC

AN9

Power/Other

 

 

 

 

 

VCC

J10

Power/Other

 

 

 

 

 

VCC

J11

Power/Other

 

 

 

 

 

VCC

J12

Power/Other

 

 

 

 

 

VCC

J13

Power/Other

 

 

 

 

 

VCC

J14

Power/Other

 

 

 

 

 

VCC

J15

Power/Other

 

 

 

 

 

VCC

J18

Power/Other

 

 

 

 

 

VCC

J19

Power/Other

 

 

 

 

 

VCC

J20

Power/Other

 

 

 

 

 

VCC

J21

Power/Other

 

 

 

 

 

VCC

J22

Power/Other

 

 

 

 

 

VCC

J23

Power/Other

 

 

 

 

 

VCC

J24

Power/Other

 

 

 

 

 

VCC

J25

Power/Other

 

 

 

 

 

VCC

J26

Power/Other

 

 

 

 

 

VCC

J27

Power/Other

 

 

 

 

 

VCC

J28

Power/Other

 

 

 

 

 

VCC

J29

Power/Other

 

 

 

 

 

VCC

J30

Power/Other

 

 

 

 

 

VCC

J8

Power/Other

 

 

 

 

 

VCC

J9

Power/Other

 

 

 

 

 

VCC

K23

Power/Other

 

 

 

 

 

VCC

K24

Power/Other

 

 

 

 

 

VCC

K25

Power/Other

 

 

 

 

 

VCC

K26

Power/Other

 

 

 

 

 

VCC

K27

Power/Other

 

 

 

 

 

VCC

K28

Power/Other

 

 

 

 

 

VCC

K29

Power/Other

 

 

 

 

 

50

Datasheet

Image 50
Contents Datasheet Intel Pentium D Processor 800Δ SequenceContents Contents Halt and Enhanced Halt Powerdown States Figures Tables Initial release May Revision HistoryRevision Description Date Contents Intel Pentium D Processor 800 Sequence Features Contents Introduction Terminology Processor Packaging TerminologyReferences ReferencesIntroduction Decoupling Guidelines Electrical SpecificationsPower and Ground Lands VCC DecouplingVoltage Identification FSB DecouplingVoltage Identification Definition VID5 VID4 VID3 VID2 VID1 VID0Reserved, Unused, FC and Testhi Signals Symbol Parameter Min Max Unit Voltage and Current SpecificationsDC Voltage and Current Specifications Absolute Maximum and Minimum RatingsVID Voltage and Current SpecificationsSymbol Parameter Min Typ Max Unit Vttout ICC065 Icc a Voltage Deviation from VID Setting V 1, 2000 072Icc a 013 033 000 019007 026 020 040Icc a Magnitude of V CC overshoot above VID 050 VCC Overshoot SpecificationVCC Overshoot Specifications Time duration of V CC overshoot above VIDDie Voltage Validation Signaling SpecificationsFSB Signal Groups Signals FSB Signal GroupsSignal Group Signals Associated StrobeSignal Reference Voltages 2 GTL+ Asynchronous SignalsSignal Characteristics 11. GTL+ Signal Group DC Specifications FSB DC Specifications10. BSEL20 and VID50 Signal Group DC Specifications Symbol Parameter Max Unit12. Pwrgood Input and TAP Signal Group DC Specifications 13. GTL+ Asynchronous Signal Group DC SpecificationsSymbol Parameter Min Typ Max Units 14. Vttpwrgd DC Specifications15. Bootselect and MSID10 DC Specifications 16. GTL+ Bus Voltage Definitions17. Core Frequency to FSB Multiplier Configuration Clock SpecificationsFSB Frequency Select Signals FSB Clock BCLK10 and Processor ClockingFSB Frequency Phase Lock Loop PLL and Filter18. BSEL20 Frequency Table for BCLK10 133 MHzPhase Lock Loop PLL Filter Requirements Package Mechanical Specifications Package Mechanical DrawingProcessor Package Drawing Package Mechanical Specifications Package Mechanical Specifications Processor Component Keep-Out Zones Package Loading SpecificationsProcessor Loading Specifications Package Handling GuidelinesProcessor Materials Package Insertion SpecificationsProcessor Mass Specification Processor MarkingsProcessor Top-Side Marking Example Intel Pentium D Processor Processor Land Coordinates Processor Land Coordinates, Top ViewLand Listing and Signal Descriptions Processor Land AssignmentsLandout Diagram Top View Left Side Landout Diagram Top View Right Side Land Name Signal Buffer Direction Type Alphabetical Land AssignmentsDBI0# GTLREF1 VCC AC8 VCC AK8 Vccmb AN5 VSS AA3 VSS AJ4 E11 Power/Other Vssmb AN6 Land Land Name Signal Buffer Direction Type Numerical Land AssignmentReserved ADS# Reserved DEFER# J12 N30 AA1 Vttoutright AD4 VSS AH1 VSS AK2 VSS AN1 VSS Request Signals Alphabetical Signals ReferenceSignal Description Sheet 1 Name Type DescriptionSignal Description Sheet 2 NameData Group Signal Description Sheet 3Bus Signal Data Bus Signals Signal Description Sheet 4 Signal Description Sheet 5 Pwrgood Signal Description Sheet 6RESET# Signal Description Sheet 7 Signal Description Sheet 8 Land Listing and Signal Descriptions Thermal Specifications Thermal Specifications and Design ConsiderationsProcessor Thermal Specifications GHz Processor Thermal SpecificationsMinimum Maximum T C C Power Maximum T C Thermal Profile for the Pentium D Processor with PRB=1Power Thermal Profile for the Pentium D Processor with PRB=0Thermal Monitor Processor Thermal FeaturesThermal Metrology On-Demand Mode PROCHOT# SignalFORCEPR# Signal Pin Thermal Diode THERMTRIP# SignalTcontrol and Fan Speed Reduction Thermal Diode ParametersDiode anode Signal Name Land Number Signal DescriptionThermal Diode Interface Thermal Specifications and Design Considerations Clock Control and Low Power States FeaturesPower-On Configuration Options Power-On Configuration Option SignalsHalt and Enhanced Halt Powerdown States Normal StateEnhanced Halt Powerdown State Stop-Grant StateEnhanced Halt Snoop or Halt Snoop State, Grant Snoop State Enhanced Intel SpeedStep TechnologyBoxed Processor Specifications Mechanical Representation of the Boxed ProcessorMechanical Specifications Boxed Processor Cooling Solution DimensionsElectrical Requirements Boxed Processor Fan Heatsink WeightFan Heatsink Power Supply Description Min Typ Max Unit Fan Heatsink Power and Signal Specifications+12 V 12 volt fan power supply Sense frequencyThermal Specifications Boxed Processor Cooling RequirementsBoxed Processor Specifications Fan operates at its highest speed Variable Speed FanBoxed Processor Fan Boxed Processor Fan Speed Boxed Processor Specifications Mechanical Representation of the Boxed Processor Cooling Solution Dimensions Assembly Stack Including the Support and Retention Module Boxed Processor Support and Retention Module SRMSense Sense frequency ControlDatasheet 101 Boxed Processor TMA Set Points Boxed Processor Boxed Processor Fan SpeedDatasheet 103 104 Mechanical Considerations Debug Tools SpecificationsLogic Analyzer Interface LAI Electrical Considerations106

830 specifications

The Intel 830 chipset, introduced in the early 2000s, marked a significant evolution in Intel's chipset architecture for desktop and mobile computing. Known for its support of the Pentium 4 processors, the 830 chipset was tailored for both performance and stability, making it an appealing choice for OEMs and enthusiasts alike.

One of the standout features of the Intel 830 chipset is its support for DDR SDRAM, providing a much-needed boost in memory bandwidth compared to its predecessors. With dual-channel memory support, the chipset could utilize two memory modules simultaneously, which effectively doubled the data transfer rate and enhanced overall system performance. This made the Intel 830 particularly beneficial for applications requiring high memory throughput, such as multimedia processing and gaming.

Another important characteristic of the Intel 830 was its integrated graphics support, featuring Intel's Extreme Graphics technology. This integration allowed for decent graphics performance without the need for a dedicated GPU, making it suitable for budget systems and everyday computing tasks. However, for power users and gaming enthusiasts, the option to incorporate a discrete graphics card remained available through the provided PCI Express x16 slot.

The Intel 830 chipset also boasted advanced I/O capabilities, including support for USB 2.0, which provided faster data transfer rates compared to USB 1.1, and enhanced IDE interfaces for connecting hard drives and optical devices. With its Hyper-Threading technology support, the chipset allowed for improved multitasking efficiency, enabling a single processor to execute multiple threads simultaneously, a feature that was particularly beneficial in server environments and complex computing tasks.

In terms of connectivity, the Intel 830 supported multiple bus interfaces, including PCI Express and AGP, thereby enabling users to expand their systems with various add-on cards. This flexibility contributed to the chipset's longevity in the marketplace, as it catered to a wide range of user needs from light computing to intensive gaming and content creation.

In summary, the Intel 830 chipset combined enhanced memory capabilities, integrated graphics performance, robust I/O features, and flexible expansion options, making it a versatile choice for various computing environments during its time. It played a key role in shaping the landscape of early 2000s computing, paving the way for future advancements in chipset technology. Its legacy continues to influence modern computing architectures, illustrating the lasting impact of Intel’s innovative design principles.