Intel 830 manual VSS AJ4

Page 53

Land Listing and Signal Descriptions

Table 4-1. Alphabetical Land

Assignments

Land Name

Land

Signal Buffer

Direction

#

Type

 

 

 

 

 

 

VSS

AJ23

Power/Other

 

 

 

 

 

VSS

AJ24

Power/Other

 

 

 

 

 

VSS

AJ27

Power/Other

 

 

 

 

 

VSS

AJ28

Power/Other

 

 

 

 

 

VSS

AJ29

Power/Other

 

 

 

 

 

VSS

AJ30

Power/Other

 

 

 

 

 

VSS

AJ4

Power/Other

 

 

 

 

 

VSS

AJ7

Power/Other

 

 

 

 

 

VSS

AK10

Power/Other

 

 

 

 

 

VSS

AK13

Power/Other

 

 

 

 

 

VSS

AK16

Power/Other

 

 

 

 

 

VSS

AK17

Power/Other

 

 

 

 

 

VSS

AK2

Power/Other

 

 

 

 

 

VSS

AK20

Power/Other

 

 

 

 

 

VSS

AK23

Power/Other

 

 

 

 

 

VSS

AK24

Power/Other

 

 

 

 

 

VSS

AK27

Power/Other

 

 

 

 

 

VSS

AK28

Power/Other

 

 

 

 

 

VSS

AK29

Power/Other

 

 

 

 

 

VSS

AK30

Power/Other

 

 

 

 

 

VSS

AK5

Power/Other

 

 

 

 

 

VSS

AK7

Power/Other

 

 

 

 

 

VSS

AL10

Power/Other

 

 

 

 

 

VSS

AL13

Power/Other

 

 

 

 

 

VSS

AL16

Power/Other

 

 

 

 

 

VSS

AL17

Power/Other

 

 

 

 

 

VSS

AL20

Power/Other

 

 

 

 

 

VSS

AL23

Power/Other

 

 

 

 

 

VSS

AL24

Power/Other

 

 

 

 

 

VSS

AL27

Power/Other

 

 

 

 

 

VSS

AL28

Power/Other

 

 

 

 

 

VSS

AL3

Power/Other

 

 

 

 

 

VSS

AL7

Power/Other

 

 

 

 

 

VSS

AM1

Power/Other

 

 

 

 

 

VSS

AM10

Power/Other

 

 

 

 

 

VSS

AM13

Power/Other

 

 

 

 

 

VSS

AM16

Power/Other

 

 

 

 

 

VSS

AM17

Power/Other

 

 

 

 

 

VSS

AM20

Power/Other

 

 

 

 

 

VSS

AM23

Power/Other

 

 

 

 

 

Table 4-1. Alphabetical Land

Assignments

Land Name

Land

Signal Buffer

Direction

#

Type

 

 

 

 

 

 

VSS

AM24

Power/Other

 

 

 

 

 

VSS

AM27

Power/Other

 

 

 

 

 

VSS

AM28

Power/Other

 

 

 

 

 

VSS

AM4

Power/Other

 

 

 

 

 

VSS

AN1

Power/Other

 

 

 

 

 

VSS

AN10

Power/Other

 

 

 

 

 

VSS

AN13

Power/Other

 

 

 

 

 

VSS

AN16

Power/Other

 

 

 

 

 

VSS

AN17

Power/Other

 

 

 

 

 

VSS

AN2

Power/Other

 

 

 

 

 

VSS

AN20

Power/Other

 

 

 

 

 

VSS

AN23

Power/Other

 

 

 

 

 

VSS

AN24

Power/Other

 

 

 

 

 

VSS

AN27

Power/Other

 

 

 

 

 

VSS

AN28

Power/Other

 

 

 

 

 

VSS

B1

Power/Other

 

 

 

 

 

VSS

B11

Power/Other

 

 

 

 

 

VSS

B14

Power/Other

 

 

 

 

 

VSS

B17

Power/Other

 

 

 

 

 

VSS

B20

Power/Other

 

 

 

 

 

VSS

B24

Power/Other

 

 

 

 

 

VSS

B5

Power/Other

 

 

 

 

 

VSS

B8

Power/Other

 

 

 

 

 

VSS

C10

Power/Other

 

 

 

 

 

VSS

C13

Power/Other

 

 

 

 

 

VSS

C16

Power/Other

 

 

 

 

 

VSS

C19

Power/Other

 

 

 

 

 

VSS

C22

Power/Other

 

 

 

 

 

VSS

C24

Power/Other

 

 

 

 

 

VSS

C4

Power/Other

 

 

 

 

 

VSS

C7

Power/Other

 

 

 

 

 

VSS

D12

Power/Other

 

 

 

 

 

VSS

D15

Power/Other

 

 

 

 

 

VSS

D18

Power/Other

 

 

 

 

 

VSS

D21

Power/Other

 

 

 

 

 

VSS

D24

Power/Other

 

 

 

 

 

VSS

D3

Power/Other

 

 

 

 

 

VSS

D5

Power/Other

 

 

 

 

 

VSS

D6

Power/Other

 

 

 

 

 

VSS

D9

Power/Other

 

 

 

 

 

Datasheet

53

Image 53
Contents Intel Pentium D Processor 800Δ Sequence DatasheetContents Contents Halt and Enhanced Halt Powerdown States Figures Tables Initial release May Revision HistoryRevision Description Date Contents Intel Pentium D Processor 800 Sequence Features Contents Introduction Processor Packaging Terminology TerminologyReferences ReferencesIntroduction Power and Ground Lands Electrical SpecificationsDecoupling Guidelines VCC DecouplingFSB Decoupling Voltage IdentificationVID5 VID4 VID3 VID2 VID1 VID0 Voltage Identification DefinitionReserved, Unused, FC and Testhi Signals DC Voltage and Current Specifications Voltage and Current SpecificationsSymbol Parameter Min Max Unit Absolute Maximum and Minimum RatingsSymbol Parameter Min Typ Max Unit Voltage and Current SpecificationsVID Vttout ICC000 Icc a Voltage Deviation from VID Setting V 1, 2065 072Icc a 007 026 000 019013 033 020 040Icc a VCC Overshoot Specifications VCC Overshoot SpecificationMagnitude of V CC overshoot above VID 050 Time duration of V CC overshoot above VIDDie Voltage Validation Signaling SpecificationsFSB Signal Groups Signal Group FSB Signal GroupsSignals Signals Associated StrobeSignal Reference Voltages 2 GTL+ Asynchronous SignalsSignal Characteristics 10. BSEL20 and VID50 Signal Group DC Specifications FSB DC Specifications11. GTL+ Signal Group DC Specifications Symbol Parameter Max Unit13. GTL+ Asynchronous Signal Group DC Specifications 12. Pwrgood Input and TAP Signal Group DC Specifications15. Bootselect and MSID10 DC Specifications 14. Vttpwrgd DC SpecificationsSymbol Parameter Min Typ Max Units 16. GTL+ Bus Voltage DefinitionsFSB Frequency Select Signals Clock Specifications17. Core Frequency to FSB Multiplier Configuration FSB Clock BCLK10 and Processor Clocking18. BSEL20 Frequency Table for BCLK10 Phase Lock Loop PLL and FilterFSB Frequency 133 MHzPhase Lock Loop PLL Filter Requirements Package Mechanical Drawing Package Mechanical SpecificationsProcessor Package Drawing Package Mechanical Specifications Package Mechanical Specifications Processor Loading Specifications Package Loading SpecificationsProcessor Component Keep-Out Zones Package Handling GuidelinesProcessor Mass Specification Package Insertion SpecificationsProcessor Materials Processor MarkingsProcessor Top-Side Marking Example Intel Pentium D Processor Processor Land Coordinates, Top View Processor Land CoordinatesProcessor Land Assignments Land Listing and Signal DescriptionsLandout Diagram Top View Left Side Landout Diagram Top View Right Side Alphabetical Land Assignments Land Name Signal Buffer Direction TypeDBI0# GTLREF1 VCC AC8 VCC AK8 Vccmb AN5 VSS AA3 VSS AJ4 E11 Power/Other Vssmb AN6 Numerical Land Assignment Land Land Name Signal Buffer Direction TypeReserved ADS# Reserved DEFER# J12 N30 AA1 Vttoutright AD4 VSS AH1 VSS AK2 VSS AN1 VSS Signal Description Sheet 1 Alphabetical Signals ReferenceRequest Signals Name Type DescriptionName Signal Description Sheet 2Data Group Signal Description Sheet 3Bus Signal Data Bus Signals Signal Description Sheet 4 Signal Description Sheet 5 Pwrgood Signal Description Sheet 6RESET# Signal Description Sheet 7 Signal Description Sheet 8 Land Listing and Signal Descriptions Thermal Specifications Thermal Specifications and Design ConsiderationsProcessor Thermal Specifications GHz Processor Thermal SpecificationsMinimum Maximum T C C Thermal Profile for the Pentium D Processor with PRB=1 Power Maximum T CThermal Profile for the Pentium D Processor with PRB=0 PowerThermal Monitor Processor Thermal FeaturesThermal Metrology PROCHOT# Signal On-Demand ModeFORCEPR# Signal Pin Tcontrol and Fan Speed Reduction THERMTRIP# SignalThermal Diode Thermal Diode ParametersDiode anode Signal Name Land Number Signal DescriptionThermal Diode Interface Thermal Specifications and Design Considerations Power-On Configuration Options FeaturesClock Control and Low Power States Power-On Configuration Option SignalsNormal State Halt and Enhanced Halt Powerdown StatesStop-Grant State Enhanced Halt Powerdown StateEnhanced Intel SpeedStep Technology Enhanced Halt Snoop or Halt Snoop State, Grant Snoop StateMechanical Representation of the Boxed Processor Boxed Processor SpecificationsBoxed Processor Cooling Solution Dimensions Mechanical SpecificationsElectrical Requirements Boxed Processor Fan Heatsink WeightFan Heatsink Power Supply +12 V 12 volt fan power supply Fan Heatsink Power and Signal SpecificationsDescription Min Typ Max Unit Sense frequencyBoxed Processor Cooling Requirements Thermal SpecificationsBoxed Processor Specifications Fan operates at its highest speed Variable Speed FanBoxed Processor Fan Boxed Processor Fan Speed Boxed Processor Specifications Mechanical Representation of the Boxed Processor Cooling Solution Dimensions Boxed Processor Support and Retention Module SRM Assembly Stack Including the Support and Retention ModuleControl Sense Sense frequencyDatasheet 101 Boxed Processor Boxed Processor Fan Speed Boxed Processor TMA Set PointsDatasheet 103 104 Logic Analyzer Interface LAI Debug Tools SpecificationsMechanical Considerations Electrical Considerations106

830 specifications

The Intel 830 chipset, introduced in the early 2000s, marked a significant evolution in Intel's chipset architecture for desktop and mobile computing. Known for its support of the Pentium 4 processors, the 830 chipset was tailored for both performance and stability, making it an appealing choice for OEMs and enthusiasts alike.

One of the standout features of the Intel 830 chipset is its support for DDR SDRAM, providing a much-needed boost in memory bandwidth compared to its predecessors. With dual-channel memory support, the chipset could utilize two memory modules simultaneously, which effectively doubled the data transfer rate and enhanced overall system performance. This made the Intel 830 particularly beneficial for applications requiring high memory throughput, such as multimedia processing and gaming.

Another important characteristic of the Intel 830 was its integrated graphics support, featuring Intel's Extreme Graphics technology. This integration allowed for decent graphics performance without the need for a dedicated GPU, making it suitable for budget systems and everyday computing tasks. However, for power users and gaming enthusiasts, the option to incorporate a discrete graphics card remained available through the provided PCI Express x16 slot.

The Intel 830 chipset also boasted advanced I/O capabilities, including support for USB 2.0, which provided faster data transfer rates compared to USB 1.1, and enhanced IDE interfaces for connecting hard drives and optical devices. With its Hyper-Threading technology support, the chipset allowed for improved multitasking efficiency, enabling a single processor to execute multiple threads simultaneously, a feature that was particularly beneficial in server environments and complex computing tasks.

In terms of connectivity, the Intel 830 supported multiple bus interfaces, including PCI Express and AGP, thereby enabling users to expand their systems with various add-on cards. This flexibility contributed to the chipset's longevity in the marketplace, as it catered to a wide range of user needs from light computing to intensive gaming and content creation.

In summary, the Intel 830 chipset combined enhanced memory capabilities, integrated graphics performance, robust I/O features, and flexible expansion options, making it a versatile choice for various computing environments during its time. It played a key role in shaping the landscape of early 2000s computing, paving the way for future advancements in chipset technology. Its legacy continues to influence modern computing architectures, illustrating the lasting impact of Intel’s innovative design principles.