Intel 830 manual Signal Description Sheet 4

Page 69

 

 

 

 

Land Listing and Signal Descriptions

Table 4-3. Signal Description (Sheet 4 of 8)

 

 

 

 

 

 

 

Name

Type

 

Description

 

 

 

 

 

 

 

DRDY# (Data Ready) is asserted by the data driver on each data transfer,

 

DRDY#

Input/

indicating valid data on the data bus. In a multi-common clock data transfer,

 

Output

DRDY# may be de-asserted to insert idle clocks. This signal must connect the

 

 

 

 

 

appropriate pins/lands of all processor FSB agents.

 

 

 

 

 

 

 

DSTBN[3:0]# are the data strobes used to latch in D[63:0]#.

 

 

 

Signals

Associated Strobe

 

DSTBN[3:0]#

Input/

D[15:0]#, DBI0#

DSTBN0#

 

 

 

 

Output

D[31:16]#, DBI1#

DSTBN1#

 

 

 

 

 

D[47:32]#, DBI2#

DSTBN2#

 

 

 

D[63:48]#, DBI3#

DSTBN3#

 

 

 

 

 

 

 

DSTBP[3:0]# are the data strobes used to latch in D[63:0]#.

 

 

 

Signals

Associated Strobe

 

DSTBP[3:0]#

Input/

D[15:0]#, DBI0#

DSTBP0#

 

 

 

 

Output

D[31:16]#, DBI1#

DSTBP1#

 

 

 

 

 

D[47:32]#, DBI2#

DSTBP2#

 

 

 

D[63:48]#, DBI3#

DSTBP3#

 

 

 

 

 

FCx

Other

FC signals are signals that are available for compatibility with other processors.

 

 

 

 

 

 

 

FERR#/PBE# (floating point error/pending break event) is a multiplexed signal

 

 

 

and its meaning is qualified by STPCLK#. When STPCLK# is not asserted,

 

 

 

FERR#/PBE# indicates a floating-point error and will be asserted when the

 

 

 

processor detects an unmasked floating-point error. When STPCLK# is not

 

 

 

asserted, FERR#/PBE# is similar to the ERROR# signal on the Intel 387

 

 

 

coprocessor, and is included for compatibility with systems using MS-DOS*-

 

FERR#/PBE#

Output

type floating-point error reporting. When STPCLK# is asserted, an assertion of

 

FERR#/PBE# indicates that the processor has a pending break event waiting

 

 

 

 

 

 

for service. The assertion of FERR#/PBE# indicates that the processor should

 

 

 

be returned to the Normal state. For additional information on the pending break

 

 

 

event functionality, including the identification of support of the feature and

 

 

 

enable/disable information, refer to volume 3 of the Intel Architecture Software

 

 

 

Developer's Manual and the Intel Processor Identification and the CPUID

 

 

 

Instruction application note.

 

 

 

 

 

 

 

 

The FORCEPR# input can be used by the platform to force the processor (both

 

FORCEPR#

Input

cores) to activate the Thermal Control Circuit (TCC). The TCC will remain active

 

 

 

until the system de-asserts FORCEPR#.

 

 

 

 

 

 

 

GTLREF[1:0] determine the signal reference level for GTL+ input signals.

 

GTLREF[1:0]

Input

GTLREF[1:0] are used by the GTL+ receivers to determine if a signal is a logical

 

 

 

0 or logical 1.

 

 

 

 

 

 

GTLREF_SEL

Output

GTLREF_SEL is used to select the appropriate chipset GTLREF voltage.

 

 

 

 

 

 

 

Input/

HIT# (Snoop Hit) and HITM# (Hit Modified) convey transaction snoop operation

 

HIT#

Output

 

 

 

results. Any FSB agent may assert both HIT# and HITM# together to indicate

 

HITM#

Input/

that it requires a snoop stall, which can be continued by reasserting HIT# and

 

HITM# together.

 

 

 

Output

 

 

 

 

 

 

 

Datasheet

69

Image 69
Contents Intel Pentium D Processor 800Δ Sequence DatasheetContents Contents Halt and Enhanced Halt Powerdown States Figures Tables Revision History Revision Description DateInitial release May Contents Intel Pentium D Processor 800 Sequence Features Contents Introduction Processor Packaging Terminology TerminologyReferences ReferencesIntroduction Power and Ground Lands Electrical SpecificationsDecoupling Guidelines VCC DecouplingFSB Decoupling Voltage IdentificationVID5 VID4 VID3 VID2 VID1 VID0 Voltage Identification DefinitionReserved, Unused, FC and Testhi Signals DC Voltage and Current Specifications Voltage and Current SpecificationsSymbol Parameter Min Max Unit Absolute Maximum and Minimum RatingsSymbol Parameter Min Typ Max Unit Voltage and Current SpecificationsVID Vttout ICC000 Icc a Voltage Deviation from VID Setting V 1, 2065 072Icc a 007 026 000 019013 033 020 040Icc a VCC Overshoot Specifications VCC Overshoot SpecificationMagnitude of V CC overshoot above VID 050 Time duration of V CC overshoot above VIDSignaling Specifications FSB Signal GroupsDie Voltage Validation Signal Group FSB Signal GroupsSignals Signals Associated Strobe2 GTL+ Asynchronous Signals Signal CharacteristicsSignal Reference Voltages 10. BSEL20 and VID50 Signal Group DC Specifications FSB DC Specifications11. GTL+ Signal Group DC Specifications Symbol Parameter Max Unit13. GTL+ Asynchronous Signal Group DC Specifications 12. Pwrgood Input and TAP Signal Group DC Specifications15. Bootselect and MSID10 DC Specifications 14. Vttpwrgd DC SpecificationsSymbol Parameter Min Typ Max Units 16. GTL+ Bus Voltage DefinitionsFSB Frequency Select Signals Clock Specifications17. Core Frequency to FSB Multiplier Configuration FSB Clock BCLK10 and Processor Clocking18. BSEL20 Frequency Table for BCLK10 Phase Lock Loop PLL and FilterFSB Frequency 133 MHzPhase Lock Loop PLL Filter Requirements Package Mechanical Drawing Package Mechanical SpecificationsProcessor Package Drawing Package Mechanical Specifications Package Mechanical Specifications Processor Loading Specifications Package Loading SpecificationsProcessor Component Keep-Out Zones Package Handling GuidelinesProcessor Mass Specification Package Insertion SpecificationsProcessor Materials Processor MarkingsProcessor Top-Side Marking Example Intel Pentium D Processor Processor Land Coordinates, Top View Processor Land CoordinatesProcessor Land Assignments Land Listing and Signal DescriptionsLandout Diagram Top View Left Side Landout Diagram Top View Right Side Alphabetical Land Assignments Land Name Signal Buffer Direction TypeDBI0# GTLREF1 VCC AC8 VCC AK8 Vccmb AN5 VSS AA3 VSS AJ4 E11 Power/Other Vssmb AN6 Numerical Land Assignment Land Land Name Signal Buffer Direction TypeReserved ADS# Reserved DEFER# J12 N30 AA1 Vttoutright AD4 VSS AH1 VSS AK2 VSS AN1 VSS Signal Description Sheet 1 Alphabetical Signals ReferenceRequest Signals Name Type DescriptionName Signal Description Sheet 2Signal Description Sheet 3 Bus Signal Data Bus SignalsData Group Signal Description Sheet 4 Signal Description Sheet 5 Signal Description Sheet 6 RESET#Pwrgood Signal Description Sheet 7 Signal Description Sheet 8 Land Listing and Signal Descriptions Thermal Specifications and Design Considerations Processor Thermal SpecificationsThermal Specifications Processor Thermal Specifications Minimum Maximum T C CGHz Thermal Profile for the Pentium D Processor with PRB=1 Power Maximum T CThermal Profile for the Pentium D Processor with PRB=0 PowerProcessor Thermal Features Thermal MetrologyThermal Monitor PROCHOT# Signal On-Demand ModeFORCEPR# Signal Pin Tcontrol and Fan Speed Reduction THERMTRIP# SignalThermal Diode Thermal Diode ParametersSignal Name Land Number Signal Description Thermal Diode InterfaceDiode anode Thermal Specifications and Design Considerations Power-On Configuration Options FeaturesClock Control and Low Power States Power-On Configuration Option SignalsNormal State Halt and Enhanced Halt Powerdown StatesStop-Grant State Enhanced Halt Powerdown StateEnhanced Intel SpeedStep Technology Enhanced Halt Snoop or Halt Snoop State, Grant Snoop StateMechanical Representation of the Boxed Processor Boxed Processor SpecificationsBoxed Processor Cooling Solution Dimensions Mechanical SpecificationsBoxed Processor Fan Heatsink Weight Fan Heatsink Power SupplyElectrical Requirements +12 V 12 volt fan power supply Fan Heatsink Power and Signal SpecificationsDescription Min Typ Max Unit Sense frequencyBoxed Processor Cooling Requirements Thermal SpecificationsBoxed Processor Specifications Variable Speed Fan Boxed Processor Fan Boxed Processor Fan SpeedFan operates at its highest speed Boxed Processor Specifications Mechanical Representation of the Boxed Processor Cooling Solution Dimensions Boxed Processor Support and Retention Module SRM Assembly Stack Including the Support and Retention ModuleControl Sense Sense frequencyDatasheet 101 Boxed Processor Boxed Processor Fan Speed Boxed Processor TMA Set PointsDatasheet 103 104 Logic Analyzer Interface LAI Debug Tools SpecificationsMechanical Considerations Electrical Considerations106

830 specifications

The Intel 830 chipset, introduced in the early 2000s, marked a significant evolution in Intel's chipset architecture for desktop and mobile computing. Known for its support of the Pentium 4 processors, the 830 chipset was tailored for both performance and stability, making it an appealing choice for OEMs and enthusiasts alike.

One of the standout features of the Intel 830 chipset is its support for DDR SDRAM, providing a much-needed boost in memory bandwidth compared to its predecessors. With dual-channel memory support, the chipset could utilize two memory modules simultaneously, which effectively doubled the data transfer rate and enhanced overall system performance. This made the Intel 830 particularly beneficial for applications requiring high memory throughput, such as multimedia processing and gaming.

Another important characteristic of the Intel 830 was its integrated graphics support, featuring Intel's Extreme Graphics technology. This integration allowed for decent graphics performance without the need for a dedicated GPU, making it suitable for budget systems and everyday computing tasks. However, for power users and gaming enthusiasts, the option to incorporate a discrete graphics card remained available through the provided PCI Express x16 slot.

The Intel 830 chipset also boasted advanced I/O capabilities, including support for USB 2.0, which provided faster data transfer rates compared to USB 1.1, and enhanced IDE interfaces for connecting hard drives and optical devices. With its Hyper-Threading technology support, the chipset allowed for improved multitasking efficiency, enabling a single processor to execute multiple threads simultaneously, a feature that was particularly beneficial in server environments and complex computing tasks.

In terms of connectivity, the Intel 830 supported multiple bus interfaces, including PCI Express and AGP, thereby enabling users to expand their systems with various add-on cards. This flexibility contributed to the chipset's longevity in the marketplace, as it catered to a wide range of user needs from light computing to intensive gaming and content creation.

In summary, the Intel 830 chipset combined enhanced memory capabilities, integrated graphics performance, robust I/O features, and flexible expansion options, making it a versatile choice for various computing environments during its time. It played a key role in shaping the landscape of early 2000s computing, paving the way for future advancements in chipset technology. Its legacy continues to influence modern computing architectures, illustrating the lasting impact of Intel’s innovative design principles.