Intel 830 manual Signaling Specifications, Die Voltage Validation, FSB Signal Groups

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Electrical Specifications

2.5.4Die Voltage Validation

Overshoot events on the processor must meet the specifications in Table 2-6when measured across the VCC_SENSE and VSS_SENSE lands. Overshoot events that are < 10 ns in duration may be ignored. These measurements of processor die level overshoot must be taken with a bandwidth limited oscilloscope set to a greater than or equal to 100 MHz bandwidth limit. Refer to the Voltage Regulator Down (VRD) 10.1 Design Guide For Desktop LGA775 Socket for additional voltage regulator validation details.

2.6Signaling Specifications

Most processor Front Side Bus signals use Gunning Transceiver Logic (GTL+) signaling technology. This technology provides improved noise margins and reduced ringing through low voltage swings and controlled edge rates. Platforms implement a termination voltage level for GTL+ signals defined as VTT. Because platforms implement separate power planes for each processor (and chipset), separate VCC and VTT supplies are necessary. This configuration allows for improved noise tolerance as processor frequency increases. Speed enhancements to data and address busses have caused signal integrity considerations and platform design methods to become even more critical than with previous processor families.

The GTL+ inputs require a reference voltage (GTLREF) that is used by the receivers to determine if a signal is a logical 0 or a logical 1. GTLREF must be generated on the motherboard (see Table 2-16for GTLREF specifications). Termination resistors (RTT) for GTL+ signals are provided on the processor silicon and are terminated to VTT. Intel chipsets will also provide on-die termination, thus eliminating the need to terminate the bus on the motherboard for most GTL+ signals.

2.6.1FSB Signal Groups

The FSB signals have been combined into groups by buffer type. GTL+ input signals have differential input buffers that use GTLREF as a reference level. In this document, the term "GTL+ Input" refers to the GTL+ input group as well as the GTL+ I/O group when receiving. Similarly, "GTL+ Output" refers to the GTL+ output group as well as the GTL+ I/O group when driving.

With the implementation of a source synchronous data bus comes the need to specify two sets of timing parameters. One set is for common clock signals whose timings are specified with respect to rising edge of BCLK0 (ADS#, HIT#, HITM#, etc.) and the second set is for the source synchronous signals that are relative to their respective strobe lines (data and address) as well as rising edge of BCLK0. Asynchronous signals are still present (A20M#, IGNNE#, etc.) and can become active at any time during the clock cycle. Table 2-7identifies which signals are common clock, source synchronous and asynchronous.

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Datasheet

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Contents Datasheet Intel Pentium D Processor 800Δ SequenceContents Contents Halt and Enhanced Halt Powerdown States Figures Tables Initial release May Revision HistoryRevision Description Date Contents Intel Pentium D Processor 800 Sequence Features Contents Introduction Terminology Processor Packaging TerminologyReferences ReferencesIntroduction Decoupling Guidelines Electrical SpecificationsPower and Ground Lands VCC DecouplingVoltage Identification FSB DecouplingVoltage Identification Definition VID5 VID4 VID3 VID2 VID1 VID0Reserved, Unused, FC and Testhi Signals Symbol Parameter Min Max Unit Voltage and Current SpecificationsDC Voltage and Current Specifications Absolute Maximum and Minimum RatingsVID Voltage and Current SpecificationsSymbol Parameter Min Typ Max Unit Vttout ICC065 Icc a Voltage Deviation from VID Setting V 1, 2000 072Icc a 013 033 000 019007 026 020 040Icc a Magnitude of V CC overshoot above VID 050 VCC Overshoot SpecificationVCC Overshoot Specifications Time duration of V CC overshoot above VIDDie Voltage Validation Signaling SpecificationsFSB Signal Groups Signals FSB Signal GroupsSignal Group Signals Associated StrobeSignal Reference Voltages 2 GTL+ Asynchronous SignalsSignal Characteristics 11. GTL+ Signal Group DC Specifications FSB DC Specifications10. BSEL20 and VID50 Signal Group DC Specifications Symbol Parameter Max Unit12. Pwrgood Input and TAP Signal Group DC Specifications 13. GTL+ Asynchronous Signal Group DC SpecificationsSymbol Parameter Min Typ Max Units 14. Vttpwrgd DC Specifications15. Bootselect and MSID10 DC Specifications 16. GTL+ Bus Voltage Definitions17. Core Frequency to FSB Multiplier Configuration Clock SpecificationsFSB Frequency Select Signals FSB Clock BCLK10 and Processor ClockingFSB Frequency Phase Lock Loop PLL and Filter18. BSEL20 Frequency Table for BCLK10 133 MHzPhase Lock Loop PLL Filter Requirements Package Mechanical Specifications Package Mechanical DrawingProcessor Package Drawing Package Mechanical Specifications Package Mechanical Specifications Processor Component Keep-Out Zones Package Loading SpecificationsProcessor Loading Specifications Package Handling GuidelinesProcessor Materials Package Insertion SpecificationsProcessor Mass Specification Processor MarkingsProcessor Top-Side Marking Example Intel Pentium D Processor Processor Land Coordinates Processor Land Coordinates, Top ViewLand Listing and Signal Descriptions Processor Land AssignmentsLandout Diagram Top View Left Side Landout Diagram Top View Right Side Land Name Signal Buffer Direction Type Alphabetical Land AssignmentsDBI0# GTLREF1 VCC AC8 VCC AK8 Vccmb AN5 VSS AA3 VSS AJ4 E11 Power/Other Vssmb AN6 Land Land Name Signal Buffer Direction Type Numerical Land AssignmentReserved ADS# Reserved DEFER# J12 N30 AA1 Vttoutright AD4 VSS AH1 VSS AK2 VSS AN1 VSS Request Signals Alphabetical Signals ReferenceSignal Description Sheet 1 Name Type DescriptionSignal Description Sheet 2 NameData Group Signal Description Sheet 3Bus Signal Data Bus Signals Signal Description Sheet 4 Signal Description Sheet 5 Pwrgood Signal Description Sheet 6RESET# Signal Description Sheet 7 Signal Description Sheet 8 Land Listing and Signal Descriptions Thermal Specifications Thermal Specifications and Design ConsiderationsProcessor Thermal Specifications GHz Processor Thermal SpecificationsMinimum Maximum T C C Power Maximum T C Thermal Profile for the Pentium D Processor with PRB=1Power Thermal Profile for the Pentium D Processor with PRB=0Thermal Monitor Processor Thermal FeaturesThermal Metrology On-Demand Mode PROCHOT# SignalFORCEPR# Signal Pin Thermal Diode THERMTRIP# SignalTcontrol and Fan Speed Reduction Thermal Diode ParametersDiode anode Signal Name Land Number Signal DescriptionThermal Diode Interface Thermal Specifications and Design Considerations Clock Control and Low Power States FeaturesPower-On Configuration Options Power-On Configuration Option SignalsHalt and Enhanced Halt Powerdown States Normal StateEnhanced Halt Powerdown State Stop-Grant StateEnhanced Halt Snoop or Halt Snoop State, Grant Snoop State Enhanced Intel SpeedStep TechnologyBoxed Processor Specifications Mechanical Representation of the Boxed ProcessorMechanical Specifications Boxed Processor Cooling Solution DimensionsElectrical Requirements Boxed Processor Fan Heatsink WeightFan Heatsink Power Supply Description Min Typ Max Unit Fan Heatsink Power and Signal Specifications+12 V 12 volt fan power supply Sense frequencyThermal Specifications Boxed Processor Cooling RequirementsBoxed Processor Specifications Fan operates at its highest speed Variable Speed FanBoxed Processor Fan Boxed Processor Fan Speed Boxed Processor Specifications Mechanical Representation of the Boxed Processor Cooling Solution Dimensions Assembly Stack Including the Support and Retention Module Boxed Processor Support and Retention Module SRMSense Sense frequency ControlDatasheet 101 Boxed Processor TMA Set Points Boxed Processor Boxed Processor Fan SpeedDatasheet 103 104 Mechanical Considerations Debug Tools SpecificationsLogic Analyzer Interface LAI Electrical Considerations106

830 specifications

The Intel 830 chipset, introduced in the early 2000s, marked a significant evolution in Intel's chipset architecture for desktop and mobile computing. Known for its support of the Pentium 4 processors, the 830 chipset was tailored for both performance and stability, making it an appealing choice for OEMs and enthusiasts alike.

One of the standout features of the Intel 830 chipset is its support for DDR SDRAM, providing a much-needed boost in memory bandwidth compared to its predecessors. With dual-channel memory support, the chipset could utilize two memory modules simultaneously, which effectively doubled the data transfer rate and enhanced overall system performance. This made the Intel 830 particularly beneficial for applications requiring high memory throughput, such as multimedia processing and gaming.

Another important characteristic of the Intel 830 was its integrated graphics support, featuring Intel's Extreme Graphics technology. This integration allowed for decent graphics performance without the need for a dedicated GPU, making it suitable for budget systems and everyday computing tasks. However, for power users and gaming enthusiasts, the option to incorporate a discrete graphics card remained available through the provided PCI Express x16 slot.

The Intel 830 chipset also boasted advanced I/O capabilities, including support for USB 2.0, which provided faster data transfer rates compared to USB 1.1, and enhanced IDE interfaces for connecting hard drives and optical devices. With its Hyper-Threading technology support, the chipset allowed for improved multitasking efficiency, enabling a single processor to execute multiple threads simultaneously, a feature that was particularly beneficial in server environments and complex computing tasks.

In terms of connectivity, the Intel 830 supported multiple bus interfaces, including PCI Express and AGP, thereby enabling users to expand their systems with various add-on cards. This flexibility contributed to the chipset's longevity in the marketplace, as it catered to a wide range of user needs from light computing to intensive gaming and content creation.

In summary, the Intel 830 chipset combined enhanced memory capabilities, integrated graphics performance, robust I/O features, and flexible expansion options, making it a versatile choice for various computing environments during its time. It played a key role in shaping the landscape of early 2000s computing, paving the way for future advancements in chipset technology. Its legacy continues to influence modern computing architectures, illustrating the lasting impact of Intel’s innovative design principles.
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