Intel 830 manual FSB DC Specifications, BSEL20 and VID50 Signal Group DC Specifications

Page 29

Electrical Specifications

2.6.3FSB DC Specifications

The processor front side bus DC specifications in this section are defined at the processor core (pads) unless otherwise stated. All specifications apply to all frequencies and cache sizes unless otherwise stated.

Table 2-10. BSEL[2:0] and VID[5:0] Signal Group DC Specifications

Symbol

Parameter

Max

Unit

Notes1, 2

RON (BSEL)

Buffer On Resistance

60

Ω

-

RON (VID)

Buffer On Resistance

60

Ω

-

IOL

Max Land Current

8

mA

-

ILO

Output Leakage Current

200

µA

3

 

VTOL

Voltage Tolerance

VTT (max)

V

-

NOTES:

1.Unless otherwise noted, all specifications in this table apply to all processor frequencies.

2.These parameters are not tested and are based on design simulations.

3.Leakage to VSS with land held at 2.5V.

Table 2-11. GTL+ Signal Group DC Specifications

Symbol

Parameter

Min

Max

Unit

Notes1

VIL

Input Low Voltage

0.0

GTLREF – (0.10 * VTT)

V

2,

3

 

 

VIH

Input High Voltage

GTLREF + (0.10 * VTT)

VTT

V

3, 4, 5

 

 

VOH

Output High Voltage

N/A

VTT

V

3, 5

 

 

IOL

Output Low Current

N/A

VTT/[(0.50*RTT_MIN) +

A

-

 

 

 

 

RON_MIN]

 

 

 

ILI

Input Leakage Current

N/A

± 200

µA

6

 

 

 

ILO

Output Leakage

N/A

± 200

µA

6

 

Current

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

RON

Buffer On Resistance

8

12

Ω

 

 

NOTES:

 

 

 

 

 

 

1.Unless otherwise noted, all specifications in this table apply to all processor frequencies.

2.VIL is defined as the voltage range at a receiving agent that will be interpreted as a logical low value.

3.The VTT referred to in these specifications is the instantaneous VTT.

4.VIH is defined as the voltage range at a receiving agent that will be interpreted as a logical high value.

5.VIH and VOH may experience excursions above VTT.

6.Leakage to VSS with land held at VTT.

Datasheet

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Contents Intel Pentium D Processor 800Δ Sequence DatasheetContents Contents Halt and Enhanced Halt Powerdown States Figures Tables Initial release May Revision HistoryRevision Description Date Contents Intel Pentium D Processor 800 Sequence Features Contents Introduction Processor Packaging Terminology TerminologyReferences ReferencesIntroduction Power and Ground Lands Electrical SpecificationsDecoupling Guidelines VCC DecouplingFSB Decoupling Voltage IdentificationVID5 VID4 VID3 VID2 VID1 VID0 Voltage Identification DefinitionReserved, Unused, FC and Testhi Signals DC Voltage and Current Specifications Voltage and Current SpecificationsSymbol Parameter Min Max Unit Absolute Maximum and Minimum RatingsSymbol Parameter Min Typ Max Unit Voltage and Current SpecificationsVID Vttout ICC000 Icc a Voltage Deviation from VID Setting V 1, 2065 072Icc a 007 026 000 019013 033 020 040Icc a VCC Overshoot Specifications VCC Overshoot SpecificationMagnitude of V CC overshoot above VID 050 Time duration of V CC overshoot above VIDDie Voltage Validation Signaling SpecificationsFSB Signal Groups Signal Group FSB Signal GroupsSignals Signals Associated StrobeSignal Reference Voltages 2 GTL+ Asynchronous SignalsSignal Characteristics 10. BSEL20 and VID50 Signal Group DC Specifications FSB DC Specifications11. GTL+ Signal Group DC Specifications Symbol Parameter Max Unit13. GTL+ Asynchronous Signal Group DC Specifications 12. Pwrgood Input and TAP Signal Group DC Specifications15. Bootselect and MSID10 DC Specifications 14. Vttpwrgd DC SpecificationsSymbol Parameter Min Typ Max Units 16. GTL+ Bus Voltage DefinitionsFSB Frequency Select Signals Clock Specifications17. Core Frequency to FSB Multiplier Configuration FSB Clock BCLK10 and Processor Clocking18. BSEL20 Frequency Table for BCLK10 Phase Lock Loop PLL and FilterFSB Frequency 133 MHzPhase Lock Loop PLL Filter Requirements Package Mechanical Drawing Package Mechanical SpecificationsProcessor Package Drawing Package Mechanical Specifications Package Mechanical Specifications Processor Loading Specifications Package Loading SpecificationsProcessor Component Keep-Out Zones Package Handling GuidelinesProcessor Mass Specification Package Insertion SpecificationsProcessor Materials Processor MarkingsProcessor Top-Side Marking Example Intel Pentium D Processor Processor Land Coordinates, Top View Processor Land CoordinatesProcessor Land Assignments Land Listing and Signal DescriptionsLandout Diagram Top View Left Side Landout Diagram Top View Right Side Alphabetical Land Assignments Land Name Signal Buffer Direction TypeDBI0# GTLREF1 VCC AC8 VCC AK8 Vccmb AN5 VSS AA3 VSS AJ4 E11 Power/Other Vssmb AN6 Numerical Land Assignment Land Land Name Signal Buffer Direction TypeReserved ADS# Reserved DEFER# J12 N30 AA1 Vttoutright AD4 VSS AH1 VSS AK2 VSS AN1 VSS Signal Description Sheet 1 Alphabetical Signals ReferenceRequest Signals Name Type DescriptionName Signal Description Sheet 2Data Group Signal Description Sheet 3Bus Signal Data Bus Signals Signal Description Sheet 4 Signal Description Sheet 5 Pwrgood Signal Description Sheet 6RESET# Signal Description Sheet 7 Signal Description Sheet 8 Land Listing and Signal Descriptions Thermal Specifications Thermal Specifications and Design ConsiderationsProcessor Thermal Specifications GHz Processor Thermal SpecificationsMinimum Maximum T C C Thermal Profile for the Pentium D Processor with PRB=1 Power Maximum T CThermal Profile for the Pentium D Processor with PRB=0 PowerThermal Monitor Processor Thermal FeaturesThermal Metrology PROCHOT# Signal On-Demand ModeFORCEPR# Signal Pin Tcontrol and Fan Speed Reduction THERMTRIP# SignalThermal Diode Thermal Diode ParametersDiode anode Signal Name Land Number Signal DescriptionThermal Diode Interface Thermal Specifications and Design Considerations Power-On Configuration Options FeaturesClock Control and Low Power States Power-On Configuration Option SignalsNormal State Halt and Enhanced Halt Powerdown StatesStop-Grant State Enhanced Halt Powerdown StateEnhanced Intel SpeedStep Technology Enhanced Halt Snoop or Halt Snoop State, Grant Snoop StateMechanical Representation of the Boxed Processor Boxed Processor SpecificationsBoxed Processor Cooling Solution Dimensions Mechanical SpecificationsElectrical Requirements Boxed Processor Fan Heatsink WeightFan Heatsink Power Supply +12 V 12 volt fan power supply Fan Heatsink Power and Signal SpecificationsDescription Min Typ Max Unit Sense frequencyBoxed Processor Cooling Requirements Thermal SpecificationsBoxed Processor Specifications Fan operates at its highest speed Variable Speed FanBoxed Processor Fan Boxed Processor Fan Speed Boxed Processor Specifications Mechanical Representation of the Boxed Processor Cooling Solution Dimensions Boxed Processor Support and Retention Module SRM Assembly Stack Including the Support and Retention ModuleControl Sense Sense frequencyDatasheet 101 Boxed Processor Boxed Processor Fan Speed Boxed Processor TMA Set PointsDatasheet 103 104 Logic Analyzer Interface LAI Debug Tools SpecificationsMechanical Considerations Electrical Considerations106

830 specifications

The Intel 830 chipset, introduced in the early 2000s, marked a significant evolution in Intel's chipset architecture for desktop and mobile computing. Known for its support of the Pentium 4 processors, the 830 chipset was tailored for both performance and stability, making it an appealing choice for OEMs and enthusiasts alike.

One of the standout features of the Intel 830 chipset is its support for DDR SDRAM, providing a much-needed boost in memory bandwidth compared to its predecessors. With dual-channel memory support, the chipset could utilize two memory modules simultaneously, which effectively doubled the data transfer rate and enhanced overall system performance. This made the Intel 830 particularly beneficial for applications requiring high memory throughput, such as multimedia processing and gaming.

Another important characteristic of the Intel 830 was its integrated graphics support, featuring Intel's Extreme Graphics technology. This integration allowed for decent graphics performance without the need for a dedicated GPU, making it suitable for budget systems and everyday computing tasks. However, for power users and gaming enthusiasts, the option to incorporate a discrete graphics card remained available through the provided PCI Express x16 slot.

The Intel 830 chipset also boasted advanced I/O capabilities, including support for USB 2.0, which provided faster data transfer rates compared to USB 1.1, and enhanced IDE interfaces for connecting hard drives and optical devices. With its Hyper-Threading technology support, the chipset allowed for improved multitasking efficiency, enabling a single processor to execute multiple threads simultaneously, a feature that was particularly beneficial in server environments and complex computing tasks.

In terms of connectivity, the Intel 830 supported multiple bus interfaces, including PCI Express and AGP, thereby enabling users to expand their systems with various add-on cards. This flexibility contributed to the chipset's longevity in the marketplace, as it catered to a wide range of user needs from light computing to intensive gaming and content creation.

In summary, the Intel 830 chipset combined enhanced memory capabilities, integrated graphics performance, robust I/O features, and flexible expansion options, making it a versatile choice for various computing environments during its time. It played a key role in shaping the landscape of early 2000s computing, paving the way for future advancements in chipset technology. Its legacy continues to influence modern computing architectures, illustrating the lasting impact of Intel’s innovative design principles.
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