Intel 830 manual Processor Thermal Features, Thermal Metrology, Thermal Monitor

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Thermal Specifications and Design Considerations

5.1.2Thermal Metrology

The maximum and minimum case temperatures (TC) are specified in Table 5-1. These temperature specifications are meant to help ensure proper operation of the processor. Figure 5-3illustrates where Intel recommends TC thermal measurements should be made. For detailed guidelines on temperature measurement methodology, refer to the Intel® Pentium® D Processor and Intel® Pentium® Processor Extreme Edition 840 Thermal and Mechanical Design Guidelines.

Figure 5-3. Case Temperature (TC) Measurement Location

37.5 mm

Measure TC at this point

(geometric center of the package)

37.5mm

5.2Processor Thermal Features

5.2.1Thermal Monitor

The Thermal Monitor feature helps control the processor temperature by activating the TCC when the processor silicon reaches its maximum operating temperature. The TCC reduces processor power consumption as needed by modulating (starting and stopping) the internal processor core clocks. The Thermal Monitor feature must be enabled for the processor to be operating within specifications. The temperature at which Thermal Monitor activates the thermal control circuit is not user configurable and is not software visible. Bus traffic is snooped in the normal manner, and interrupt requests are latched (and serviced during the time that the clocks are on) while the TCC is active.

When the Thermal Monitor feature is enabled, and a high temperature situation exists (i.e., TCC is active), the clocks will be modulated by alternately turning the clocks off and on at a duty cycle specific to the processor (typically 30–50%). Clocks often will not be off for more than

3.0microseconds when the TCC is active. Cycle times are processor speed dependent and will

decrease as processor core frequencies increase. A small amount of hysteresis has been included to prevent rapid active/inactive transitions of the TCC when the processor temperature is near its maximum operating temperature. Once the temperature has dropped below the maximum operating temperature, and the hysteresis timer has expired, the TCC goes inactive and clock modulation ceases.

Datasheet

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Contents Intel Pentium D Processor 800Δ Sequence DatasheetContents Contents Halt and Enhanced Halt Powerdown States Figures Tables Revision Description Date Revision HistoryInitial release May Contents Intel Pentium D Processor 800 Sequence Features Contents Introduction Processor Packaging Terminology TerminologyReferences ReferencesIntroduction VCC Decoupling Electrical SpecificationsPower and Ground Lands Decoupling GuidelinesFSB Decoupling Voltage IdentificationVID5 VID4 VID3 VID2 VID1 VID0 Voltage Identification DefinitionReserved, Unused, FC and Testhi Signals Absolute Maximum and Minimum Ratings Voltage and Current SpecificationsDC Voltage and Current Specifications Symbol Parameter Min Max UnitVttout ICC Voltage and Current SpecificationsSymbol Parameter Min Typ Max Unit VID072 Icc a Voltage Deviation from VID Setting V 1, 2000 065Icc a 020 040 000 019007 026 013 033Icc a Time duration of V CC overshoot above VID VCC Overshoot SpecificationVCC Overshoot Specifications Magnitude of V CC overshoot above VID 050FSB Signal Groups Signaling SpecificationsDie Voltage Validation Signals Associated Strobe FSB Signal GroupsSignal Group SignalsSignal Characteristics 2 GTL+ Asynchronous SignalsSignal Reference Voltages Symbol Parameter Max Unit FSB DC Specifications10. BSEL20 and VID50 Signal Group DC Specifications 11. GTL+ Signal Group DC Specifications13. GTL+ Asynchronous Signal Group DC Specifications 12. Pwrgood Input and TAP Signal Group DC Specifications16. GTL+ Bus Voltage Definitions 14. Vttpwrgd DC Specifications15. Bootselect and MSID10 DC Specifications Symbol Parameter Min Typ Max UnitsFSB Clock BCLK10 and Processor Clocking Clock SpecificationsFSB Frequency Select Signals 17. Core Frequency to FSB Multiplier Configuration133 MHz Phase Lock Loop PLL and Filter18. BSEL20 Frequency Table for BCLK10 FSB FrequencyPhase Lock Loop PLL Filter Requirements Package Mechanical Drawing Package Mechanical SpecificationsProcessor Package Drawing Package Mechanical Specifications Package Mechanical Specifications Package Handling Guidelines Package Loading SpecificationsProcessor Loading Specifications Processor Component Keep-Out ZonesProcessor Markings Package Insertion SpecificationsProcessor Mass Specification Processor MaterialsProcessor Top-Side Marking Example Intel Pentium D Processor Processor Land Coordinates, Top View Processor Land CoordinatesProcessor Land Assignments Land Listing and Signal DescriptionsLandout Diagram Top View Left Side Landout Diagram Top View Right Side Alphabetical Land Assignments Land Name Signal Buffer Direction TypeDBI0# GTLREF1 VCC AC8 VCC AK8 Vccmb AN5 VSS AA3 VSS AJ4 E11 Power/Other Vssmb AN6 Numerical Land Assignment Land Land Name Signal Buffer Direction TypeReserved ADS# Reserved DEFER# J12 N30 AA1 Vttoutright AD4 VSS AH1 VSS AK2 VSS AN1 VSS Name Type Description Alphabetical Signals ReferenceSignal Description Sheet 1 Request SignalsName Signal Description Sheet 2Bus Signal Data Bus Signals Signal Description Sheet 3Data Group Signal Description Sheet 4 Signal Description Sheet 5 RESET# Signal Description Sheet 6Pwrgood Signal Description Sheet 7 Signal Description Sheet 8 Land Listing and Signal Descriptions Processor Thermal Specifications Thermal Specifications and Design ConsiderationsThermal Specifications Minimum Maximum T C C Processor Thermal SpecificationsGHz Thermal Profile for the Pentium D Processor with PRB=1 Power Maximum T CThermal Profile for the Pentium D Processor with PRB=0 PowerThermal Metrology Processor Thermal FeaturesThermal Monitor PROCHOT# Signal On-Demand ModeFORCEPR# Signal Pin Thermal Diode Parameters THERMTRIP# SignalTcontrol and Fan Speed Reduction Thermal DiodeThermal Diode Interface Signal Name Land Number Signal DescriptionDiode anode Thermal Specifications and Design Considerations Power-On Configuration Option Signals FeaturesPower-On Configuration Options Clock Control and Low Power StatesNormal State Halt and Enhanced Halt Powerdown StatesStop-Grant State Enhanced Halt Powerdown StateEnhanced Intel SpeedStep Technology Enhanced Halt Snoop or Halt Snoop State, Grant Snoop StateMechanical Representation of the Boxed Processor Boxed Processor SpecificationsBoxed Processor Cooling Solution Dimensions Mechanical SpecificationsFan Heatsink Power Supply Boxed Processor Fan Heatsink WeightElectrical Requirements Sense frequency Fan Heatsink Power and Signal Specifications+12 V 12 volt fan power supply Description Min Typ Max UnitBoxed Processor Cooling Requirements Thermal SpecificationsBoxed Processor Specifications Boxed Processor Fan Boxed Processor Fan Speed Variable Speed FanFan operates at its highest speed Boxed Processor Specifications Mechanical Representation of the Boxed Processor Cooling Solution Dimensions Boxed Processor Support and Retention Module SRM Assembly Stack Including the Support and Retention ModuleControl Sense Sense frequencyDatasheet 101 Boxed Processor Boxed Processor Fan Speed Boxed Processor TMA Set PointsDatasheet 103 104 Electrical Considerations Debug Tools SpecificationsLogic Analyzer Interface LAI Mechanical Considerations106

830 specifications

The Intel 830 chipset, introduced in the early 2000s, marked a significant evolution in Intel's chipset architecture for desktop and mobile computing. Known for its support of the Pentium 4 processors, the 830 chipset was tailored for both performance and stability, making it an appealing choice for OEMs and enthusiasts alike.

One of the standout features of the Intel 830 chipset is its support for DDR SDRAM, providing a much-needed boost in memory bandwidth compared to its predecessors. With dual-channel memory support, the chipset could utilize two memory modules simultaneously, which effectively doubled the data transfer rate and enhanced overall system performance. This made the Intel 830 particularly beneficial for applications requiring high memory throughput, such as multimedia processing and gaming.

Another important characteristic of the Intel 830 was its integrated graphics support, featuring Intel's Extreme Graphics technology. This integration allowed for decent graphics performance without the need for a dedicated GPU, making it suitable for budget systems and everyday computing tasks. However, for power users and gaming enthusiasts, the option to incorporate a discrete graphics card remained available through the provided PCI Express x16 slot.

The Intel 830 chipset also boasted advanced I/O capabilities, including support for USB 2.0, which provided faster data transfer rates compared to USB 1.1, and enhanced IDE interfaces for connecting hard drives and optical devices. With its Hyper-Threading technology support, the chipset allowed for improved multitasking efficiency, enabling a single processor to execute multiple threads simultaneously, a feature that was particularly beneficial in server environments and complex computing tasks.

In terms of connectivity, the Intel 830 supported multiple bus interfaces, including PCI Express and AGP, thereby enabling users to expand their systems with various add-on cards. This flexibility contributed to the chipset's longevity in the marketplace, as it catered to a wide range of user needs from light computing to intensive gaming and content creation.

In summary, the Intel 830 chipset combined enhanced memory capabilities, integrated graphics performance, robust I/O features, and flexible expansion options, making it a versatile choice for various computing environments during its time. It played a key role in shaping the landscape of early 2000s computing, paving the way for future advancements in chipset technology. Its legacy continues to influence modern computing architectures, illustrating the lasting impact of Intel’s innovative design principles.
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