Analog Devices ADSP-TS201S specifications Operating Conditions, Sclkvref

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ADSP-TS201S

ADSP-TS201S—SPECIFICATIONS

Note that component specifications are subject to change with- out notice. For information on link port electrical characteristics, see Link Port Low Voltage, Differential-Signal (LVDS) Electrical Characteristics, and Timing on Page 30.

OPERATING CONDITIONS

Parameter

Description

Test Conditions

Grade1

Min

Typ

Max

Unit

 

 

 

 

 

 

 

 

VDD

Internal Supply Voltage

@ CCLK = 600 MHz

060

1.14

1.20

1.26

V

 

 

@ CCLK = 500 MHz

050

1.00

1.05

1.10

V

VDD_A

Analog Supply Voltage

@ CCLK = 600 MHz

060

1.14

1.20

1.26

V

 

 

@ CCLK = 500 MHz

050

1.00

1.05

1.10

V

VDD_IO

I/O Supply Voltage

 

(all)

2.38

2.50

2.63

V

VDD_DRAM

Internal DRAM Supply Voltage

@ CCLK = 600 MHz

060

1.52

1.60

1.68

V

 

 

@ CCLK = 500 MHz

050

1.425

1.500

1.575

V

TCASE

Case Operating Temperature

 

A

–40

 

+85

°C

TCASE

Case Operating Temperature

 

W

–40

 

+105

°C

VIH1

High Level Input Voltage2, 3

@ VDD, VDD_IO = Max

(all)

1.7

 

3.63

V

VIH2

High Level Input Voltage3, 4

@ VDD, VDD_IO = Max

(all)

1.9

 

3.63

V

VIL

Low Level Input Voltage3, 5

@ VDD, VDD_IO = Min

(all)

–0.33

 

+0.8

V

IDD

VDD Supply Current, Typical Activity6

@ CCLK = 600 MHz, VDD = 1.20 V, TCASE = 25°C

060

 

2.90

 

A

 

 

@ CCLK = 500 MHz, VDD = 1.05 V, TCASE = 25°C

050

 

2.06

 

A

IDD_A

VDD_A Supply Current, Typical Activity

@ CCLK = 600 MHz, VDD = 1.20 V, TCASE = 25°C

060

 

25

55

mA

 

 

@ CCLK = 500 MHz, VDD = 1.05 V, TCASE = 25°C

050

 

20

50

mA

IDD_IO

VDD_IO Supply Current, Typical Activity6

@ SCLK = 62.5 MHz, VDD_IO = 2.5 V, TCASE = 25°C

(all)

 

0.15

 

A

IDD_DRAM

VDD_DRAM Supply Current, Typical Activity6

@ CCLK = 600 MHz, VDD_DRAM = 1.6 V, TCASE = 25°C

060

 

0.28

0.43

A

 

 

@ CCLK = 500 MHz, VDD_DRAM = 1.5 V, TCASE = 25°C

050

 

0.25

0.40

A

VREF

Voltage Reference

 

(all)

(VDD_IO ×0.56)±5%

V

SCLK_VREF

Voltage Reference

 

(all)

(VCLOCK_DRIVE × 0.56) ±5%

V

 

 

 

 

 

 

 

 

1Specifications vary for different grades (for example, SABP-060, SABP-050, SWBP-050). For more information on part grades, see Ordering Guide on Page 46.

2VIH1 specification applies to input and bidirectional pins: SCLKRAT2–0, SCLK, ADDR31–0, DATA63–0, RD, WRL, WRH, ACK, BRST, BR7–0, BOFF, HBR, HBG, MSSD3–0, RAS, CAS, SDCKE, SDWE, TCK, FLAG3–0, DS2–0, ENEDREG.

3Values represent dc case. During transitions, the inputs may overshoot or undershoot to the voltage shown in Table 18, based on the transient duty cycle. The dc case is equivalent to 100% duty cycle.

4VIH2 specification applies to input and bidirectional pins: TDI, TMS, TRST, CIMP1–0, ID2–0, LxBCMPI, LxACKI, POR_IN, RST_IN, IRQ3–0, CPA, DPA, DMAR3–0.

5 Applies to input and bidirectional pins.

6 For details on internal and external power calculation issues, including other operating conditions, see the EE-170, Estimating Power for the ADSP-TS201Son the Analog Devices website.

Rev. C Page 21 of 48 December 2006

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Contents ADSP-TS201S ADSP-TS201S Clock General-Purpose Algorithm Benchmarks at 600 MHzBenchmark Speed Cycles FIR filter per real tap 83 nsDual Compute Blocks Data Alignment Buffer DABDual Integer ALU Ialu DSP Memory Program SequencerInterrupt Controller Flexible Instruction SetInternal Space External Port OFF-CHIP MEMORY/PERIPHERALS InterfaceHost Interface DMA ControllerMultiprocessor Interface Sdram ControllerDMA controller provides these additional features Reset and Booting Timer and GENERAL-PURPOSE I/ONo Boot, Run from Memory Addresses Link Ports LvdsPower Domains Filtering Reference Voltage and ClocksDevelopment Tools Additional Information Evaluation KITSignal Type Term Description Pin Definitions-Clocks and ResetSclk Ratio RatioACK T/OD Pin Definitions-External Port Bus ControlsPin Definitions-External Port Arbitration Signal TypeDSP performs DMA transfers according to the DMA Pin Definitions-External Port DMA/FlybySample the data instead of the TigerSHARC MakesLdqm Pin Definitions-External Port Sdram ControllerHdqm SDA10Pin Definitions-JTAG Port Signal Type Term Description Pin Definitions-Flags, Interrupts, and TimerCONTROLIMP0 Pin Definitions-Link PortsCONTROLIMP1 DS1Driver Mode Pin Definitions-Power, Ground, and ReferenceDS2-0 Drive Output Pins Strength Impedance Impedance Control SelectionPin Definitions-I/O Strap Pins Type at Signal ResetPin Rstin = Sclkvref Operating ConditionsMaximum Duty Cycle for Input Transient Voltage Electrical CharacteristicsMaximum Duty VIN Max VIN Min Cycle2ESD Sensitivity Package InformationAbsolute Maximum Ratings Package Brand InformationAC Asynchronous Signal Specifications Timing SpecificationsGeneral AC Timing Reference Clocks-Core Clock Cclk Cycle TimeReference Clocks-JTAG Test Clock TCK Cycle Time Reference Clocks-System Clock Sclk Cycle TimeSclkrat = 5⋅, 7⋅ Parameter Description Min Max Unit Parameter Description Min Max UnitPower-Up Reset Timing Power-Up Timing1On-Chip Dram Refresh1 Normal Reset TimingOutputDisable Max AC Signal SpecificationsStrap Pins DS2-0 Static Pins-Must Be ConstantJtag SYS 11 Jtag System Pins +2.5 +10.0 +12.0 Strap SYS 9Link Port Lvds Receive Electrical Characteristics Link Port Lvds Transmit Electrical CharacteristicsParameter Description Test Conditions Min Max Unit VODParameter Description Min Max Unit Link Port-Data Out TimingLink Ports-Output Clock Link Ports-Transmission End and Stops LxBCMPI Hold Figure Link Port-Data In TimingLink Ports-Data Input Setup and Hold1 Typical Drive Currents at Strength Output Drive CurrentsTest Conditions Output Disable TimeCapacitive Loading Output Enable TimeTimes Andfall Rise Fall Time Thermal Characteristics for 25 mm × 25 mm Package Thermal CharacteristicsEnvironmental Conditions Parameter Condition Typical UnitBall Bgaed PIN Configurations Ball 25 mm × 25 mm Bgaed Ball Assignments Ball No Signal NameL0ACKO Sdcke SCLKRAT1L0DATI1N L0DATI3NID2 TDI TMR0E DS2 Enedreg TCKDS1 CONTROLIMP1 TDO FLAG3 L1CLKINNBGA Data for Use with Surface Mount Design Surface Mount DesignPackage Ball Attach Type Solder Mask Opening Ball Pad Size Ball Bgaed Nonsolder Mask Defined Nsmd Mm diameter BP-576Temperature Instruction On-Chip Package Model Range1 Rate2 Ordering GuideOperating Voltage Option Description Rev. C Page 47 of 48 December Rev. C Page 48 of 48 December