Analog Devices ADSP-TS201S Package Information, ESD Sensitivity, Absolute Maximum Ratings

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ADSP-TS201S

PACKAGE INFORMATION

The information presented in Figure 8 provide details about the package branding for the ADSP-TS201S processors. For a com- plete listing of product availability, see Ordering Guide on Page 46.

a

ADSP-TS20xS

tppZ-ccc

LLLLLLLLL-L 2.0

yyww country_of_origin

Tvvvvv

Figure 8. Typical Package Brand

Table 19. Package Brand Information

Brand Key	Field Description
t	Temperature Range
pp	Package Type
Z	Lead Free Option (optional)
ccc	See Ordering Guide
LLLLLLLLL-L	Silicon Lot Number
R.R	Silicon Revision
yyww	Date Code
vvvvvv	Assembly Lot Code

ESD SENSITIVITY

ESD (electrostatic discharge) sensitive device.

Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary circuitry, damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions should be take to avoid performance degradation or loss of functionality.

ABSOLUTE MAXIMUM RATINGS

Stresses greater than those listed below may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions greater than those indicated in the operational sections of this specifica- tion is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Table 20. Absolute Maximum Ratings

Parameter	Rating
Internal (Core) Supply Voltage (VDD)	–0.3 V to +1.4 V
Analog (PLL) Supply Voltage (VDD_A)	–0.3 V to +1.4 V
External (I/O) Supply Voltage (VDD_IO)	–0.3 V to +3.5 V
External (DRAM) Supply Voltage (VDD_DRAM)	–0.3 V to +2.1 V
Input Voltage1	–0.63 V to +3.93 V
Output Voltage Swing	–0.5 V to VDD_IO +0.5 V
Storage Temperature Range	–65°C to +150°C

1Applies to 10% transient duty cycle. For other duty cycles see Table 18.

Rev. C Page 23 of 48 December 2006

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Contents ADSP-TS201S ADSP-TS201S FIR filter per real tap 83 ns General-Purpose Algorithm Benchmarks at 600 MHzClock Benchmark Speed CyclesDual Integer ALU Ialu Dual Compute BlocksData Alignment Buffer DAB Flexible Instruction Set Program SequencerDSP Memory Interrupt ControllerInternal Space External Port OFF-CHIP MEMORY/PERIPHERALS InterfaceSdram Controller DMA ControllerHost Interface Multiprocessor InterfaceDMA controller provides these additional features Link Ports Lvds Timer and GENERAL-PURPOSE I/OReset and Booting No Boot, Run from Memory AddressesDevelopment Tools Power DomainsFiltering Reference Voltage and Clocks Additional Information Evaluation KITRatio Pin Definitions-Clocks and ResetSignal Type Term Description Sclk RatioACK T/OD Pin Definitions-External Port Bus ControlsPin Definitions-External Port Arbitration Signal TypeMakes Pin Definitions-External Port DMA/FlybyDSP performs DMA transfers according to the DMA Sample the data instead of the TigerSHARCSDA10 Pin Definitions-External Port Sdram ControllerLdqm HdqmPin Definitions-JTAG Port Signal Type Term Description Pin Definitions-Flags, Interrupts, and TimerDS1 Pin Definitions-Link PortsCONTROLIMP0 CONTROLIMP1Impedance Control Selection Pin Definitions-Power, Ground, and ReferenceDriver Mode DS2-0 Drive Output Pins Strength ImpedancePin Rstin = Pin Definitions-I/O Strap PinsType at Signal Reset Sclkvref Operating ConditionsVIN Max VIN Min Cycle2 Electrical CharacteristicsMaximum Duty Cycle for Input Transient Voltage Maximum DutyPackage Brand Information Package InformationESD Sensitivity Absolute Maximum RatingsReference Clocks-Core Clock Cclk Cycle Time Timing SpecificationsAC Asynchronous Signal Specifications General AC TimingParameter Description Min Max Unit Reference Clocks-System Clock Sclk Cycle TimeReference Clocks-JTAG Test Clock TCK Cycle Time Sclkrat = 5⋅, 7⋅ Parameter Description Min Max UnitPower-Up Reset Timing Power-Up Timing1On-Chip Dram Refresh1 Normal Reset TimingOutputDisable Max AC Signal SpecificationsStrap SYS 9 DS2-0 Static Pins-Must Be ConstantStrap Pins Jtag SYS 11 Jtag System Pins +2.5 +10.0 +12.0VOD Link Port Lvds Transmit Electrical CharacteristicsLink Port Lvds Receive Electrical Characteristics Parameter Description Test Conditions Min Max UnitParameter Description Min Max Unit Link Port-Data Out TimingLink Ports-Output Clock Link Ports-Transmission End and Stops LxBCMPI Hold Figure Link Port-Data In TimingLink Ports-Data Input Setup and Hold1 Typical Drive Currents at Strength Output Drive CurrentsTest Conditions Output Disable TimeCapacitive Loading Output Enable TimeTimes Andfall Rise Fall Time Parameter Condition Typical Unit Thermal CharacteristicsThermal Characteristics for 25 mm × 25 mm Package Environmental ConditionsBall Bgaed PIN Configurations Ball 25 mm × 25 mm Bgaed Ball Assignments Ball No Signal NameL0DATI3N Sdcke SCLKRAT1L0ACKO L0DATI1NL1CLKINN DS2 Enedreg TCKID2 TDI TMR0E DS1 CONTROLIMP1 TDO FLAG3Ball Bgaed Nonsolder Mask Defined Nsmd Mm diameter BP-576 Surface Mount DesignBGA Data for Use with Surface Mount Design Package Ball Attach Type Solder Mask Opening Ball Pad SizeOperating Voltage Option Description Temperature Instruction On-Chip Package Model Range1 Rate2Ordering Guide Rev. C Page 47 of 48 December Rev. C Page 48 of 48 December