Analog Devices ADSP-TS201S specifications Environmental Conditions, Thermal Characteristics

Page 40

ADSP-TS201S

ENVIRONMENTAL CONDITIONS

The ADSP-TS201S processor is rated for performance under

TCASE environmental conditions specified in the Operating Con- ditions on Page 21.

Thermal Characteristics

The ADSP-TS201S processor is packaged in a 25 mm × 25 mm, thermally enhanced ball grid array (BGA_ED). The ADSP-TS201S processor is specified for a case temperature

(TCASE). To ensure that the TCASE data sheet specification is not exceeded, a heat sink and/or an air flow source may be required.

Table 34 shows the thermal characteristics of the 25 mm × 25 mm BGA_ED package. All parameters are based on a JESD51-9 four-layer 2s2p board. All data are based on 3 W power dissipation.

Table 34. Thermal Characteristics for 25 mm × 25 mm Package

Parameter	Condition	Typical	Unit
θJA1	Airflow = 0 m/s	12.92	°C/W
	Airflow = 1 m/s	10.2	°C/W
	Airflow = 2 m/s	9.0	°C/W
	Airflow = 3 m/s	8.0	°C/W
θJB3	—	7.7	°C/W
θJC4	—	0.7	°C/W

1θJA measured per JEDEC standard JESD51-6.

2θJA = 12.9°C/W for 0 m/s is for vertically mounted boards. For horizontally mounted boards, use 17.0°C/W for 0 m/s.

3θJB measured per JEDEC standard JESD51-9.

4θJC measured by cold plate test method (no approved JEDEC standard).

Rev. C Page 40 of 48 December 2006

Image 40

Contents ADSP-TS201S ADSP-TS201S General-Purpose Algorithm Benchmarks at 600 MHz ClockBenchmark Speed Cycles FIR filter per real tap 83 nsData Alignment Buffer DAB Dual Compute BlocksDual Integer ALU Ialu Program Sequencer DSP MemoryInterrupt Controller Flexible Instruction SetExternal Port OFF-CHIP MEMORY/PERIPHERALS Interface Internal SpaceDMA Controller Host InterfaceMultiprocessor Interface Sdram ControllerDMA controller provides these additional features Timer and GENERAL-PURPOSE I/O Reset and BootingNo Boot, Run from Memory Addresses Link Ports LvdsFiltering Reference Voltage and Clocks Power DomainsDevelopment Tools Evaluation KIT Additional InformationPin Definitions-Clocks and Reset Signal Type Term DescriptionSclk Ratio RatioPin Definitions-External Port Bus Controls ACK T/ODSignal Type Pin Definitions-External Port ArbitrationPin Definitions-External Port DMA/Flyby DSP performs DMA transfers according to the DMASample the data instead of the TigerSHARC MakesPin Definitions-External Port Sdram Controller LdqmHdqm SDA10Pin Definitions-Flags, Interrupts, and Timer Pin Definitions-JTAG Port Signal Type Term DescriptionPin Definitions-Link Ports CONTROLIMP0CONTROLIMP1 DS1Pin Definitions-Power, Ground, and Reference Driver ModeDS2-0 Drive Output Pins Strength Impedance Impedance Control SelectionType at Signal Reset Pin Definitions-I/O Strap PinsPin Rstin = Operating Conditions SclkvrefElectrical Characteristics Maximum Duty Cycle for Input Transient VoltageMaximum Duty VIN Max VIN Min Cycle2Package Information ESD SensitivityAbsolute Maximum Ratings Package Brand InformationTiming Specifications AC Asynchronous Signal SpecificationsGeneral AC Timing Reference Clocks-Core Clock Cclk Cycle TimeReference Clocks-System Clock Sclk Cycle Time Reference Clocks-JTAG Test Clock TCK Cycle TimeSclkrat = 5⋅, 7⋅ Parameter Description Min Max Unit Parameter Description Min Max UnitPower-Up Timing1 Power-Up Reset TimingNormal Reset Timing On-Chip Dram Refresh1AC Signal Specifications OutputDisable MaxDS2-0 Static Pins-Must Be Constant Strap PinsJtag SYS 11 Jtag System Pins +2.5 +10.0 +12.0 Strap SYS 9Link Port Lvds Transmit Electrical Characteristics Link Port Lvds Receive Electrical CharacteristicsParameter Description Test Conditions Min Max Unit VODLink Port-Data Out Timing Parameter Description Min Max UnitLink Ports-Output Clock Link Ports-Transmission End and Stops Link Port-Data In Timing LxBCMPI Hold FigureLink Ports-Data Input Setup and Hold1 Output Drive Currents Typical Drive Currents at StrengthOutput Disable Time Test ConditionsOutput Enable Time Capacitive LoadingTimes Andfall Rise Fall Time Thermal Characteristics Thermal Characteristics for 25 mm × 25 mm PackageEnvironmental Conditions Parameter Condition Typical UnitBall Bgaed PIN Configurations Ball No Signal Name Ball 25 mm × 25 mm Bgaed Ball AssignmentsSdcke SCLKRAT1 L0ACKOL0DATI1N L0DATI3NDS2 Enedreg TCK ID2 TDI TMR0EDS1 CONTROLIMP1 TDO FLAG3 L1CLKINNSurface Mount Design BGA Data for Use with Surface Mount DesignPackage Ball Attach Type Solder Mask Opening Ball Pad Size Ball Bgaed Nonsolder Mask Defined Nsmd Mm diameter BP-576Ordering Guide Temperature Instruction On-Chip Package Model Range1 Rate2Operating Voltage Option Description Rev. C Page 47 of 48 December Rev. C Page 48 of 48 December