HP 8559A ABBREVIATIONS, REFERENCE DESIGNATIONS

REPLACEABLEPARTS MODEL8559A

TABLE 6.1. REFERENCEDESIGNATIONSAND ABBREVIATIONS(1OF 3)

........................ Assembly

.............. Attenuator, Isolator,

Limiter, Termination

...................... Fan,Motor

......................... Battery

....................... Capacitor

........................ Coupler

........... Diode, Diode Thyristor,

Step Recovery Diode, Varactor

.............. Directional Coupler

...................... Delay Line

......... Annunc~ator,Lamp, Light

Emitting Diode (LED),

Signaling Device (Visible)

....... MiscellaneousElectrical Part

REFERENCE DESIGNATIONS

F .............................	Fuse
FL ...........................	Filter
HY . . . . . .	. . . . . . . . . . . . . . . Circulator
J ................	ElectricalConnector
K ............................	(Stationary Portion), Jack
	Relay
L .....................	Coil, Inductor
M ...........................	Meter
MP .....	Miscellaneous Mechanical Part
P ...............	ElectricalConnector
	(Movable Portion), Plug
Q .........	Silicon Controlled Rectifier
	(SCR), Transistor,
	Triode Thyristor
R ..........................	Resistor

RT . . . . . . . . . . . . . . . . . . . . . . Thermistor

S ...........................	Switch
T ......................	Transformer
TB ..................	Terminal Board
TC ...................	Thermocouple
TP .......................	Test Point

U...... Integrated Circuit, Microcircuit

V..................... Electron Tube

VR ......... Breakdown Diode (Zener),

Voltage Regulator

W.............. Cable, Wire, Jumper

X........................... Socket

Y.......... Crystal Unit (Piezoelectric,

Quartz)

Z......... Tuned Cavity, Tuned Circuit

ABBREVIATIONS

A ...........	Across Flats, Acrylic, Air
	(Dry Method), Ampere
ADJ .............	Adjust, Adjustment
ANSI .............	American National
	Standards Institute
	(formerly USASI-ASA)
ASSY .....................	Assembly
AWG ............	American Wire Gage
BCD ...........	Binary Coded Decimal
BD ...................	Board, Bundle
BE-CU .............	Beryllium Copper
BNC ..............	Type of Connector
BRG ................	Bearing, Boring
BRS.. ........................	Brass
BSC ..........................	Basic
BTN ........................	Button
C ............	Capacitance, Capacitor,
	Center Tapped, Cermet,
	Cold, Compression
CCP ......	Carbon Composition Plastic
CD ............	Cadmium, Card, Cord
CER .......................	Ceramic
CHAM ....................	Chamfer
CHAR ...................	Character,
	Characteristic, Charcoal
CMOS .........	Complementary Metal
	Oxide Semiconductor
CNDCT ......	Conducting, Conductive,
	Conductivity,Conductor
CONT ..........	Contact, Continuous,
	Control, Controller

CONV.. .................. Converter

CPRSN ................	Compression
CUP-PT ..................	Cup Point
CW .....................	Clockwise,
	Continuous Wave
D ............	Deep, Depletion, Depth,
	Diameter, Direct Current
DA ......................	Darlington
DAP-GL .......	Diallyl Phthalate Glass
DBL ........................	Double
DCDR .....................	Decoder
DEO ........................	Degree
D-HOLE .............	D-Shaped Hole
DIA ......................	Diameter
DIP ............	Dual In-Line Package
DIP-SLDR ................	Dip Solder
D-MODE ............	Depletion Mode
DO .........	Package Type Designation
DP ...........	Deep, Depth, Diametric
	Pitch, Dip
DP3T .............	Double Pole Three
	Throw
DPDT ...........	Double Pole Double
DWL ........................	Throw
	Dowel
E-R .........................	E-Ring
EXT ............	Extended, Extension,
	External, Extinguish
F ..........	Fahrenheit, Farad, Female,
	Film (Resistor), Fixed,
FC ........	Flange, Frequency
	Carbon Film/Composition,

Edge of Cutoff Frequency, Face

FDTHRU	.............. Feed Through
F E M . . ......................	Female
FIL-HD ................	Fillister Head
FL .................	Flash, Flat, Fluid
FLAT-PT	................. Flat Point
FR ...........................	Front
FREQ ....................	Frequency
FT ...........	Current Gain Bandwidth
	Product (Transition Frequency),
	Feet, Foot
FXD .........................	Fixed
GEN .............	General, Generator
GND .......................	Ground
GP ...........	General Purpose, Group
H ......................	Henry,High
HDW ....................	Hardware
HEX .........	Hexadecimal, Hexagon,
	Hexagonal
HLCL ......................	Helical
HP ........	Hewlett-Packard Company,
	High Pass
1C ................	Collector Current,
	Integrated Circuit
ID ..............	Identification, Inside
IF .................	Diameter
	Forward Current,
IN ............................	Intermediate Frequency
	Inch
INCL .....................	Including
INT ........	Integral, Intensity, Internal