General Release Specification — MC68HC05RC16

Section 12. Mechanical Specifications

12.1 Contents

12.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .111

12.328-Pin Plastic Dual-In-Line Package

(Case 710-02) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .112

12.428-Pin Small Outline Integrated Circuit Package

(Case 751F-04) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .112

12.544-Pin Plastic Leaded Chip Carrier Package

(Case 777-02) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .113

12.2 Introduction

This section describes the dimensions of the dual-in-line package (DIP), small outline integrated circuit (SOIC), and plastic leaded chip carrier (PLCC) MCU packages.

The following figures show the latest packages at the time of this publication. To make sure that you have the latest package specifications, contact one of the following:

•Local Motorola Sales Office

•Motorola Mfax

–Phone 602-244-6609

–EMAIL rmfax0@email.sps.mot.com

•Worldwide Web (wwweb) at http://design-net.com

Follow Mfax or wwweb on-line instructions to retrieve the current mechanical specifications.

MC68HC05RC16 — Rev. 3.0

 

General Release Specification

 

 

 

MOTOROLA

Mechanical Specifications

111