CLOCK OSC.

55MHz/

20MHz

Freescale Semiconductor, Inc.

Functional Description

FIGURE 5-1 Clock Distribution Scheme

 

 

 

CY2309

A1

SDRAM1

 

 

 

Zero

MSC8101

 

 

 

A2

 

 

Delay

SDRAM2

 

 

 

Buffer

 

 

CLKIN

CLKOUT

 

 

B1

BCSR

 

 

VCC

 

DLL_IN

 

B2

MICTOR

 

 

 

JP2

VCC/

S2

B3

EXPANSION

 

 

S1

A4

 

 

 

GND

 

 

 

 

 

U44

 

 

Freescale Semiconductor, Inc.

The Zero Delay Buffer CY2309 distributes high speed clock with skew less 250ps when internal PLL is ON. Select inputs S1,S2 allow to the input clock be directly applied to the output with pro- pogation delay of regular clock buffer about 5ns. See available working modes in TABLE 4-2. "JP1/ JP2 Settings".

5•4 Bus Buffering

In order to achieve best performance, it is necessary to reduce the capacitive load over the PPC bus as much as possible. Therefore, the slower devices on the bus, i.e., the Flash SIMM, ATM UNI M/P interface, BCSR and the external tool bus are buffered, while the SDRAM devices are not buffered from the bus.

Buffers are provided over address and strobe (when necessary) lines while transceivers are provided for data. Use is done with 74ALVT buffers (by Philips) which are 3.3V operated and 5V tolerantA and provide bus hold to reduce pull-up/pull-down resistors count (as required by the MSC8101). This type of buffers reduces noise on board due to reduced transition’s amplitude.

To further reduce noise and reflections, serial damping resistors may be added are placed over SDRAM address and all MSC8101 strobe lines.

The data transceivers are open only if there is an access to a validB buffered board address or during Hard - Reset configurationC. That way data conflicts are avoided in case an unbuffered memory read or off-board memory is read - provided that it is not mapped to an address valid on board. It is the users’ responsibility to avoid such errors.

5•5 Chip - Select Generator

The memory controller of the MSC8101 is used as a chip-select generator to access on-board (and off-board) memories, saving board’s area, reducing cost, power consumption and increasing flex- ibility. To enhance off-board application development, memory modules (including the BCSRx) may be disabled via BCSRD in favor of an external memory connected via the expansion connec- tors. That way, a CS line may be used off-board via the expansion connectors, while its associated local memory is disabled.

When a CS region, assigned to a bufferedE memory, is disabled via BCSR, the local data trans-

A. Required for Flash SIMM and BCSR

B. An address which is covered in a Chip-Select region, that controls a buffered device by BCSR logic. C. To allow a configuration word stored in the Flash memory or BCSR to become active.

D. After the BCSR is removed from the local memory map, there is no way to access it but to re-apply power to the MSC8101ADS.

MOTOROLA

MSC8101ADS RevB User’s Manual

43

For More Information On This Product,

Go to: www.freescale.com

Page 43
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Nortel Networks MSC8101 ADS user manual Bus Buffering, Chip Select Generator