Intel 31154 manual Customer Reference Board Stackup, Signal

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Customer Reference Board

The IQ31154 CRB is implemented on eight layers. These layers are detailed in Table 22. This example is provided as a reference; each individual 31154 application may vary.

Table 22.

Customer Reference Board Stackup

 

 

 

 

Layers

Signal

 

 

 

 

Top layer

Signal layer—critical nets (clocks, S/P AD buses)

 

 

 

 

2nd layer

Ground plane

 

 

 

 

3rd layer

Signal layer

 

 

 

 

4th layer

Power plane—(split voltage plane 3.3 and 1.3 for I/O and core)

 

 

 

 

5th layer

Power plane—(also a split voltage plane 5 and 12 V)

 

 

 

 

6th layer

Signal—(some minor 25 mil wide power runs included)

 

 

 

 

7th layer

Ground plane

 

 

 

 

8th layer

Signal layer (critical nets)

 

 

 

FR-4, 0.062 in. ± 0.008, 1.0 oz. copper power/GND; ½ oz. copper signal.

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Intel® 31154 133 MHz PCI Bridge Design Guide Design Guide

Image 60
Contents Intel 31154 133 MHz PCI Bridge Design Guide Design GuideIntel 31154 133 MHz PCI Bridge Design Guide Contents Figures TablesContents Revision History Date Revision Description001 Initial release About This Document Terminology and DefinitionsTerminology and Definition Sheet 1 DefinitionTerminology and Definition Sheet 2 TermISI SHBPCI-to-PCI Bridge Configurations Introduction2Product Overview Intel 31154 133 MHz PCI Bridge ApplicationsFeatures List Features ListRelated External Specifications ReferencesThis page Intentionally Left Blank Package Information Intel 31154 133 MHz PCI Bridge Package Intel 31154 133 MHz PCI Bridge Ball Map-Top View, Left Side Intel 31154 133 MHz PCI Bridge Ball Map-Top View, Right Side Total Signal Count Total Signal CountInterface Signals JtagThis page Intentionally Left Blank Terminations4 Pull-Up/Pull-Down Terminations Sheet 1Secondary PCI Signals Pull-Up/Pull-Down Terminations Sheet 2Pull-Up/Pull-Down Terminations Sheet 3 PCI ClocksPull-Up/Pull-Down Terminations Sheet 4 Hot SwapSarbdisable Pull-Up/Pull-Down Terminations Sheet 5Hardware Straps sampled at the edge of PRST# SarblockPull-Up/Pull-Down Terminations Sheet 6 Serial EepromPull-Up/Pull-Down Terminations Sheet 7 VoltagesMiscellaneous Pull-Up/Pull-Down Terminations Sheet 8 RSTV0RSRV1/CRSTEN SM66ENPull-Up/Pull-Down Terminations Sheet 9 NTMASK#This page Intentionally Left Blank PCI/PCI-X Interface PCI/PCI-X Voltage LevelsInterrupt Routing PCI/PCI-X Voltage LevelsIdsel Lines Primary Idsel LineSecondary Idsel Lines CompactPCI* Hot Swap Mode Select Opaque Memory Region EnableSecondary Idsel Masking Secondary Clock ControlPrimary PCI Clocking Mode Secondary PCI Clocking ModePCI-X Initialization Clocking Modes PCI-X Clocking Modes Secondary Bus Frequency InitializationGND Primary-to-Secondary Frequency Limits PCI-X Initialization PatternClock Frequency MHzRouting Guidelines Crosstalk Crosstalk Effects on Trace Distance and HeightPCB Ground Layout Around Connectors EMI ConsiderationsPower Distribution and Decoupling Pins Voltage Capacitor Value NumberDecoupling Recommendations Intel 31154 133 MHz PCI Bridge Decoupling RecommendationsTrace Impedance This page Intentionally Left Blank PCI-X Layout Guidelines Add-in Card Routing ParametersPCI Clock Layout Guidelines #### PCI-X Topology Layout Guidelines PCI-X Slot GuidelinesWiring Lengths for 133 MHz Slot Single Slot at 133 MHzLower AD Bus Upper AD Bus Segment MaximumWiring Lengths for Embedded 133 MHz Design Lower AD Bus Upper AD BusWiring Lengths for 100 MHz Dual-Slot Dual-Slot at 100 MHzWiring Lengths for Embedded 100 MHz Design Wiring Lengths for 66 MHz Quad-Slot Sheet 1 Quad-Slots at 66 MHzW13 W14Wiring Lengths for 66 MHz Quad-Slot Sheet 2 Wiring Lengths for Embedded 66 MHz Design Minimum LengthEmbedded PCI-X Specification Picmg 1.2 Overview PCI-X at 33 MHzAn Example of an ePCI-X System Wiring Lengths for Picmg 1.2 Backplane Segment AD Bus UnitsPCI-X Clock Wiring Lengths for Picmg Backplane Clock Point to PointThis page Intentionally Left Blank Power Considerations Analog Power PinsPower Sequencing Customer Reference Board EepromCustomer Reference Board Stackup Debug Connectors and Logic Analyzer Connectivity10 Probing PCI-X SignalsLogic Analyzer Pod Frame DevselTrdy BE2Irdy AD31 PCI-X Signal Name § § This page Intentionally Left Blank Thermal Solutions Operational PowerVoltage Maximum Power Thermal Solutions References12 Related DocumentsDesign Reference Material Design Reference MaterialReferences