Intel 31154 manual Pull-Up/Pull-Down Terminations Sheet 9, Ntmask#

Page 27

 

 

 

Terminations

Table 5.

Pull-Up/Pull-Down Terminations (Sheet 9 of 9)

 

 

 

 

Signal

 

Pull-Up/Pull-Down or Termination (See Note 1)

Comments

 

 

 

 

 

 

• When forced retirement of the 31154 internal

• As soon as NT_MASK# is asserted, it must

 

 

request queues and data buffer is not desired

 

 

in the application, this pin must be pulled up to

not be de-asserted until the QE pin is

 

 

3.3 V through an 8.2 Kresistor.

asserted.

NT_MASK#

 

• When forced retirement of the 31154 internal

• NT_MASK# must not be reasserted until the

 

request queues and data buffer is desired in

QE pin is cleared.

 

 

 

 

the application, this pin must be connected to

• Setting the New Transaction Mask bit to 1b in

 

 

external logic (or using the GPIO of the 31154)

VCR0 has the same effect as asserting

 

 

that drives this pin low when masking new

NT_MASK#.

 

 

transactions is desired.

 

 

 

 

 

 

 

Connection depends on application. This is an

NOTE: The state of this output is valid only when

 

 

output signal that indicates the state of the 31154

the NT_MASK# pin is asserted.

QE

 

internal request and data queues. When high, this

 

 

 

signal indicates that the 31154 internal queues are

 

 

 

completely empty.

 

 

 

 

 

SCAN_EN

 

For normal operation, tie low to GND.

 

 

 

 

 

 

 

For normal operation, tie to 0000 or 0111.

 

TMODE[3:0]

 

0 = Pull low to GND.

 

 

1 = Pull high to 3.3 V through an external 8.2 K

 

 

 

 

 

 

resistor.

 

 

 

 

 

NOTES:

1.The recommended value for pull-up resistors for PCI applications is 5.6 K(note that the minimum value for PCI 3.3 V signaling RMIN = 2.42 K, RTYP = 8.2 K, as per the PCI Local Bus Specification, Revision 2.3, section 4.3.3).

2.The recommended value for pull-up resistors for PCI-X applications is 8.2 K. For PCI-X, the minimum pull-up resistor value is 5 K, as per the PCI-X Addendum to the PCI Local Bus Specification, Revision 1.0b, section 9.7.

3.For plug-in card implementations, the pull-up must be on the motherboard.

4.Connect PVIO and SVIO pull-up resistors to 5 V or 3.3 V power supply through an external resistor—25 (5 V) or

0 (3.3 V), depending on the signaling level of the primary/secondary PCI bus. Refer to the power-sequencing guidelines in Section 8.2 on page 58.

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Intel® 31154 133 MHz PCI Bridge Design Guide Design Guide

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Contents Design Guide Intel 31154 133 MHz PCI Bridge Design GuideIntel 31154 133 MHz PCI Bridge Design Guide Contents Tables FiguresContents Revision History Date Revision Description001 Initial release Definition About This DocumentTerminology and Definitions Terminology and Definition Sheet 1SHB Terminology and Definition Sheet 2Term ISIIntel 31154 133 MHz PCI Bridge Applications PCI-to-PCI Bridge ConfigurationsIntroduction2 Product OverviewFeatures List Features ListReferences Related External SpecificationsThis page Intentionally Left Blank Package Information Intel 31154 133 MHz PCI Bridge Package Intel 31154 133 MHz PCI Bridge Ball Map-Top View, Left Side Intel 31154 133 MHz PCI Bridge Ball Map-Top View, Right Side Jtag Total Signal CountTotal Signal Count Interface SignalsThis page Intentionally Left Blank Pull-Up/Pull-Down Terminations Sheet 1 Terminations4Pull-Up/Pull-Down Terminations Sheet 2 Secondary PCI SignalsPCI Clocks Pull-Up/Pull-Down Terminations Sheet 3Hot Swap Pull-Up/Pull-Down Terminations Sheet 4Sarblock SarbdisablePull-Up/Pull-Down Terminations Sheet 5 Hardware Straps sampled at the edge of PRST#Serial Eeprom Pull-Up/Pull-Down Terminations Sheet 6Pull-Up/Pull-Down Terminations Sheet 7 VoltagesMiscellaneous SM66EN Pull-Up/Pull-Down Terminations Sheet 8RSTV0 RSRV1/CRSTENNTMASK# Pull-Up/Pull-Down Terminations Sheet 9This page Intentionally Left Blank PCI/PCI-X Voltage Levels PCI/PCI-X InterfacePCI/PCI-X Voltage Levels Interrupt RoutingIdsel Lines Primary Idsel LineSecondary Idsel Lines Secondary Clock Control CompactPCI* Hot Swap Mode SelectOpaque Memory Region Enable Secondary Idsel MaskingPrimary PCI Clocking Mode Secondary PCI Clocking ModePCI-X Initialization Clocking Modes PCI-X Clocking Modes Secondary Bus Frequency InitializationGND MHz Primary-to-Secondary Frequency LimitsPCI-X Initialization Pattern Clock FrequencyRouting Guidelines Crosstalk Effects on Trace Distance and Height CrosstalkEMI Considerations PCB Ground Layout Around ConnectorsIntel 31154 133 MHz PCI Bridge Decoupling Recommendations Power Distribution and DecouplingPins Voltage Capacitor Value Number Decoupling RecommendationsTrace Impedance This page Intentionally Left Blank Add-in Card Routing Parameters PCI-X Layout GuidelinesPCI Clock Layout Guidelines #### PCI-X Slot Guidelines PCI-X Topology Layout GuidelinesMaximum Wiring Lengths for 133 MHz SlotSingle Slot at 133 MHz Lower AD Bus Upper AD Bus SegmentLower AD Bus Upper AD Bus Wiring Lengths for Embedded 133 MHz DesignDual-Slot at 100 MHz Wiring Lengths for 100 MHz Dual-SlotWiring Lengths for Embedded 100 MHz Design W14 Wiring Lengths for 66 MHz Quad-Slot Sheet 1Quad-Slots at 66 MHz W13Wiring Lengths for 66 MHz Quad-Slot Sheet 2 Minimum Length Wiring Lengths for Embedded 66 MHz DesignPCI-X at 33 MHz Embedded PCI-X Specification Picmg 1.2 OverviewAn Example of an ePCI-X System Segment AD Bus Units Wiring Lengths for Picmg 1.2 BackplaneClock Point to Point PCI-X Clock Wiring Lengths for Picmg BackplaneThis page Intentionally Left Blank Analog Power Pins Power ConsiderationsPower Sequencing Eeprom Customer Reference BoardCustomer Reference Board Stackup Probing PCI-X Signals Debug Connectors and Logic Analyzer Connectivity10Logic Analyzer Pod BE2 FrameDevsel TrdyIrdy AD31 PCI-X Signal Name § § This page Intentionally Left Blank Thermal Solutions Operational PowerVoltage Maximum Power Thermal Solutions Design Reference Material References12Related Documents Design Reference MaterialReferences