Intel 31154 manual Pull-Up/Pull-Down Terminations Sheet 7, Voltages, Miscellaneous

Page 25

 

 

 

 

 

Terminations

Table 5.

Pull-Up/Pull-Down Terminations (Sheet 7 of 9)

 

 

 

 

 

 

 

 

Signal

 

Pull-Up/Pull-Down or Termination (See Note 1)

 

 

Comments

 

 

 

 

 

 

JTAG

 

 

 

 

 

 

 

 

 

 

 

TCK

 

Pull low when not used.

 

 

 

 

 

 

 

 

 

TDI

 

When not used, pull up to 3.3 V through an

 

 

 

 

external 8.2 Kresistor.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

TDO

 

NC when not used

 

 

 

 

 

 

 

 

 

TRST#

 

When not used, pull low to GND through an

 

 

 

 

external 1 Kresistor.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

TMS

 

When not used, pull up to 3.3 V through an

 

 

 

 

external 8.2 Kresistor.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SCAN_EN

 

For normal operation, tie low to GND.

 

 

 

 

 

 

 

 

 

 

 

For normal operation, tie to 0000 or 0111.

 

 

 

TMODE[3:0]

 

0 = Pull low to GND.

 

 

 

 

1 = Pull high to 3.3 V through an external 8.2 K

 

 

 

 

 

 

 

 

 

 

resistor.

 

 

 

 

 

 

 

 

 

Voltages

 

 

 

 

 

 

 

 

 

 

 

 

 

Connect to 1.3 V supply through a low-pass filter to

 

Ensure that the voltage at the input pin is

 

 

reduce noise-induced jitter. The 4.7 F capacitor

 

 

within the min./max. range for S_VCCA

S_VCCA

 

must be low ESR solid tantalum, the 0.01 F

 

 

(1.235 V and 1.365 V).

 

 

capacitor must be of type X7R, and the node

 

For power sequencing, see Section 8.2,

 

 

connecting VCCPLL must be as short as possible.

 

 

“Power Sequencing” on page 58.

 

 

 

 

 

 

 

 

Connect to 1.3 V supply through a low-pass filter to

 

Ensure that the voltage at the input pin is

 

 

reduce noise-induced jitter. The 4.7 F capacitor

 

 

within the min./max. range for P_VCCA

P_VCCA

 

must be low ESR solid tantalum, the 0.01 F

 

 

(1.235 V and 1.365 V).

 

 

capacitor must be of type X7R, and the node

 

For power sequencing, see Section 8.2,

 

 

connecting VCCPLL must be as short as possible.

 

 

“Power Sequencing” on page 58.

 

 

 

 

 

 

VCC

 

Connect to 1.3 V supply.

 

 

 

 

 

 

 

 

 

VCCP

 

Connect to 3.3 V supply.

 

 

 

 

 

 

 

 

 

 

 

Connect to 5 V or 3.3 V power supply through an

 

 

 

PVIO

 

external resistor, depending on the signaling level

 

 

 

 

 

of primary PCI bus (see Note 4).

 

 

 

 

 

 

 

 

 

 

 

Connect to 5 V or 3.3 V power supply through an

 

 

 

SVIO

 

external resistor, depending on the signaling level

 

 

 

 

 

of secondary PCI bus (see Note 4).

 

 

 

 

 

 

 

 

 

Miscellaneous

 

 

 

 

 

 

 

 

 

 

 

R_REF

 

Pull down to GND through an external 30 1%

 

 

 

 

resistor.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

MT0# and MT1#

 

Pull up to 3.3 V through an external 8.2 Kseries

 

 

 

 

resistor.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

NOTES:

1.The recommended value for pull-up resistors for PCI applications is 5.6 K(note that the minimum value for PCI 3.3 V signaling RMIN = 2.42 K, RTYP = 8.2 K, as per the PCI Local Bus Specification, Revision 2.3, section 4.3.3).

2.The recommended value for pull-up resistors for PCI-X applications is 8.2 K. For PCI-X, the minimum pull-up resistor value is 5 K, as per the PCI-X Addendum to the PCI Local Bus Specification, Revision 1.0b, section 9.7.

3.For plug-in card implementations, the pull-up must be on the motherboard.

4.Connect PVIO and SVIO pull-up resistors to 5 V or 3.3 V power supply through an external resistor—25 (5 V) or

0 (3.3 V), depending on the signaling level of the primary/secondary PCI bus. Refer to the power-sequencing guidelines in Section 8.2 on page 58.

Intel® 31154 133 MHz PCI Bridge Design Guide Design Guide

25

Image 25
Contents Design Guide Intel 31154 133 MHz PCI Bridge Design GuideIntel 31154 133 MHz PCI Bridge Design Guide Contents Tables FiguresContents Date Revision Description Revision History001 Initial release Terminology and Definitions About This DocumentTerminology and Definition Sheet 1 DefinitionTerm Terminology and Definition Sheet 2ISI SHBIntroduction2 PCI-to-PCI Bridge ConfigurationsProduct Overview Intel 31154 133 MHz PCI Bridge ApplicationsFeatures List Features ListReferences Related External SpecificationsThis page Intentionally Left Blank Package Information Intel 31154 133 MHz PCI Bridge Package Intel 31154 133 MHz PCI Bridge Ball Map-Top View, Left Side Intel 31154 133 MHz PCI Bridge Ball Map-Top View, Right Side Total Signal Count Total Signal CountInterface Signals JtagThis page Intentionally Left Blank Pull-Up/Pull-Down Terminations Sheet 1 Terminations4Pull-Up/Pull-Down Terminations Sheet 2 Secondary PCI SignalsPCI Clocks Pull-Up/Pull-Down Terminations Sheet 3Hot Swap Pull-Up/Pull-Down Terminations Sheet 4Pull-Up/Pull-Down Terminations Sheet 5 SarbdisableHardware Straps sampled at the edge of PRST# SarblockSerial Eeprom Pull-Up/Pull-Down Terminations Sheet 6Voltages Pull-Up/Pull-Down Terminations Sheet 7Miscellaneous RSTV0 Pull-Up/Pull-Down Terminations Sheet 8RSRV1/CRSTEN SM66ENNTMASK# Pull-Up/Pull-Down Terminations Sheet 9This page Intentionally Left Blank PCI/PCI-X Voltage Levels PCI/PCI-X InterfaceInterrupt Routing PCI/PCI-X Voltage LevelsPrimary Idsel Line Idsel LinesSecondary Idsel Lines Opaque Memory Region Enable CompactPCI* Hot Swap Mode SelectSecondary Idsel Masking Secondary Clock ControlSecondary PCI Clocking Mode Primary PCI Clocking ModePCI-X Initialization Clocking Modes Secondary Bus Frequency Initialization PCI-X Clocking ModesGND PCI-X Initialization Pattern Primary-to-Secondary Frequency LimitsClock Frequency MHzRouting Guidelines Crosstalk Effects on Trace Distance and Height CrosstalkEMI Considerations PCB Ground Layout Around ConnectorsPins Voltage Capacitor Value Number Power Distribution and DecouplingDecoupling Recommendations Intel 31154 133 MHz PCI Bridge Decoupling RecommendationsTrace Impedance This page Intentionally Left Blank Add-in Card Routing Parameters PCI-X Layout GuidelinesPCI Clock Layout Guidelines #### PCI-X Slot Guidelines PCI-X Topology Layout GuidelinesSingle Slot at 133 MHz Wiring Lengths for 133 MHz SlotLower AD Bus Upper AD Bus Segment MaximumLower AD Bus Upper AD Bus Wiring Lengths for Embedded 133 MHz DesignDual-Slot at 100 MHz Wiring Lengths for 100 MHz Dual-SlotWiring Lengths for Embedded 100 MHz Design Quad-Slots at 66 MHz Wiring Lengths for 66 MHz Quad-Slot Sheet 1W13 W14Wiring Lengths for 66 MHz Quad-Slot Sheet 2 Minimum Length Wiring Lengths for Embedded 66 MHz DesignPCI-X at 33 MHz Embedded PCI-X Specification Picmg 1.2 OverviewAn Example of an ePCI-X System Segment AD Bus Units Wiring Lengths for Picmg 1.2 BackplaneClock Point to Point PCI-X Clock Wiring Lengths for Picmg BackplaneThis page Intentionally Left Blank Analog Power Pins Power ConsiderationsPower Sequencing Eeprom Customer Reference BoardCustomer Reference Board Stackup Probing PCI-X Signals Debug Connectors and Logic Analyzer Connectivity10Logic Analyzer Pod Devsel FrameTrdy BE2Irdy AD31 PCI-X Signal Name § § This page Intentionally Left Blank Operational Power Thermal SolutionsVoltage Maximum Power Thermal Solutions Related Documents References12Design Reference Material Design Reference MaterialReferences