2.Remove the heat sink (2).

NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Replacement thermal material is included with the heat sink, processor, and system board spare part kits.

The following illustration shows the replacement thermal material locations. Thermal paste is used on the heat sink (1) and the processor (2).

Reverse this procedure to install the heat sink.

Component replacement procedures

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HP 9470m i7 Win8 D3K33UT#ABA manual