Intel 830 manual Processor Packaging Terminology

Introduction

1.1Terminology

A ‘#’ symbol after a signal name refers to an active low signal, indicating a signal is in the active state when driven to a low level. For example, when RESET# is low, a reset has been requested. Conversely, when NMI is high, a nonmaskable interrupt has occurred. In the case of signals where the name does not imply an active state but describes part of a binary sequence (such as address or data), the ‘#’ symbol implies that the signal is inverted. For example, D[3:0] = ‘HLHL’ refers to a hex ‘A’, and D[3:0]# = ‘LHLH’ also refers to a hex ‘A’ (H= High logic level, L= Low logic level).

“FSB” refers to the interface between the processor and system core logic (a.k.a. the chipset components). The FSB is a multiprocessing interface to processors, memory, and I/O.

1.1.1Processor Packaging Terminology

Commonly used terms are explained here for clarification:

•Intel® Pentium® D processor 800 sequence — Dual-core processor in the FC-LGA4 package with two 1-MB L2 caches.

•Processor — For this document, the term processor is the generic form of the Intel Pentium D processor 800 sequence.

•Keep-out zone — The area on or near the processor that system design can not use.

•Intel® 945G/945GZ/945P/945PL Express Chipset Family — Chipset that supports DDR2 memory technology for the Pentium D processor.

•Intel® 955X Express Chipset — Chipset that supports DDR2 memory technology for the Pentium D processor.

•Processor core — Processor core die with integrated L2 cache.

•FC-LGA4 package — The Pentium D processor is available in a Flip-Chip Land Grid Array 4 package, consisting of a processor core mounted on a substrate with an integrated heat spreader (IHS).

•LGA775 socket — The Pentium D processor mates with the system board through a surface mount, 775-land, LGA socket.

•Integrated heat spreader (IHS) — A component of the processor package used to enhance the thermal performance of the package. Component thermal solutions interface with the processor at the IHS surface.

•Retention mechanism (RM) — Since the LGA775 socket does not include any mechanical features for heatsink attach, a retention mechanism is required. Component thermal solutions should attach to the processor via a retention mechanism that is independent of the socket.

•Storage conditions — Refers to a non-operational state. The processor may be installed in a platform, in a tray, or loose. Processors may be sealed in packaging or exposed to free air. Under these conditions, processor lands should not be connected to any supply voltages, have any I/Os biased, or receive any clocks. Upon exposure to “free air” (i.e., unsealed packaging or a device removed from packaging material) the processor must be handled in accordance with moisture sensitivity labeling (MSL) as indicated on the packaging material.

•Functional operation — Refers to normal operating conditions in which all processor specifications, including DC, AC, system bus, signal quality, mechanical and thermal, are satisfied.

12 Datasheet