Intel 830 3

Datasheet 35

Package Mechanical Specifications

3Package Mechanical

Specifications

The Intel® Pentium® D processor is packaged in a Flip-Chip Land Grid Array (FC-LGA4) package

that interfaces with the motherboard via an LGA775 socket. The package consists of a processor

core mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to the

package substrate and core and serves as the mating surface for processor component thermal

solutions, such as a heatsink. Figure 3-1 shows a sketch of the processor package components and

how they are assembled together. Refer to the LGA775 Socket Mechanical Design Guide for

complete details on the LGA775 socket.

The package components shown in Figure 3-1 include the following:

•Integrated Heat Spreader (IHS)

•Thermal Interface Material (TIM)

•Processor core (die)

•Package substrate

•Capacitors

NOTE:

1. Socket and motherboard are included for reference and are not part of processor package.

3.1 Package Mechanical Drawing

The package mechanical drawings are shown in Figure 3-2 and Figure 3-4. The drawings include

dimensions necessary to design a thermal solution for the processor. These dimensions include:

•Package reference with tolerances (total height, length, width, etc.)

•IHS parallelism and tilt

•Land dimensions

•Top-side and back-side component keep-out dimensions

•Reference datums

•All drawing dimensions are in mm [in].

Note: Guidelines on potential IHS flatness variation with socket load plate actuation and installation of

the cooling solution is available in the processor Thermal/Mechanical Design Guidelines.

Figure 3-1. Processor Package Assembly Sketch

System Board

LGA775 Socket

Capacitors

TIM

Core (die)

IHS

Substrate

P Pk A bl 775

Contents

Main Contents Contents Page Figures Tables Revision History Page Intel Pentium D Processor 800 Sequence Features Page 1 1.1 Terminology 1.1.1 Processor Packaging Terminology Introduction 1.2 References Table 1-1. References Page 2 2.1 Power and Ground Lands 2.2 Decoupling Guidelines 2.2.1 VCC Decoupling 2.2.2 VTT Decoupling 2.3 Voltage Identification Table 2-1. Voltage Identification Definition 2.4 Reserved, Unused, FC and TESTHI Signals 2.5 Voltage and Current Specifications 2.5.1 Absolute Maximum and Minimum Ratings 2.5.2 DC Voltage and Current Specifications Table 2-3. Voltage and Current Specifications Table 2-4. VCC Static and Transient Tolerance for 775_VR_CONFIG_05A Pentium D Processor Figure 2-1. VCC Static and Transient Tolerance for 775_VR_CONFIG_05A Pentium D Processor Table 2-5. VCC Static and Transient Tolerance for 775_VR_CONFIG_05B Pentium D Processor Figure 2-2. VCC Static and Transient Tolerance for 775_VR_CONFIG_05B Pentium D Processor 2.5.3 VCC Overshoot Specification Time Example Overshoot Waveform T VID 2.6 Signaling Specifications 2.6.1 FSB Signal Groups Table 2-7. FSB Signal Groups 2.6.2 GTL+ Asynchronous Signals Table 2-8. Signal Characteristics Table 2-9. Signal Reference Voltages 2.6.3 FSB DC Specifications Table 2-11. GTL+ Signal Group DC Specifications Table 2-12. PWRGOOD Input and TAP Signal Group DC Specifications Table 2-13. GTL+ Asynchronous Signal Group DC Specifications 2.6.3.1 GTL+ Front Side Bus Specifications Table 2-14. VTTPWRGD DC Specifications Table 2-15. BOOTSELECT and MSID[1:0] DC Specifications Table 2-16. GTL+ Bus Voltage Definitions 2.7 Clock Specifications 2.7.1 FSB Clock (BCLK[1:0]) and Processor Clocking 2.7.2 FSB Frequency Select Signals 2.7.3 Phase Lock Loop (PLL) and Filter Figure 2-4. Phase Lock Loop (PLL) Filter Requirements 3 Specifications 3.1 Package Mechanical Drawing Page Page Page 3.2 Processor Component Keep-Out Zones 3.3 Package Loading Specifications 3.4 Package Handling Guidelines 3.5 Package Insertion Specifications 3.6 Processor Mass Specification 3.7 Processor Materials 3.8 Processor Markings Page Package Mechanical Specifications 3.9 Processor Land Coordinates Figure 3-7. Processor Land Coordinates, Top View Socket LGA775 Quadrants Top View V CC / V VTT / Clocks Data 4 Figure 4-1. Landout Diagram (Top View Left Side) Figure 4-2. Landout Diagram (Top View Right Side) Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page 4.2 Alphabetical Signals Reference Table 4-3. Signal Description (Sheet 1 of 8) Table 4-3. Signal Description (Sheet 2 of 8) Table 4-3. Signal Description (Sheet 3 of 8) Table 4-3. Signal Description (Sheet 4 of 8) Table 4-3. Signal Description (Sheet 5 of 8) Table 4-3. Signal Description (Sheet 6 of 8) Table 4-3. Signal Description (Sheet 7 of 8) Table 4-3. Signal Description (Sheet 8 of 8) Page 5 Design Considerations 5.1 Processor Thermal Specifications 5.1.1 Thermal Specifications Page Figure 5-1. Thermal Profile for the Pentium D Processor with PRB=1 Figure 5-2. Thermal Profile for the Pentium D Processor with PRB=0 5.1.2 Thermal Metrology 5.2 Processor Thermal Features 5.2.1 Thermal Monitor 5.2.2 On-Demand Mode 5.2.3 PROCHOT# Signal 5.2.4 FORCEPR# Signal Pin 5.2.5 THERMTRIP# Signal 5.2.6 TCONTROL and Fan Speed Reduction 5.2.7 Thermal Diode Page Page 6 6.1 Power-On Configuration Options 6.2 Clock Control and Low Power States 6.2.1 Normal State 6.2.2 HALT and Enhanced HALT Powerdown States 6.2.2.1 HALT Powerdown State 6.2.2.2 Enhanced HALT Powerdown State 6.2.3 Stop-Grant State 6.2.4 Enhanced HALT Snoop or HALT Snoop State, Grant Snoop State 6.2.4.1 HALT Snoop State, Grant Snoop State 6.2.4.2 Enhanced HALT Snoop State 6.2.5 Enhanced Intel SpeedStep Techn olo gy 7 7.1 Mechanical Specifications 7.1.1 Boxed Processor Cooling Solution Dimensions 7.1.2 Boxed Processor Fan Heatsink Weight 7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly 7.2 Electrical Requirements 7.2.1 Fan Heatsink Power Supply Page 7.3 Thermal Specifications 7.3.1 Boxed Processor Cooling Requirements Page 7.3.2 Variable Speed Fan Page 8 (BTX) Type I Boxed Processor Specifications 8.1 Mechanical Specifications 8.1.1 Cooling Solution Dimensions 8.1.2 Boxed Processor Fan Heatsink Weight 8.1.3 Boxed Processor Support and Retention Module (SRM) 8.2 Electrical Requirements 8.2.1 Fan Heatsink Power Supply Page 8.3 Thermal Specifications 8.3.1 Boxed Processor Cooling Requirements 8.3.2 Variable Speed Fan Page Page 9 9.1 Logic Analyzer Interface (LAI) 9.1.1 Mechanical Considerations 9.1.2 Electrical Considerations