Intel 830 manual Processor Thermal Specifications, Minimum Maximum T C C, GHz

Thermal Specifications and Design Considerations

Refer to the Intel® Pentium® D Processor and Intel® Pentium® Processor Extreme Edition 840 Thermal and Mechanical Design Guidelines and the Processor Power Characterization Methodology for the details of this methodology.

The case temperature is defined at the geometric top center of the processor IHS. Analysis indicates that real applications are unlikely to cause the processor to consume maximum power dissipation for sustained periods of time. Intel recommends that complete thermal solution designs target the Thermal Design Power (TDP) indicated in Table 5-1instead of the maximum processor power consumption. The Thermal Monitor feature is intended to help protect the processor in the unlikely event that an application exceeds the TDP recommendation for a sustained period of time. For more details on the usage of this feature, refer to Section 5.2. In all cases, the Thermal Monitor feature must be enabled for the processor to remain within specification.

Table 5-1. Processor Thermal Specifications

Processor	Core Frequency	Thermal Design	Minimum	Maximum TC (°C)	Notes
Number	(GHz)	Power (W)	TC (°C)
805	2.66 GHz (PRB = 0)	95	5	See Table 5-3and Figure 5-2	1, 2
820	2.80 GHz (PRB = 0)	95	5	See Table 5-3and Figure 5-2	1, 2
830	3 GHz (PRB = 1)	130	5	See Table 5-2and Figure 5-1	1, 2
840	3.20 GHz (PRB = 1)	130	5	See Table 5-2and Figure 5-1	1, 2

NOTES:

1.Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the maximum pow- er that the processor can dissipate.

2.This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP. Therefore, the maximum TC will vary depending on the TDP of the individual processor. Refer to thermal profile figure and associated table for the allowed combinations of power and TC.

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