Electrical Specifications

Table 2-14. VTTPWRGD DC Specifications

Symbol

Parameter

Min

Typ

Max

Unit

Notes

 

 

 

 

 

 

 

VIL

Input Low Voltage

0.3

V

 

VIH

Input High Voltage

0.9

V

 

Table 2-15. BOOTSELECT and MSID[1:0] DC Specifications

Symbol

Parameter

Min

Typ

Max

Unit

Notes

 

 

 

 

 

 

 

VIL

Input Low Voltage

0.24

V

1

 

VIH

Input High Voltage

0.96

V

-

NOTES:

1. These parameters are not tested and are based on design simulations.

2.6.3.1GTL+ Front Side Bus Specifications

In most cases, termination resistors are not required as these are integrated into the processor silicon. See Table 2-8for details on which GTL+ signals do not include on-die termination.

Valid high and low levels are determined by the input buffers by comparing with a reference voltage called GTLREF. Table 2-16lists the GTLREF specifications. The GTL+ reference voltage (GTLREF) must be generated on the motherboard using high precision voltage divider circuits.

Table 2-16. GTL+ Bus Voltage Definitions

Symbol

 

Parameter

Min

Typ

Max

Units

Notes1

GTLREF_PU

GTLREF pull up resistor

124 * 0.99

124

124 * 1.01

Ω

2

 

 

 

 

 

 

 

GTLREF_PD

GTLREF pull down resistor

210 * 0.99

210

210 * 1.01

Ω

2

 

 

 

 

 

 

 

RPULLUP

On die pullup for

500

-

5000

Ω

3

BOOTSELECT signal

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

60

Ω Platform Termination

41

50

58

Ω

4

 

Resistance

 

RTT

 

 

 

 

 

 

 

 

 

 

 

 

50

Ω Platform Termination

37

45

52

Ω

4

 

 

Resistance

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

60

Ω Platform COMP

59.8

60.4

61

Ω

5

 

Resistance

 

COMP[1:0]

 

 

 

 

 

 

 

 

 

 

 

 

50

Ω Platform COMP

49.9 * 0.99

49.9

49.9 * 1.01

Ω

5

 

 

Resistance

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

60

Ω Platform COMP

59.8

60.4

61

Ω

5

 

Resistance

 

COMP[3:2]

 

 

 

 

 

 

 

 

 

 

 

 

50

Ω Platform COMP

49.9 * 0.99

49.9

49.9 * 1.01

Ω

5

 

 

Resistance

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

NOTES:

 

 

 

 

 

 

 

1.Unless otherwise noted, all specifications in this table apply to all processor frequencies.

2.GTLREF is to be generated from VTT by a voltage divider of 1% resistors (one divider for each GTLREF land).

3.These pull-ups are to VTT.

4.RTT is the on-die termination resistance measured at VTT/2 of the GTL+ output driver. The IMPSEL pin is used to select a 50Ω or 60Ω buffer and RTT value.

5.COMP resistance must be provided on the system board with 1% resistors. COMP[1:0] resistors are to VSS. COMP[3:2] resistors are to VSS.

Datasheet

31

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Image 31
Intel 830 manual Vttpwrgd DC Specifications, Bootselect and MSID10 DC Specifications, GTL+ Bus Voltage Definitions

830 specifications

The Intel 830 chipset, introduced in the early 2000s, marked a significant evolution in Intel's chipset architecture for desktop and mobile computing. Known for its support of the Pentium 4 processors, the 830 chipset was tailored for both performance and stability, making it an appealing choice for OEMs and enthusiasts alike.

One of the standout features of the Intel 830 chipset is its support for DDR SDRAM, providing a much-needed boost in memory bandwidth compared to its predecessors. With dual-channel memory support, the chipset could utilize two memory modules simultaneously, which effectively doubled the data transfer rate and enhanced overall system performance. This made the Intel 830 particularly beneficial for applications requiring high memory throughput, such as multimedia processing and gaming.

Another important characteristic of the Intel 830 was its integrated graphics support, featuring Intel's Extreme Graphics technology. This integration allowed for decent graphics performance without the need for a dedicated GPU, making it suitable for budget systems and everyday computing tasks. However, for power users and gaming enthusiasts, the option to incorporate a discrete graphics card remained available through the provided PCI Express x16 slot.

The Intel 830 chipset also boasted advanced I/O capabilities, including support for USB 2.0, which provided faster data transfer rates compared to USB 1.1, and enhanced IDE interfaces for connecting hard drives and optical devices. With its Hyper-Threading technology support, the chipset allowed for improved multitasking efficiency, enabling a single processor to execute multiple threads simultaneously, a feature that was particularly beneficial in server environments and complex computing tasks.

In terms of connectivity, the Intel 830 supported multiple bus interfaces, including PCI Express and AGP, thereby enabling users to expand their systems with various add-on cards. This flexibility contributed to the chipset's longevity in the marketplace, as it catered to a wide range of user needs from light computing to intensive gaming and content creation.

In summary, the Intel 830 chipset combined enhanced memory capabilities, integrated graphics performance, robust I/O features, and flexible expansion options, making it a versatile choice for various computing environments during its time. It played a key role in shaping the landscape of early 2000s computing, paving the way for future advancements in chipset technology. Its legacy continues to influence modern computing architectures, illustrating the lasting impact of Intel’s innovative design principles.