Electrical Specifications

2.4Reserved, Unused, FC and TESTHI Signals

All RESERVED lands must remain unconnected. Connection of these lands to VCC, VSS, VTT, or to any other signal (including each other) can result in component malfunction or incompatibility with future processors. See Chapter 4 for a land listing of the processor and the location of all RESERVED lands.

For reliable operation, always connect unused inputs or bidirectional signals to an appropriate signal level. In a system level design, on-die termination has been included on the Pentium D processor to allow signals to be terminated within the processor silicon. Most unused GTL+ inputs should be left as no connects, as GTL+ termination is provided on the processor silicon. However, see Table 2-8for details on GTL+ signals that do not include on-die termination. Unused active high inputs should be connected through a resistor to ground (VSS). Unused outputs can be left unconnected; however, this may interfere with some test access port (TAP) functions, complicate debug probing, and prevent boundary scan testing. A resistor must be used when tying bidirectional signals to power or ground. When tying any signal to power or ground, a resistor will also allow for system testability. For unused GTL+ inputs or I/O signals, use pull-up resistors of the same value as the on-die termination resistors (RTT). Refer to Table 2-16for more details.

TAP, GTL+ Asynchronous inputs, and GTL+ Asynchronous outputs do not include on-die termination. Inputs and used outputs must be terminated on the system board. Unused outputs may be terminated on the system board or left unconnected. Note that leaving unused outputs unterminated may interfere with some TAP functions, complicate debug probing, and prevent boundary scan testing.

FCx signals are signals that are available for compatibility with other processors.

The TESTHI signals must be tied to the processor VTT using a matched resistor, where a matched resistor has a resistance value within ±20% of the impedance of the board transmission line traces. For example, if the trace impedance is 60 Ω, then a value between 48 Ω and 72 Ω is required.

The TESTHI signals may use individual pull-up resistors or be grouped together as detailed below. A matched resistor must be used for each group:

•TESTHI[1:0]

•TESTHI[7:2]

•TESTHI8 – cannot be grouped with other TESTHI signals

•TESTHI9 – cannot be grouped with other TESTHI signals

•TESTHI10 – cannot be grouped with other TESTHI signals

•TESTHI11 – cannot be grouped with other TESTHI signals

•TESTHI12 – cannot be grouped with other TESTHI signals

•TESTHI13 – cannot be grouped with other TESTHI signals

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Datasheet

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Intel 830 manual Reserved, Unused, FC and Testhi Signals
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830 specifications

The Intel 830 chipset, introduced in the early 2000s, marked a significant evolution in Intel's chipset architecture for desktop and mobile computing. Known for its support of the Pentium 4 processors, the 830 chipset was tailored for both performance and stability, making it an appealing choice for OEMs and enthusiasts alike.

One of the standout features of the Intel 830 chipset is its support for DDR SDRAM, providing a much-needed boost in memory bandwidth compared to its predecessors. With dual-channel memory support, the chipset could utilize two memory modules simultaneously, which effectively doubled the data transfer rate and enhanced overall system performance. This made the Intel 830 particularly beneficial for applications requiring high memory throughput, such as multimedia processing and gaming.

Another important characteristic of the Intel 830 was its integrated graphics support, featuring Intel's Extreme Graphics technology. This integration allowed for decent graphics performance without the need for a dedicated GPU, making it suitable for budget systems and everyday computing tasks. However, for power users and gaming enthusiasts, the option to incorporate a discrete graphics card remained available through the provided PCI Express x16 slot.

The Intel 830 chipset also boasted advanced I/O capabilities, including support for USB 2.0, which provided faster data transfer rates compared to USB 1.1, and enhanced IDE interfaces for connecting hard drives and optical devices. With its Hyper-Threading technology support, the chipset allowed for improved multitasking efficiency, enabling a single processor to execute multiple threads simultaneously, a feature that was particularly beneficial in server environments and complex computing tasks.

In terms of connectivity, the Intel 830 supported multiple bus interfaces, including PCI Express and AGP, thereby enabling users to expand their systems with various add-on cards. This flexibility contributed to the chipset's longevity in the marketplace, as it catered to a wide range of user needs from light computing to intensive gaming and content creation.

In summary, the Intel 830 chipset combined enhanced memory capabilities, integrated graphics performance, robust I/O features, and flexible expansion options, making it a versatile choice for various computing environments during its time. It played a key role in shaping the landscape of early 2000s computing, paving the way for future advancements in chipset technology. Its legacy continues to influence modern computing architectures, illustrating the lasting impact of Intel’s innovative design principles.
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