Intel 830 8.2 Electrical Requirements

Datasheet 99

Balanced Technology Extended (BTX) Type I Boxed Processor Specifications

8.1.3 Boxed Processor Support and Retention Module (SRM)

The boxed processor TMA requires a SRM assembly to attach directly to the chassis base pan and

to secure the processor and TMA in the mainboard socket. The boxed processor TMA will ship

with the heatsink attach clip assembly, duct, and screws for attachment. The SRM must be supplied

by the chassis hardware vendor. See the Support and Retention Module (SRM) External Design

Requirements Document, Balanced Technology Extended (BTX) System Design Guide, and the

Intel® Pentium® D Processor and Intel® Pentium® Processor Extreme Edition 840 Thermal and

Mechanical Design Guidelines for more detailed design information regarding the support and

retention module.

8.2 Electrical Requirements

8.2.1 Fan Heatsink Power Supply

The boxed processor's fan heatsink requires a +12 V power supply. A fan power cable will be

shipped with the boxed processor to draw power from a power header on the baseboard. The power

cable connector and pinout are shown in Figure8-4. Baseboards must provid e a matched po wer

header to support the boxed processor. Table 8- 1 contains specifications for the input and output

signals at the fan heatsink connector.

The fan heatsink outputs a SENSE signal that is an open- collector output that pulses at a rate of

2p ulses per fan revolution. A baseboard pull-up resistor provides VOH to match the system board-

mounted fan speed monitor requirements, if applicable. Use of the SENSE signal is optional. If the

SENSE signal is not used, pin 3 of the connector should be tied to GND.

Figure 8-3. Assembly Stack Including the Support and Retention Module

Thermal Module Assembly

•Heatsink & Fan

• Clip

• Structu ra l D u c t

Motherboard

SRM

Chassis Pan

Contents

Main Contents Contents Page Figures Tables Revision History Page Intel Pentium D Processor 800 Sequence Features Page 1 1.1 Terminology 1.1.1 Processor Packaging Terminology Introduction 1.2 References Table 1-1. References Page 2 2.1 Power and Ground Lands 2.2 Decoupling Guidelines 2.2.1 VCC Decoupling 2.2.2 VTT Decoupling 2.3 Voltage Identification Table 2-1. Voltage Identification Definition 2.4 Reserved, Unused, FC and TESTHI Signals 2.5 Voltage and Current Specifications 2.5.1 Absolute Maximum and Minimum Ratings 2.5.2 DC Voltage and Current Specifications Table 2-3. Voltage and Current Specifications Table 2-4. VCC Static and Transient Tolerance for 775_VR_CONFIG_05A Pentium D Processor Figure 2-1. VCC Static and Transient Tolerance for 775_VR_CONFIG_05A Pentium D Processor Table 2-5. VCC Static and Transient Tolerance for 775_VR_CONFIG_05B Pentium D Processor Figure 2-2. VCC Static and Transient Tolerance for 775_VR_CONFIG_05B Pentium D Processor 2.5.3 VCC Overshoot Specification Time Example Overshoot Waveform T VID 2.6 Signaling Specifications 2.6.1 FSB Signal Groups Table 2-7. FSB Signal Groups 2.6.2 GTL+ Asynchronous Signals Table 2-8. Signal Characteristics Table 2-9. Signal Reference Voltages 2.6.3 FSB DC Specifications Table 2-11. GTL+ Signal Group DC Specifications Table 2-12. PWRGOOD Input and TAP Signal Group DC Specifications Table 2-13. GTL+ Asynchronous Signal Group DC Specifications 2.6.3.1 GTL+ Front Side Bus Specifications Table 2-14. VTTPWRGD DC Specifications Table 2-15. BOOTSELECT and MSID[1:0] DC Specifications Table 2-16. GTL+ Bus Voltage Definitions 2.7 Clock Specifications 2.7.1 FSB Clock (BCLK[1:0]) and Processor Clocking 2.7.2 FSB Frequency Select Signals 2.7.3 Phase Lock Loop (PLL) and Filter Figure 2-4. Phase Lock Loop (PLL) Filter Requirements 3 Specifications 3.1 Package Mechanical Drawing Page Page Page 3.2 Processor Component Keep-Out Zones 3.3 Package Loading Specifications 3.4 Package Handling Guidelines 3.5 Package Insertion Specifications 3.6 Processor Mass Specification 3.7 Processor Materials 3.8 Processor Markings Page Package Mechanical Specifications 3.9 Processor Land Coordinates Figure 3-7. Processor Land Coordinates, Top View Socket LGA775 Quadrants Top View V CC / V VTT / Clocks Data 4 Figure 4-1. Landout Diagram (Top View Left Side) Figure 4-2. Landout Diagram (Top View Right Side) Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page 4.2 Alphabetical Signals Reference Table 4-3. Signal Description (Sheet 1 of 8) Table 4-3. Signal Description (Sheet 2 of 8) Table 4-3. Signal Description (Sheet 3 of 8) Table 4-3. Signal Description (Sheet 4 of 8) Table 4-3. Signal Description (Sheet 5 of 8) Table 4-3. Signal Description (Sheet 6 of 8) Table 4-3. Signal Description (Sheet 7 of 8) Table 4-3. Signal Description (Sheet 8 of 8) Page 5 Design Considerations 5.1 Processor Thermal Specifications 5.1.1 Thermal Specifications Page Figure 5-1. Thermal Profile for the Pentium D Processor with PRB=1 Figure 5-2. Thermal Profile for the Pentium D Processor with PRB=0 5.1.2 Thermal Metrology 5.2 Processor Thermal Features 5.2.1 Thermal Monitor 5.2.2 On-Demand Mode 5.2.3 PROCHOT# Signal 5.2.4 FORCEPR# Signal Pin 5.2.5 THERMTRIP# Signal 5.2.6 TCONTROL and Fan Speed Reduction 5.2.7 Thermal Diode Page Page 6 6.1 Power-On Configuration Options 6.2 Clock Control and Low Power States 6.2.1 Normal State 6.2.2 HALT and Enhanced HALT Powerdown States 6.2.2.1 HALT Powerdown State 6.2.2.2 Enhanced HALT Powerdown State 6.2.3 Stop-Grant State 6.2.4 Enhanced HALT Snoop or HALT Snoop State, Grant Snoop State 6.2.4.1 HALT Snoop State, Grant Snoop State 6.2.4.2 Enhanced HALT Snoop State 6.2.5 Enhanced Intel SpeedStep Techn olo gy 7 7.1 Mechanical Specifications 7.1.1 Boxed Processor Cooling Solution Dimensions 7.1.2 Boxed Processor Fan Heatsink Weight 7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly 7.2 Electrical Requirements 7.2.1 Fan Heatsink Power Supply Page 7.3 Thermal Specifications 7.3.1 Boxed Processor Cooling Requirements Page 7.3.2 Variable Speed Fan Page 8 (BTX) Type I Boxed Processor Specifications 8.1 Mechanical Specifications 8.1.1 Cooling Solution Dimensions 8.1.2 Boxed Processor Fan Heatsink Weight 8.1.3 Boxed Processor Support and Retention Module (SRM) 8.2 Electrical Requirements 8.2.1 Fan Heatsink Power Supply Page 8.3 Thermal Specifications 8.3.1 Boxed Processor Cooling Requirements 8.3.2 Variable Speed Fan Page Page 9 9.1 Logic Analyzer Interface (LAI) 9.1.1 Mechanical Considerations 9.1.2 Electrical Considerations