Intel 830 7.3.2 Variable Speed Fan

Datasheet 95

Boxed Processor Specifications

7.3.2 Variable Speed Fan

If the boxed processor fan heatsink 4-pin connector is connected to a 3-pin motherboard header it

will operate as follows:

The boxed processor fan will operate at different speeds over a short range of internal chassis

temperatures. This allows the processor fan to operate at a lower speed and noise level, while

internal chassis temperatures are low. If internal chassis temperature increases beyond a lower

set point, the fan speed will rise linearly with the internal temperature until the higher set point

is reached. At that point, the fan speed is at its maximum. As fan speed increases, so does fan

noise levels. Systems should be designed to provide adequate air around the boxed processor

fan heatsink that remains cooler then lower set point. These set points, represented in

Figure 7-9 and Table 7 -2, can vary by a few degrees from fan heatsink to fan heatsink. The

internal chassis temperature should be kept below 39 ºC. Meeting the processor's temperature

specification (see Chapter5) is the resp onsib ility of the system integrator.

The motherboard must supply a constant +12 V to the processor's power header to ensure proper

operation of the variable speed fan for the boxed processor. Refer to Table 7 -1 for the specific

requirements.

Figure 7-9. Boxed Processor Fan Heatsink Set Points

Table 7-2. Fan Heatsink Power and Signal Specifications

Boxed Processor Fan

Heatsink Set Point (ºC) Boxed Processor Fan Speed Notes

X ≤ 30 When the internal chassis temperature is below or equal to this set point,

the fan operates at its lowest speed. Recommended maximum internal

chassis temperature for nominal operating environment.

1

NOTES:

1. Set point variance is approximately ± 1 °C from fan heatsink to fan heatsink.

Y = 35 When the internal chassis temperature is at this point, the fan operates

between its lowest and highest speeds. Recommended maximum

internal chassis temperature for worst-case operating environment. -

Z ≥ 39 When the internal chassis temperature is above or equal to this set point,

the fan operates at its highest speed. -

Lower Set Point

Lowest Noise Level

Internal Chassis Temperature (Degrees C)

XYZ

Increasing Fan

Speed & Noise

Higher Set Point

Highest Noise Level

Contents

Main Contents Contents Page Figures Tables Revision History Page Intel Pentium D Processor 800 Sequence Features Page 1 1.1 Terminology 1.1.1 Processor Packaging Terminology Introduction 1.2 References Table 1-1. References Page 2 2.1 Power and Ground Lands 2.2 Decoupling Guidelines 2.2.1 VCC Decoupling 2.2.2 VTT Decoupling 2.3 Voltage Identification Table 2-1. Voltage Identification Definition 2.4 Reserved, Unused, FC and TESTHI Signals 2.5 Voltage and Current Specifications 2.5.1 Absolute Maximum and Minimum Ratings 2.5.2 DC Voltage and Current Specifications Table 2-3. Voltage and Current Specifications Table 2-4. VCC Static and Transient Tolerance for 775_VR_CONFIG_05A Pentium D Processor Figure 2-1. VCC Static and Transient Tolerance for 775_VR_CONFIG_05A Pentium D Processor Table 2-5. VCC Static and Transient Tolerance for 775_VR_CONFIG_05B Pentium D Processor Figure 2-2. VCC Static and Transient Tolerance for 775_VR_CONFIG_05B Pentium D Processor 2.5.3 VCC Overshoot Specification Time Example Overshoot Waveform T VID 2.6 Signaling Specifications 2.6.1 FSB Signal Groups Table 2-7. FSB Signal Groups 2.6.2 GTL+ Asynchronous Signals Table 2-8. Signal Characteristics Table 2-9. Signal Reference Voltages 2.6.3 FSB DC Specifications Table 2-11. GTL+ Signal Group DC Specifications Table 2-12. PWRGOOD Input and TAP Signal Group DC Specifications Table 2-13. GTL+ Asynchronous Signal Group DC Specifications 2.6.3.1 GTL+ Front Side Bus Specifications Table 2-14. VTTPWRGD DC Specifications Table 2-15. BOOTSELECT and MSID[1:0] DC Specifications Table 2-16. GTL+ Bus Voltage Definitions 2.7 Clock Specifications 2.7.1 FSB Clock (BCLK[1:0]) and Processor Clocking 2.7.2 FSB Frequency Select Signals 2.7.3 Phase Lock Loop (PLL) and Filter Figure 2-4. Phase Lock Loop (PLL) Filter Requirements 3 Specifications 3.1 Package Mechanical Drawing Page Page Page 3.2 Processor Component Keep-Out Zones 3.3 Package Loading Specifications 3.4 Package Handling Guidelines 3.5 Package Insertion Specifications 3.6 Processor Mass Specification 3.7 Processor Materials 3.8 Processor Markings Page Package Mechanical Specifications 3.9 Processor Land Coordinates Figure 3-7. Processor Land Coordinates, Top View Socket LGA775 Quadrants Top View V CC / V VTT / Clocks Data 4 Figure 4-1. Landout Diagram (Top View Left Side) Figure 4-2. Landout Diagram (Top View Right Side) Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page 4.2 Alphabetical Signals Reference Table 4-3. Signal Description (Sheet 1 of 8) Table 4-3. Signal Description (Sheet 2 of 8) Table 4-3. Signal Description (Sheet 3 of 8) Table 4-3. Signal Description (Sheet 4 of 8) Table 4-3. Signal Description (Sheet 5 of 8) Table 4-3. Signal Description (Sheet 6 of 8) Table 4-3. Signal Description (Sheet 7 of 8) Table 4-3. Signal Description (Sheet 8 of 8) Page 5 Design Considerations 5.1 Processor Thermal Specifications 5.1.1 Thermal Specifications Page Figure 5-1. Thermal Profile for the Pentium D Processor with PRB=1 Figure 5-2. Thermal Profile for the Pentium D Processor with PRB=0 5.1.2 Thermal Metrology 5.2 Processor Thermal Features 5.2.1 Thermal Monitor 5.2.2 On-Demand Mode 5.2.3 PROCHOT# Signal 5.2.4 FORCEPR# Signal Pin 5.2.5 THERMTRIP# Signal 5.2.6 TCONTROL and Fan Speed Reduction 5.2.7 Thermal Diode Page Page 6 6.1 Power-On Configuration Options 6.2 Clock Control and Low Power States 6.2.1 Normal State 6.2.2 HALT and Enhanced HALT Powerdown States 6.2.2.1 HALT Powerdown State 6.2.2.2 Enhanced HALT Powerdown State 6.2.3 Stop-Grant State 6.2.4 Enhanced HALT Snoop or HALT Snoop State, Grant Snoop State 6.2.4.1 HALT Snoop State, Grant Snoop State 6.2.4.2 Enhanced HALT Snoop State 6.2.5 Enhanced Intel SpeedStep Techn olo gy 7 7.1 Mechanical Specifications 7.1.1 Boxed Processor Cooling Solution Dimensions 7.1.2 Boxed Processor Fan Heatsink Weight 7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly 7.2 Electrical Requirements 7.2.1 Fan Heatsink Power Supply Page 7.3 Thermal Specifications 7.3.1 Boxed Processor Cooling Requirements Page 7.3.2 Variable Speed Fan Page 8 (BTX) Type I Boxed Processor Specifications 8.1 Mechanical Specifications 8.1.1 Cooling Solution Dimensions 8.1.2 Boxed Processor Fan Heatsink Weight 8.1.3 Boxed Processor Support and Retention Module (SRM) 8.2 Electrical Requirements 8.2.1 Fan Heatsink Power Supply Page 8.3 Thermal Specifications 8.3.1 Boxed Processor Cooling Requirements 8.3.2 Variable Speed Fan Page Page 9 9.1 Logic Analyzer Interface (LAI) 9.1.1 Mechanical Considerations 9.1.2 Electrical Considerations