Boxed Processor Specifications

7.3.2Variable Speed Fan

If the boxed processor fan heatsink 4-pin connector is connected to a 3-pin motherboard header it will operate as follows:

The boxed processor fan will operate at different speeds over a short range of internal chassis temperatures. This allows the processor fan to operate at a lower speed and noise level, while internal chassis temperatures are low. If internal chassis temperature increases beyond a lower set point, the fan speed will rise linearly with the internal temperature until the higher set point is reached. At that point, the fan speed is at its maximum. As fan speed increases, so does fan noise levels. Systems should be designed to provide adequate air around the boxed processor fan heatsink that remains cooler then lower set point. These set points, represented in Figure 7-9and Table 7-2, can vary by a few degrees from fan heatsink to fan heatsink. The internal chassis temperature should be kept below 39 ºC. Meeting the processor's temperature specification (see Chapter 5) is the responsibility of the system integrator.

The motherboard must supply a constant +12 V to the processor's power header to ensure proper operation of the variable speed fan for the boxed processor. Refer to Table 7-1for the specific requirements.

Figure 7-9. Boxed Processor Fan Heatsink Set Points

 

 

Higher Set Point

 

 

Highest Noise Level

 

Increasing Fan

 

 

Speed & Noise

 

Lower Set Point

 

 

Lowest Noise Level

 

 

X

Y

Z

Internal Chassis Temperature (Degrees C)

Table 7-2. Fan Heatsink Power and Signal Specifications

Boxed Processor Fan

Boxed Processor Fan Speed

Notes

Heatsink Set Point (ºC)

 

 

 

 

When the internal chassis temperature is below or equal to this set point,

1

X ≤ 30

the fan operates at its lowest speed. Recommended maximum internal

 

chassis temperature for nominal operating environment.

 

 

 

 

 

When the internal chassis temperature is at this point, the fan operates

 

Y = 35

between its lowest and highest speeds. Recommended maximum

-

 

internal chassis temperature for worst-case operating environment.

 

 

 

 

Z ≥ 39

When the internal chassis temperature is above or equal to this set point,

-

the fan operates at its highest speed.

 

 

 

 

 

NOTES:

 

 

1.Set point variance is approximately ± 1 °C from fan heatsink to fan heatsink.

Datasheet

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Intel 830 manual Variable Speed Fan, Boxed Processor Fan Boxed Processor Fan Speed, Fan operates at its highest speed

830 specifications

The Intel 830 chipset, introduced in the early 2000s, marked a significant evolution in Intel's chipset architecture for desktop and mobile computing. Known for its support of the Pentium 4 processors, the 830 chipset was tailored for both performance and stability, making it an appealing choice for OEMs and enthusiasts alike.

One of the standout features of the Intel 830 chipset is its support for DDR SDRAM, providing a much-needed boost in memory bandwidth compared to its predecessors. With dual-channel memory support, the chipset could utilize two memory modules simultaneously, which effectively doubled the data transfer rate and enhanced overall system performance. This made the Intel 830 particularly beneficial for applications requiring high memory throughput, such as multimedia processing and gaming.

Another important characteristic of the Intel 830 was its integrated graphics support, featuring Intel's Extreme Graphics technology. This integration allowed for decent graphics performance without the need for a dedicated GPU, making it suitable for budget systems and everyday computing tasks. However, for power users and gaming enthusiasts, the option to incorporate a discrete graphics card remained available through the provided PCI Express x16 slot.

The Intel 830 chipset also boasted advanced I/O capabilities, including support for USB 2.0, which provided faster data transfer rates compared to USB 1.1, and enhanced IDE interfaces for connecting hard drives and optical devices. With its Hyper-Threading technology support, the chipset allowed for improved multitasking efficiency, enabling a single processor to execute multiple threads simultaneously, a feature that was particularly beneficial in server environments and complex computing tasks.

In terms of connectivity, the Intel 830 supported multiple bus interfaces, including PCI Express and AGP, thereby enabling users to expand their systems with various add-on cards. This flexibility contributed to the chipset's longevity in the marketplace, as it catered to a wide range of user needs from light computing to intensive gaming and content creation.

In summary, the Intel 830 chipset combined enhanced memory capabilities, integrated graphics performance, robust I/O features, and flexible expansion options, making it a versatile choice for various computing environments during its time. It played a key role in shaping the landscape of early 2000s computing, paving the way for future advancements in chipset technology. Its legacy continues to influence modern computing architectures, illustrating the lasting impact of Intel’s innovative design principles.