Intel 830 manual Contents

				Contents
Contents
1	Introduction		....................................................................................................................................	11
	1.1	Terminology		12
		1.1.1	Processor Packaging Terminology	12
	1.2	References		13
2	Electrical Specifications			15
	2.1	Power and Ground Lands		15
	2.2	Decoupling Guidelines		15
		2.2.1	VCC Decoupling	15
		2.2.2	VTT Decoupling	15
		2.2.3	FSB Decoupling	16
	2.3	Voltage Identification		16
	2.4	Reserved, Unused, FC and TESTHI Signals		18
	2.5	Voltage and Current Specifications		19
		2.5.1	Absolute Maximum and Minimum Ratings	19
		2.5.2	DC Voltage and Current Specifications	19
		2.5.3	VCC Overshoot Specification	25
		2.5.4	Die Voltage Validation	26
	2.6	Signaling Specifications		26
		2.6.1	FSB Signal Groups	26
		2.6.2	GTL+ Asynchronous Signals	28
		2.6.3	FSB DC Specifications	29
	2.7	Clock Specifications		32
		2.7.1	FSB Clock (BCLK[1:0]) and Processor Clocking	32
		2.7.2	FSB Frequency Select Signals	32
		2.7.3	Phase Lock Loop (PLL) and Filter	33
3	Package Mechanical Specifications			35
	3.1	Package Mechanical Drawing		35
	3.2	Processor Component Keep-Out Zones		39
	3.3	Package Loading Specifications		39
	3.4	Package Handling Guidelines		39
	3.5	Package Insertion Specifications		40
	3.6	Processor Mass Specification		40
	3.7	Processor Materials		40
	3.8	Processor Markings		40
	3.9	Processor Land Coordinates		42
4	Land Listing and Signal Descriptions			43
	4.1	Processor Land Assignments		43
	4.2	Alphabetical Signals Reference		66
5	Thermal Specifications and Design Considerations			75
	5.1	Processor Thermal Specifications		75
		5.1.1	Thermal Specifications	75
		5.1.2	Thermal Metrology	79

Datasheet 3