Thermal Specifications and Design Considerations

5.2.5THERMTRIP# Signal

Regardless of whether or not the Thermal Monitor feature is enabled, in the event of a catastrophic cooling failure, the processor will automatically shut down when the silicon has reached an elevated temperature (refer to the THERMTRIP# definition in Table 4-3). At this point, the FSB signal THERMTRIP# will go active and stay active as described in Table 4-3. THERMTRIP# activation is independent of processor activity and does not generate any bus cycles.

5.2.6TCONTROL and Fan Speed Reduction

TCONTROL is a temperature specification based on a temperature reading from the thermal diode. The value for TCONTROL will be calibrated in manufacturing and configured for each processor. When TDIODE is above TCONTROL, then TC must be at or below TC-MAXas defined by the thermal profile in Table 5-2and Figure 5-1; otherwise, the processor temperature can be maintained at TCONTROL (or lower) as measured by the thermal diode.

The purpose of this feature is to support acoustic optimization through fan speed control.

5.2.7Thermal Diode

The processor incorporates an on-die thermal diode. A thermal sensor located on the system board may monitor the die temperature of the processor for thermal management/long term die temperature change purposes. Table 5-4and Table 5-5provide the diode parameter and interface specifications. This thermal diode is separate from the Thermal Monitor’s thermal sensor and cannot be used to predict the behavior of the Thermal Monitor.

Table 5-4. Thermal Diode Parameters

Symbol

Parameter

Min

Typ

Max

Unit

Notes

 

 

 

 

 

 

 

IFW

Forward Bias Current

11

 

187

µA

1

 

 

n

Diode Ideality Factor

1.0083

1.011

1.023

 

2, 3, 4, 5

 

 

 

 

 

 

 

RT

Series Resistance

3.242

3.33

3.594

Ω

2, 3, 6

 

NOTES:

1.Intel does not support or recommend operation of the thermal diode under reverse bias.

2.Characterized at 75 °C.

3.Not 100% tested. Specified by design characterization.

4.The ideality factor, n, represents the deviation from ideal diode behavior as exemplified by the diode equation:

IFW = IS * (e qVD/nkT –1)

where IS = saturation current, q = electronic charge, VD = voltage across the diode, k = Boltzmann Constant, and T = absolute temperature (Kelvin).

5.Devices found to have an ideality factor of 1.0183 to 1.023 will create a temperature error approximately 2 °C higher than the actual temperature. To minimize any potential acoustic impact of this temperature error, TCONTROL will be increased by 2 °C on these parts.

6.The series resistance, RT, is provided to allow for a more accurate measurement of the thermal diode temperature. RT, as defined, includes the pins of the processor but does not include any socket resistance or board trace resistance be- tween the socket and the external remote diode thermal sensor. RT can be used by remote diode thermal sensors with automatic series resistance cancellation to calibrate out this error term. Another application is that a temperature offset can be manually calculated and programmed into an offset register in the remote diode thermal sensors as exemplified by the equation:

Terror = [RT * (N-1) * IFWmin] / [nk/q * ln N]

wherecharge.Terror = sensor temperature error, N = sensor current ratio, k = Boltzmann Constant, q = electronic

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Datasheet

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Intel 830 manual THERMTRIP# Signal, Tcontrol and Fan Speed Reduction, Thermal Diode Parameters
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830 specifications

The Intel 830 chipset, introduced in the early 2000s, marked a significant evolution in Intel's chipset architecture for desktop and mobile computing. Known for its support of the Pentium 4 processors, the 830 chipset was tailored for both performance and stability, making it an appealing choice for OEMs and enthusiasts alike.

One of the standout features of the Intel 830 chipset is its support for DDR SDRAM, providing a much-needed boost in memory bandwidth compared to its predecessors. With dual-channel memory support, the chipset could utilize two memory modules simultaneously, which effectively doubled the data transfer rate and enhanced overall system performance. This made the Intel 830 particularly beneficial for applications requiring high memory throughput, such as multimedia processing and gaming.

Another important characteristic of the Intel 830 was its integrated graphics support, featuring Intel's Extreme Graphics technology. This integration allowed for decent graphics performance without the need for a dedicated GPU, making it suitable for budget systems and everyday computing tasks. However, for power users and gaming enthusiasts, the option to incorporate a discrete graphics card remained available through the provided PCI Express x16 slot.

The Intel 830 chipset also boasted advanced I/O capabilities, including support for USB 2.0, which provided faster data transfer rates compared to USB 1.1, and enhanced IDE interfaces for connecting hard drives and optical devices. With its Hyper-Threading technology support, the chipset allowed for improved multitasking efficiency, enabling a single processor to execute multiple threads simultaneously, a feature that was particularly beneficial in server environments and complex computing tasks.

In terms of connectivity, the Intel 830 supported multiple bus interfaces, including PCI Express and AGP, thereby enabling users to expand their systems with various add-on cards. This flexibility contributed to the chipset's longevity in the marketplace, as it catered to a wide range of user needs from light computing to intensive gaming and content creation.

In summary, the Intel 830 chipset combined enhanced memory capabilities, integrated graphics performance, robust I/O features, and flexible expansion options, making it a versatile choice for various computing environments during its time. It played a key role in shaping the landscape of early 2000s computing, paving the way for future advancements in chipset technology. Its legacy continues to influence modern computing architectures, illustrating the lasting impact of Intel’s innovative design principles.
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