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83
Thermal Specifications a
nd Design Considerations
ยง
Table 5-5. Thermal Diode Interface
Signal Name
Land Number
Signal Description
THERMDA
AL1
diode anode
THERMDC
AK1
diode cathode
Contents
Main
Contents
Contents
Page
Figures
Tables
Revision History
Page
Intel Pentium D Processor 800 Sequence Features
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1
1.1 Terminology
1.1.1 Processor Packaging Terminology
Introduction
1.2 References
Table 1-1. References
Page
2
2.1 Power and Ground Lands
2.2 Decoupling Guidelines
2.2.1 VCC Decoupling
2.2.2 VTT Decoupling
2.3 Voltage Identification
Table 2-1. Voltage Identification Definition
2.4 Reserved, Unused, FC and TESTHI Signals
2.5 Voltage and Current Specifications
2.5.1 Absolute Maximum and Minimum Ratings
2.5.2 DC Voltage and Current Specifications
Table 2-3. Voltage and Current Specifications
Table 2-4. VCC Static and Transient Tolerance for 775_VR_CONFIG_05A Pentium D Processor
Figure 2-1. VCC Static and Transient Tolerance for 775_VR_CONFIG_05A Pentium D Processor
Table 2-5. VCC Static and Transient Tolerance for 775_VR_CONFIG_05B Pentium D Processor
Figure 2-2. VCC Static and Transient Tolerance for 775_VR_CONFIG_05B Pentium D Processor
2.5.3 VCC Overshoot Specification
Time
Example Overshoot Waveform
T
VID
2.6 Signaling Specifications
2.6.1 FSB Signal Groups
Table 2-7. FSB Signal Groups
2.6.2 GTL+ Asynchronous Signals
Table 2-8. Signal Characteristics
Table 2-9. Signal Reference Voltages
2.6.3 FSB DC Specifications
Table 2-11. GTL+ Signal Group DC Specifications
Table 2-12. PWRGOOD Input and TAP Signal Group DC Specifications
Table 2-13. GTL+ Asynchronous Signal Group DC Specifications
2.6.3.1 GTL+ Front Side Bus Specifications
Table 2-14. VTTPWRGD DC Specifications
Table 2-15. BOOTSELECT and MSID[1:0] DC Specifications
Table 2-16. GTL+ Bus Voltage Definitions
2.7 Clock Specifications
2.7.1 FSB Clock (BCLK[1:0]) and Processor Clocking
2.7.2 FSB Frequency Select Signals
2.7.3 Phase Lock Loop (PLL) and Filter
Figure 2-4. Phase Lock Loop (PLL) Filter Requirements
3
Specifications
3.1 Package Mechanical Drawing
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3.2 Processor Component Keep-Out Zones
3.3 Package Loading Specifications
3.4 Package Handling Guidelines
3.5 Package Insertion Specifications
3.6 Processor Mass Specification
3.7 Processor Materials
3.8 Processor Markings
Page
Package Mechanical Specifications
3.9 Processor Land Coordinates
Figure 3-7. Processor Land Coordinates, Top View
Socket LGA775 Quadrants Top View
V CC / V
VTT / Clocks Data
4
Figure 4-1. Landout Diagram (Top View Left Side)
Figure 4-2. Landout Diagram (Top View Right Side)
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4.2 Alphabetical Signals Reference
Table 4-3. Signal Description (Sheet 1 of 8)
Table 4-3. Signal Description (Sheet 2 of 8)
Table 4-3. Signal Description (Sheet 3 of 8)
Table 4-3. Signal Description (Sheet 4 of 8)
Table 4-3. Signal Description (Sheet 5 of 8)
Table 4-3. Signal Description (Sheet 6 of 8)
Table 4-3. Signal Description (Sheet 7 of 8)
Table 4-3. Signal Description (Sheet 8 of 8)
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5
Design Considerations
5.1 Processor Thermal Specifications
5.1.1 Thermal Specifications
Page
Figure 5-1. Thermal Profile for the Pentium D Processor with PRB=1
Figure 5-2. Thermal Profile for the Pentium D Processor with PRB=0
5.1.2 Thermal Metrology
5.2 Processor Thermal Features
5.2.1 Thermal Monitor
5.2.2 On-Demand Mode
5.2.3 PROCHOT# Signal
5.2.4 FORCEPR# Signal Pin
5.2.5 THERMTRIP# Signal
5.2.6 TCONTROL and Fan Speed Reduction
5.2.7 Thermal Diode
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6
6.1 Power-On Configuration Options
6.2 Clock Control and Low Power States
6.2.1 Normal State
6.2.2 HALT and Enhanced HALT Powerdown States
6.2.2.1 HALT Powerdown State
6.2.2.2 Enhanced HALT Powerdown State
6.2.3 Stop-Grant State
6.2.4 Enhanced HALT Snoop or HALT Snoop State, Grant Snoop State
6.2.4.1 HALT Snoop State, Grant Snoop State
6.2.4.2 Enhanced HALT Snoop State
6.2.5 Enhanced Intel SpeedStep Techn olo gy
7
7.1 Mechanical Specifications
7.1.1 Boxed Processor Cooling Solution Dimensions
7.1.2 Boxed Processor Fan Heatsink Weight
7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly
7.2 Electrical Requirements
7.2.1 Fan Heatsink Power Supply
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7.3 Thermal Specifications
7.3.1 Boxed Processor Cooling Requirements
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7.3.2 Variable Speed Fan
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8
(BTX) Type I Boxed Processor Specifications
8.1 Mechanical Specifications
8.1.1 Cooling Solution Dimensions
8.1.2 Boxed Processor Fan Heatsink Weight
8.1.3 Boxed Processor Support and Retention Module (SRM)
8.2 Electrical Requirements
8.2.1 Fan Heatsink Power Supply
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8.3 Thermal Specifications
8.3.1 Boxed Processor Cooling Requirements
8.3.2 Variable Speed Fan
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9.1 Logic Analyzer Interface (LAI)
9.1.1 Mechanical Considerations
9.1.2 Electrical Considerations