96 Datasheet
Boxed Processor Specifications
If the boxed processor fan heatsink 4-pin connector is connected to a 4-pin motherboard header and
the motherboard is designed with a fan speed controller with PWM output (For details on
CONTROL, see Table 7 -1) and remote thermal diode measurement capability the boxed processor
will operate as follows:
As processor power has increased the required thermal solutions have generated increasingly more
noise. Intel has added an option to the boxed processor that allows system integrators to have a
quieter system in the most common usage.
The 4th wire PWM solution provides better control over chassis acoustics. This is achieved by
more accurate measurement of processor die temperature through the processor's temperature
diode (TDIODE). Fan RPM is modulated through the use of an ASIC located on the motherboard
that sends out a PWM control signal to the 4th pin of the connector labeled as CONTROL. The fan
speed is based on the actual processor temperature instead of internal ambient chassis
temperatures.
If the new 4-pin active fan heat sink solution is connected to an older 3-pin baseboard processor fan
header, it will default back to a thermistor controlled mode. This allows compatibility with existing
3-pin baseboard designs. Under thermistor controlled mode, the fan RPM is automatically varied
based on the Tinlet temperature measured by a thermistor located at the fan inlet.
For more details on specific motherboard requirements for 4-wire based fan speed control, see the
Intel® Pentium® D Processor and Intel® Pentium® Processor Extreme Edition 840 Thermal and
Mechanical Design Guidelines.
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