Datasheet 5
Contents
Figures
2-1 VCC Static and Transient Tolerance for 775_VR_CONFIG_05A Pentium D Processor............22
2-2 VCC Static and Transient Tolerance for 775_VR_CONFIG_05B Pentium D Processor............24
2-3 VCC Overshoot Example Waveform................... .......................................................................25
2-4 Phase Lock Loop (PLL) Filter Requirements.............................................................................. 34
3-1 Processor Package Assembly Sketch.............................................. ..........................................35
3-2 Processor Package Drawing 1 ................................................................................................... 36
3-3 Processor Package Drawing 2 ................................................................................................... 37
3-4 Processor Package Drawing 3 ................................................................................................... 38
3-5 Processor Top-Side Marking Example (Intel® Pentium® D Processors 840, 830, 820).............40
3-6 Processor Top-Side Marking Example (Intel® Pentium® D Processor 805)...............................41
3-7 Processor Land Coordinates, Top View........................... ..........................................................42
4-1 Landout Diagram (Top View – Left Side).................................................................................... 44
4-2 Landout Diagram (Top View – Right Side)................................. ................................................45
5-1 Thermal Profile for the Pentium D Processor with PRB=1 .........................................................77
5-2 Thermal Profile for the Pentium D Processor with PRB=0 .........................................................78
5-3 Case Temperature (TC) Measurement Location........................................................ ................79
6-1 Processor Low Power State Machine............................................................................... ..........86
7-1 Mechanical Representation of the Boxed Processor.................................................................. 89
7-2 Side View Space Requirements for the Boxed Processor (Applies to all four side views)......... 90
7-3 Top View Space Requirements for the Boxed Processor...........................................................90
7-4 Overall View Space Requirements for the Boxed Processor .....................................................91
7-5 Boxed Processor Fan Heatsink Power Cable Connector Description........................................ 92
7-6 Baseboard Power Header Placement Relative to Processor Socket...................... ...................93
7-7 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view)........................ 94
7-8 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 2 view)........................ 94
7-9 Boxed Processor Fan Heatsink Set Points................................................................................. 95
8-1 Mechanical Representation of the Boxed Processor.................................................................. 97
8-2 Requirements for the Balanced Technology Extended (BTX) Type I Keep-out Volumes ..........98
8-3 Assembly Stack Including the Support and Retention Module................................................ ...99
8-4 Boxed Processor Fan Heatsink Power Cable Connector......................................................... 100
8-5 Balanced Technology Extended (BTX) Mainboard Power Header Placement (hatched area)101
8-6 Boxed Processor TMA Set Points.... ... ... ... .... ... ... ... .... ..............................................................102